In this letter, a silicon-based package design is proposed for E-band communication systems. In order to obtain ex- cellent RF performance, the discontinuous ...

Jan 12, 2024 · This letter presents a silicon-based package design for E-band communication systems. As the primary concern to package, the radio-frequency ...

Si-based system-in-package design with broadband interconnection for E-band applications. Jiao Chu, Jun Li, Yunyan Zhou, Jia Cao, Pengwei Chen, Liqiang Cao.

Abstract—This paper presents the design of vertical chip-tochip interconnects for mm-wave system-in-package (SiP) applications up to 170 GHz.

Si-based system-in-package design with broadband interconnection for E-band applications ... silicon-based package design for E-band communication systems.

Si-based system-in-package design with broadband interconnection for E-band applications. Published:2021-04-25 Issue:8 Volume:18 Page:20210140-20210140. ISSN ...

Bibliographic details on Si-based system-in-package design with broadband interconnection for E-band applications.

Si-based system-in-package design with broadband interconnection for E-band applications ... This letter presents a silicon-based package design for E-band ...

May 29, 2023 · It is an organic-board-type package, unlike the other package forms, and lacks TSVs, which is based on a two-dimensional planar extension ...