SIGLEAvailable from INIST (FR), Document Supply Service, under shelf-number : AR 15713 / INIST-CN... more SIGLEAvailable from INIST (FR), Document Supply Service, under shelf-number : AR 15713 / INIST-CNRS - Institut de l'Information Scientifique et TechniqueMinistere de la Recherche et de l'Espace (MRE), 75 - Paris (France)FRFranc
The European 3D technology platform that has been established represents the ensemble of 3D integ... more The European 3D technology platform that has been established represents the ensemble of 3D integration technologies which were developed within the e-CUBES project [http://www.ecubes.org]. It became evident that the fabrication of e-CUBES with their need for high-level miniaturization can only be realized by system integration technologies which use the third dimension. The main objective is to provide 3D integration technologies which on the one hand increase the performance sufficiently and at the same time allow for low cost fabrication in order to achieve products with a large market potential. The work was focussed on the requirements coming from application demonstrators. However, other requirements set by taking the visionary approach of developing strongly miniaturized micro/nano-systems were also a major task of the work. Research and technological development was necessary in the following fields in order to achieve the objectives. Seven corresponding technologies were su...
The ‘chip carrier’ or CC is an intermediate support, hermetically sealed or otherwise, (of alumin... more The ‘chip carrier’ or CC is an intermediate support, hermetically sealed or otherwise, (of alumina, beryllium oxide or plastic) requires to connect an integrated circuit chip with numerous output pins to the outside world. This carrier at present represents the best compromise in terms of technology and economy, because of the use of standard multi‐source chips and the simple testing it permits.
Miniaturisation for commercial applications demands very high interconnection densities and low c... more Miniaturisation for commercial applications demands very high interconnection densities and low costs. Wiser for former experiences, multi-chip modules, wafer scale integration, 3-D modules for space, defense and professional (3D Plus) applications, we learned that the yield constituted an important part of the production costs. The WDoD process allows to stack known good rebuilt wafer (KGRW) only. Several applications in the medical and industrial domains have been presented. This extremely important densification of 10 to 20 levels per mm with only 100 mum around the largest die allows to launch extremely ambitious applications with memories, systems in package and abandoned sensors.
The fantastic development of the components interconnection allows to imagine « Systems in Packa... more The fantastic development of the components interconnection allows to imagine « Systems in Package » of around a few mm3, which opens new perspectives for medical applications. Since the use of hybrid modules, then Multichip Modules « MCM » which were identical to the previous ones but named differently, the coming of the interconnection in 3-D allowed to divide both the volume and weight of a module by a factor comprised between 25 and more than 100.
SIGLEAvailable from INIST (FR), Document Supply Service, under shelf-number : AR 15713 / INIST-CN... more SIGLEAvailable from INIST (FR), Document Supply Service, under shelf-number : AR 15713 / INIST-CNRS - Institut de l'Information Scientifique et TechniqueMinistere de la Recherche et de l'Espace (MRE), 75 - Paris (France)FRFranc
The European 3D technology platform that has been established represents the ensemble of 3D integ... more The European 3D technology platform that has been established represents the ensemble of 3D integration technologies which were developed within the e-CUBES project [http://www.ecubes.org]. It became evident that the fabrication of e-CUBES with their need for high-level miniaturization can only be realized by system integration technologies which use the third dimension. The main objective is to provide 3D integration technologies which on the one hand increase the performance sufficiently and at the same time allow for low cost fabrication in order to achieve products with a large market potential. The work was focussed on the requirements coming from application demonstrators. However, other requirements set by taking the visionary approach of developing strongly miniaturized micro/nano-systems were also a major task of the work. Research and technological development was necessary in the following fields in order to achieve the objectives. Seven corresponding technologies were su...
The ‘chip carrier’ or CC is an intermediate support, hermetically sealed or otherwise, (of alumin... more The ‘chip carrier’ or CC is an intermediate support, hermetically sealed or otherwise, (of alumina, beryllium oxide or plastic) requires to connect an integrated circuit chip with numerous output pins to the outside world. This carrier at present represents the best compromise in terms of technology and economy, because of the use of standard multi‐source chips and the simple testing it permits.
Miniaturisation for commercial applications demands very high interconnection densities and low c... more Miniaturisation for commercial applications demands very high interconnection densities and low costs. Wiser for former experiences, multi-chip modules, wafer scale integration, 3-D modules for space, defense and professional (3D Plus) applications, we learned that the yield constituted an important part of the production costs. The WDoD process allows to stack known good rebuilt wafer (KGRW) only. Several applications in the medical and industrial domains have been presented. This extremely important densification of 10 to 20 levels per mm with only 100 mum around the largest die allows to launch extremely ambitious applications with memories, systems in package and abandoned sensors.
The fantastic development of the components interconnection allows to imagine « Systems in Packa... more The fantastic development of the components interconnection allows to imagine « Systems in Package » of around a few mm3, which opens new perspectives for medical applications. Since the use of hybrid modules, then Multichip Modules « MCM » which were identical to the previous ones but named differently, the coming of the interconnection in 3-D allowed to divide both the volume and weight of a module by a factor comprised between 25 and more than 100.
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