"Computer Based Manufacturing Cell Control using Intelligent Sensing System," Internati... more "Computer Based Manufacturing Cell Control using Intelligent Sensing System," International Conference on Agile Manufacturing. Held in Minneapolis, Minnesota: May 1998
"Print Process Characterization for Fine Pitch BGA Devices," SMTA International Confere... more "Print Process Characterization for Fine Pitch BGA Devices," SMTA International Conference. Held at Chicago, IL: September 2001.
"Robotic Grippers: Instrument of Instruments," TRYST-87, All India Student Seminar. Hel... more "Robotic Grippers: Instrument of Instruments," TRYST-87, All India Student Seminar. Held at the Indian Institute of Technology, New Delhi, India: January 1987
"Lead Free Selective Soldering Process Optimization," SMTA International Conference Pro... more "Lead Free Selective Soldering Process Optimization," SMTA International Conference Proceedings. Held in Orlando, Florida: 7-11 October 2007
ABSTRACT Quality management (QM), which includes quality monitoring, data analysis and data repor... more ABSTRACT Quality management (QM), which includes quality monitoring, data analysis and data reporting, requires continuous inspection of product quality, process quality and equipment/tool condition. Product quality monitoring inspects the products after they have been manufactured or assembled. This does not provide a real-time indication of the process that is making the product. Hence, it becomes more of a non-value added task to separate the good from the bad. On the other hand, process quality or equipment/tool condition monitoring provides value-added real-time feedback of the drift in the process. This information will be useful for adaptive control of the process and equipment, to produce good parts and assemblies. With the advent of the web, and its use to control various aspects of manufacturing and assembly, real-time web-based Automatic Inspection (AI) and QM have become very attractive and viable. Web-based AI and QM will enable effective real-time integration of shop-floor dynamics into the Manufacturing Execution Systems (MES) and the Enterprise Resource Planning Systems (ERPS). This will provide effective monitoring and adaptive control of the manufacturing enterprise and its supply chain.
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020
This paper will show the benefits of the latest stretchable inks and z-axis adhesives for flexibl... more This paper will show the benefits of the latest stretchable inks and z-axis adhesives for flexible hybrid electronics (FHE) applications. These stretchable inks and z-axis adhesives will be used to build a simple multilayer flashing LED assembled on a thermoplastic urethane (TPU) substrate using standard electronic packaging methods and evaluated for tensile, strain testing, and effects of humidity and temperature.The results from the previous study of single layer silver based and carbon-based structures showed materials remain conductive over large strain however resistance did change for elongation testing and strain testing. Silver based materials had a greater resistance to change compared to carbon-based materials. However, the later had a better resistance recovery.For humidity and temperature evaluations, the silver based single layer samples showed small decrease in resistance under temperature and humidity while the carbon based single layer showed small decrease during the initial twenty-four hours then remained constant for the remainder of the test.Same tests profiles were carried on three assembled multilayer LED flashing circuit with three configurations: non-encapsulated SMD components, encapsulated with old formulation (encapsulant A), and with a new formulation (encapsulant B). Results show that fully encapsulated samples with encapsulant B have the highest resistance to mechanical and environmental stresses.
"Effect of Solder Paste and Surface Finish on 0201 Assembly Process Defects," SMTA Inte... more "Effect of Solder Paste and Surface Finish on 0201 Assembly Process Defects," SMTA International Conference Proceedings. Held in Chicago, IL: 21-25 September 2004
"Line Balancing and Productivity Improvements in Electronics Assembly Using Modeling and Sim... more "Line Balancing and Productivity Improvements in Electronics Assembly Using Modeling and Simulation Techniques," SMTA Pan Pacific Microelectronics Symposium. Held at Maui, Hawaii: February 2002.
"Achieving Increased Productivity and Profitability in an EMS Environment using Lean Manufac... more "Achieving Increased Productivity and Profitability in an EMS Environment using Lean Manufacturing Tools and Techniques," SMTA Pan Pacific Microelectronics Symposium. Held in Hawaii, US: 18-20 February 2003
2020 3rd International Conference on Control and Robots (ICCR), 2020
Automatic speech recognition (ASR) technology has been used by researchers to develop voice-contr... more Automatic speech recognition (ASR) technology has been used by researchers to develop voice-controlled robots. However, the usual pattern is to develop an ASR interface that works specifically with one particular robot. Generalized ASRs, ones that can communicate with multiple robots, are needed. A generalized ASR allows an operator to control several robots that are operated by different programming languages at the same time via a single interface. This paper describes the development and an initial user study of a generalized ASR interface using a commercially available ASR software. The user study provided initial validation of the interface's functionality using a variety of commands. Results indicated a reasonably high input flexibility; the interface successfully recognized 85% of 1200 spoken commands. It also demonstrated output flexibility; the generalized ASR fed the robot a sequence of keystrokes that formed any syntax required to trigger its task programs. Implicatio...
This book chapter is to be published in the Nanotechnology For Telecommunications Handbook and pu... more This book chapter is to be published in the Nanotechnology For Telecommunications Handbook and published by CRC Press/Taylor and Francis Group, expected publication in 2009
"Development of an Interdisciplinary Curriculum in Electronics Design and Manufacturing,&quo... more "Development of an Interdisciplinary Curriculum in Electronics Design and Manufacturing," SME International Conference on Manufacturing Education. Held in San Diego, CA: March 1996
The many challenges with 0201 passive component assembly can be attributed to the solder paste vo... more The many challenges with 0201 passive component assembly can be attributed to the solder paste volume, pad design, aperture design, board finish, type of solder paste, pick-and-place, and reflow profile. A Design-of-Experiment (DOE) study was carried out to investigate the effects of these parameters on assembly defects and reliability.
The primary objective of this research is to determine the influence of deviating from the standa... more The primary objective of this research is to determine the influence of deviating from the standard reflow process window for lead-free soldering. As the industry is moving towards lead-free technology, SAC solder alloy (melting point 217°C) is being viewed as a potential ...
"Investigation of the Forward and Backward Compatibility of Solder Alloys with Component Fin... more "Investigation of the Forward and Backward Compatibility of Solder Alloys with Component Finishes for HASL and OSP PCB Finish," SMTA International Conference Proceedings. Held in Chicago, IL: 24-28 September 2006
"Computer Based Manufacturing Cell Control using Intelligent Sensing System," Internati... more "Computer Based Manufacturing Cell Control using Intelligent Sensing System," International Conference on Agile Manufacturing. Held in Minneapolis, Minnesota: May 1998
"Print Process Characterization for Fine Pitch BGA Devices," SMTA International Confere... more "Print Process Characterization for Fine Pitch BGA Devices," SMTA International Conference. Held at Chicago, IL: September 2001.
"Robotic Grippers: Instrument of Instruments," TRYST-87, All India Student Seminar. Hel... more "Robotic Grippers: Instrument of Instruments," TRYST-87, All India Student Seminar. Held at the Indian Institute of Technology, New Delhi, India: January 1987
"Lead Free Selective Soldering Process Optimization," SMTA International Conference Pro... more "Lead Free Selective Soldering Process Optimization," SMTA International Conference Proceedings. Held in Orlando, Florida: 7-11 October 2007
ABSTRACT Quality management (QM), which includes quality monitoring, data analysis and data repor... more ABSTRACT Quality management (QM), which includes quality monitoring, data analysis and data reporting, requires continuous inspection of product quality, process quality and equipment/tool condition. Product quality monitoring inspects the products after they have been manufactured or assembled. This does not provide a real-time indication of the process that is making the product. Hence, it becomes more of a non-value added task to separate the good from the bad. On the other hand, process quality or equipment/tool condition monitoring provides value-added real-time feedback of the drift in the process. This information will be useful for adaptive control of the process and equipment, to produce good parts and assemblies. With the advent of the web, and its use to control various aspects of manufacturing and assembly, real-time web-based Automatic Inspection (AI) and QM have become very attractive and viable. Web-based AI and QM will enable effective real-time integration of shop-floor dynamics into the Manufacturing Execution Systems (MES) and the Enterprise Resource Planning Systems (ERPS). This will provide effective monitoring and adaptive control of the manufacturing enterprise and its supply chain.
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020
This paper will show the benefits of the latest stretchable inks and z-axis adhesives for flexibl... more This paper will show the benefits of the latest stretchable inks and z-axis adhesives for flexible hybrid electronics (FHE) applications. These stretchable inks and z-axis adhesives will be used to build a simple multilayer flashing LED assembled on a thermoplastic urethane (TPU) substrate using standard electronic packaging methods and evaluated for tensile, strain testing, and effects of humidity and temperature.The results from the previous study of single layer silver based and carbon-based structures showed materials remain conductive over large strain however resistance did change for elongation testing and strain testing. Silver based materials had a greater resistance to change compared to carbon-based materials. However, the later had a better resistance recovery.For humidity and temperature evaluations, the silver based single layer samples showed small decrease in resistance under temperature and humidity while the carbon based single layer showed small decrease during the initial twenty-four hours then remained constant for the remainder of the test.Same tests profiles were carried on three assembled multilayer LED flashing circuit with three configurations: non-encapsulated SMD components, encapsulated with old formulation (encapsulant A), and with a new formulation (encapsulant B). Results show that fully encapsulated samples with encapsulant B have the highest resistance to mechanical and environmental stresses.
"Effect of Solder Paste and Surface Finish on 0201 Assembly Process Defects," SMTA Inte... more "Effect of Solder Paste and Surface Finish on 0201 Assembly Process Defects," SMTA International Conference Proceedings. Held in Chicago, IL: 21-25 September 2004
"Line Balancing and Productivity Improvements in Electronics Assembly Using Modeling and Sim... more "Line Balancing and Productivity Improvements in Electronics Assembly Using Modeling and Simulation Techniques," SMTA Pan Pacific Microelectronics Symposium. Held at Maui, Hawaii: February 2002.
"Achieving Increased Productivity and Profitability in an EMS Environment using Lean Manufac... more "Achieving Increased Productivity and Profitability in an EMS Environment using Lean Manufacturing Tools and Techniques," SMTA Pan Pacific Microelectronics Symposium. Held in Hawaii, US: 18-20 February 2003
2020 3rd International Conference on Control and Robots (ICCR), 2020
Automatic speech recognition (ASR) technology has been used by researchers to develop voice-contr... more Automatic speech recognition (ASR) technology has been used by researchers to develop voice-controlled robots. However, the usual pattern is to develop an ASR interface that works specifically with one particular robot. Generalized ASRs, ones that can communicate with multiple robots, are needed. A generalized ASR allows an operator to control several robots that are operated by different programming languages at the same time via a single interface. This paper describes the development and an initial user study of a generalized ASR interface using a commercially available ASR software. The user study provided initial validation of the interface's functionality using a variety of commands. Results indicated a reasonably high input flexibility; the interface successfully recognized 85% of 1200 spoken commands. It also demonstrated output flexibility; the generalized ASR fed the robot a sequence of keystrokes that formed any syntax required to trigger its task programs. Implicatio...
This book chapter is to be published in the Nanotechnology For Telecommunications Handbook and pu... more This book chapter is to be published in the Nanotechnology For Telecommunications Handbook and published by CRC Press/Taylor and Francis Group, expected publication in 2009
"Development of an Interdisciplinary Curriculum in Electronics Design and Manufacturing,&quo... more "Development of an Interdisciplinary Curriculum in Electronics Design and Manufacturing," SME International Conference on Manufacturing Education. Held in San Diego, CA: March 1996
The many challenges with 0201 passive component assembly can be attributed to the solder paste vo... more The many challenges with 0201 passive component assembly can be attributed to the solder paste volume, pad design, aperture design, board finish, type of solder paste, pick-and-place, and reflow profile. A Design-of-Experiment (DOE) study was carried out to investigate the effects of these parameters on assembly defects and reliability.
The primary objective of this research is to determine the influence of deviating from the standa... more The primary objective of this research is to determine the influence of deviating from the standard reflow process window for lead-free soldering. As the industry is moving towards lead-free technology, SAC solder alloy (melting point 217°C) is being viewed as a potential ...
"Investigation of the Forward and Backward Compatibility of Solder Alloys with Component Fin... more "Investigation of the Forward and Backward Compatibility of Solder Alloys with Component Finishes for HASL and OSP PCB Finish," SMTA International Conference Proceedings. Held in Chicago, IL: 24-28 September 2006
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Papers by S. Manian Ramkumar