In this work, the influence of electrode thickness on hermetic sealing was investigated. Two approaches to realise hermetic sealing via anodic bonding of ...
... hermetic sealing via anodic bonding of silicon to glass with thick electrodes were proposed. One of the approaches is called embedded electrode method. The ...
Gold metal film on glass is used as fixed electrode. Anodic bonding is used to bond together the silicon and glass to form the capacitive pressure sensor. The ...
Two approaches to realise hermetic sealing via anodic bonding of silicon to glass with thick electrodes with vertical via electrode method and embedded ...
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ABSTRACT. This paper describes a versatile and reliable wafer-level hermetic packaging technology using an anodically-bondable low temperature cofired ...
An anodically bondable low temperature cofired ceramic (LTCC) wafer offers a versatile, clean and reliable wafer-level hermetic packaging for MEMS.
The anodic bonding of glass and silicon is an important step for the fabrication and packaging of MEMS devices. It is a kind of direct bonding technology ...
Dec 28, 2018 · The roughness will affect the packaging hermeticity. During anodic bonding, the plastic deformation occurs to the glass at the bonding ...
Hermetic Packaging Of Mems With Thick Electrodes By Silicon-Glass Anodic Bonding. Article. Jun 2003; Int J Comput Eng Sci. Yufeng Jin · J. Wei · P. C. Lim ...