Additive manufacturing (AM) technologies can be used to manufacture metallic and non-metallic par... more Additive manufacturing (AM) technologies can be used to manufacture metallic and non-metallic parts. Combination of electrochemistry and additive manufacturing technology makes possible the fabrication of different shapes and geometrical features with very smooth surfaces. In this thesis, an overview of the basics of electroless copper plating, copper electroplating, AM technologies and their applications are covered. An introduction to how an AM part is produced, how electroless copper plating is carried out on a non-conductive surface, how an electroless copper plated part can be electroformed, how to obtain sufficient thickness of the copper coating while keeping the surface smooth have been shown. FDM (fused deposition modeling) technology is used to print a 3D ABS (Acrylonitrile butadiene styrene) part due to its low manufacturing cost and a minimal amount of waste material. Then, a produced ABS part got conductive through electroless copper plating process enabling the electro...
Thermal Spray 2021: Proceedings from the International Thermal Spray Conference
A previous study showed that Cu can be cold sprayed onto carbon fiber-reinforced polymers (CFRPs)... more A previous study showed that Cu can be cold sprayed onto carbon fiber-reinforced polymers (CFRPs) if a Cu interlayer is deposited prior to low-pressure cold spraying. In this present study, Cu was cold sprayed onto CFRP substrates that were coated with either Sn (cold spray) or Ni electroplating. Two layers of Cu powder were also cold sprayed onto a Cu-plated CFRP substrate to investigate the effect of a second particle layer on impacting particles. Test results showed that the relative hardness between the particle and substrate has a major effect on deformability, impact mode, and deposition efficiency (DE), which explains why Cu could not be cold sprayed onto Sn or Ni interlayers and why the deposition efficiency of Cu-on-Cu substrates is lower than that of one pass spraying. In summary, the results suggest that Cu can be successfully cold sprayed at low pressures onto electroplated Cu due to their similarity in hardness.
Additive manufacturing (AM) technologies can be used to manufacture metallic and non-metallic par... more Additive manufacturing (AM) technologies can be used to manufacture metallic and non-metallic parts. Combination of electrochemistry and additive manufacturing technology makes possible the fabrication of different shapes and geometrical features with very smooth surfaces. In this thesis, an overview of the basics of electroless copper plating, copper electroplating, AM technologies and their applications are covered. An introduction to how an AM part is produced, how electroless copper plating is carried out on a non-conductive surface, how an electroless copper plated part can be electroformed, how to obtain sufficient thickness of the copper coating while keeping the surface smooth have been shown. FDM (fused deposition modeling) technology is used to print a 3D ABS (Acrylonitrile butadiene styrene) part due to its low manufacturing cost and a minimal amount of waste material. Then, a produced ABS part got conductive through electroless copper plating process enabling the electro...
Thermal Spray 2021: Proceedings from the International Thermal Spray Conference
A previous study showed that Cu can be cold sprayed onto carbon fiber-reinforced polymers (CFRPs)... more A previous study showed that Cu can be cold sprayed onto carbon fiber-reinforced polymers (CFRPs) if a Cu interlayer is deposited prior to low-pressure cold spraying. In this present study, Cu was cold sprayed onto CFRP substrates that were coated with either Sn (cold spray) or Ni electroplating. Two layers of Cu powder were also cold sprayed onto a Cu-plated CFRP substrate to investigate the effect of a second particle layer on impacting particles. Test results showed that the relative hardness between the particle and substrate has a major effect on deformability, impact mode, and deposition efficiency (DE), which explains why Cu could not be cold sprayed onto Sn or Ni interlayers and why the deposition efficiency of Cu-on-Cu substrates is lower than that of one pass spraying. In summary, the results suggest that Cu can be successfully cold sprayed at low pressures onto electroplated Cu due to their similarity in hardness.
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Papers by Panteha Fallah