This paper proposes to reclaim dark silicon through a thermally-aware chiplet organization technique in 2.5D manycore systems. The proposed technique adjusts ...

This paper proposes to reclaim dark silicon through a thermally-aware chiplet organization ... 2.5D systems to reclaim dark silicon. We propose to split a.

Eris et al. [13] leverage 2.5D integration technology to strategically insert spacing between chiplets to lower system temperature and reclaim dark silicon.

This paper proposes to reclaim dark silicon through a thermally-aware chiplet organization technique in 2.5D manycore systems. The proposed technique adjusts ...

This work proposes TAP-2.5D: the first open-source network routing and thermally-aware chiplet placement methodology for heterogeneous 2.

Sep 14, 2018 · This paper proposes to reclaim dark silicon through a thermally-aware chiplet organization technique in 2.5D manycore systems. The proposed ...

Leveraging thermally-aware chiplet organization in 2.5D systems to reclaim dark silicon. F. Eris, A. Joshi, A. Kahng, Y. Ma, S. Mojumder, and T. Zhang.

Eris et al. [13] leverage 2.5D integration technology to strategically insert spacing between chiplets to lower system temperature and reclaim dark silicon.

Leveraging thermally-aware chiplet organization in 2.5 D systems to reclaim dark silicon. F Eris, A Joshi, AB Kahng, Y Ma, S Mojumder, T Zhang. 2018 Design ...

May 8, 2024 · ... Aware Chiplet Placement Methodology for 2.5D Systems ... Leveraging thermally-aware chiplet organization in 2.5D systems to reclaim dark silicon.