2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Diamond is one of the best wide band-gap semiconductor materials available for high power devices... more Diamond is one of the best wide band-gap semiconductor materials available for high power devices development in terms of high current capability, high temperature operability, breakdown voltage and switching speed. Unfortunately, fabrication technology for diamond devices is still experimental and immature. Furthermore, one of the most critical fields to be addressed for practical diamond devices implementation concerns the development of power packaging solutions, given that limitations in the device packaging would hinder the performance of the device and act as the limiting factor for a technology that is still in a development state. Of special interest are the induced stresses and deformations caused by the thermo-mechanical mismatch between materials. These stresses and strains will be considerably different than the ones obtained with silicon or SiC dies, and it will be especially noticeable in high temperature applications due to the higher temperature swings and the reliability constraints that arise from the coefficient of thermal expansion mismatch and stiffness difference. In this paper, a Finite Element Method for thermo-mechanical simulation of a high-temperature thermal cycle for a full-stacked diamond die SOT-227 power module is introduced and compared to silicon- and SiC-die modules. Special interest is addressed to the analysis of stress and deformations generated in the die and die-attach solder layer.
The “PLATFORM” manufacturing ecosystem for pilot production of pre-commercial CNT-based nano-enab... more The “PLATFORM” manufacturing ecosystem for pilot production of pre-commercial CNT-based nano-enabled products, consists of three pilot lines (PPLs) for the manufacture of buckypapers, doped prepregs and doped veils. The PPLs have been constructed with the ultimate goal to commercialize these products in the European market in 2020/2022.This goal requires having the PPLs in compliance with the applicable product safety regulation by that date (CE marking). The main EU regulation for new machinery (as the PPLs) is the Directive 2006/42/EC on Machinery (MD). This Directive sets out the general mandatory Essential Health and Safety Requirements (EHSRs) related to the design and construction of machinery, while particular technical specifications for fulfilling them are provided in European harmonized standards. Application of harmonized standards is voluntary but confers a presumption of conformity with the EHSRs they cover. The PPLs are unique machines for own use and must comply with ...
The emergence of new SiC and GaN wide band gap technologies in Europe, Japan and in the US repres... more The emergence of new SiC and GaN wide band gap technologies in Europe, Japan and in the US represents a real breakthrough with regard to Si and GaAs technologies for high power applications in electronics. Breakthrough in terms of: High power density from 2 to 6 W/mm (even 10W/mm) High voltage operation Very high breakdown voltages (100V for the SiC, 70V for the GaN) Output impedance close to 50W simplified output matching network of HPA, less losses High temperature nominal operation The increased of dissipated power and the associated power density in electronic equipments for space applications is a common problem between the different industries. Space markets are ideal customers for this new technology in areas like: Radars, Communication systems, Processing, High Power TWT, etc… Today’s thermal solutions have reached or are about to reach their limits: Emerging solutions must be validated in a relevant environment New solutions must be developed. Conference proceedings: ISBN 9...
The development of GaN technologies has challenged packaging research, not only in terms of mater... more The development of GaN technologies has challenged packaging research, not only in terms of materials but also in terms of configurations, active cooling etc. New materials, new structures and new housing concepts need to be assessed. The thermal dissipation of existing materials for electronic packaging components are not meeting the spec ifications needed for the heat management of wide band-gap semiconductors. The high breakdown voltage, high operating temperature capability and high power densities that are required, impacts on the packaging options and increases the need for optimized thermal and power management. New packaging concepts are needed. Objectives of presented work: Study housing concepts in terms of: power dissipation, high frequency performance, high temperature operation, manufacturability, cost and space requirements Develop the most promising packaging Validate the packaging through demonstrators meeting the technical objectives Conference proceedings: ISBN 978...
GaN power transistors will roughly increase power density by more than an order of magnitude for ... more GaN power transistors will roughly increase power density by more than an order of magnitude for large devices compared to present solutions (0.5 W/mm to 5 W/mm for space applications including de-ratings). The consequences of this will directly impact on packaging technology. The thermal resistance needs to be significantly reduced if the advantages obtained at die level are to be maintained at the module and equipment level. The AGAPAC project aims to address this critical challenge for space satellite applications. COnference proceedings: ISBN 978-2-9527218-8-2
This paper provides a review of past terrorist attacks on metro vehicles and systems over the pas... more This paper provides a review of past terrorist attacks on metro vehicles and systems over the past 50 years, describing the attack methodology and the immediate and subsequent impact on the passengers, staff and infrastructure. Based on these trends it describes the set-up and execution of an explosives test on a decommissioned Metro de Madrid vehicle and discusses the response of the vehicle structure to the blast. This paper also details the blast simulation work undertaken to support the physical tests and provide recommendations into the SecureMetro demonstrator vehicle design process. The analysis of blast effect and consequences for the vehicle materials and structure led to the identification of key areas for improvement and potential solutions and design criteria were proposed.A demonstrator vehicle with new design solutions to improve blast resilience was designed, built and blast tested.The findings are discussed including an assessment of the impact of the technologies an...
Aircraft structures appear to be strategic components to be manufactured in composite materials f... more Aircraft structures appear to be strategic components to be manufactured in composite materials for reducing weight, although new questions regarding electrical conductivity have arisen such as static discharge, electrical bonding and grounding, interference shielding and current return through the structure. These functions can be met by the use of technologies based on nanocomposites, which indeed combine mechanical properties, electrical and thermal conductivity. Based on the needs to provide advanced concepts and technologies for increased and optimised use of light-weight composite smart materials, the main objective of ELECTRICAL is the development of novel multifunctional composite structures with bulk electrical conductivity and self-sensing capabilities. The project will investigate and develop alternative emerging methods to manufacture nanoreinforced carbon based composites compatible with current industrial manufacturing processes of composites. The main goals will be: –...
Presentation of the results of the SecureMetro blast testing program carried out on material pane... more Presentation of the results of the SecureMetro blast testing program carried out on material panels, vehicle subcomponents as well as full scale and demonstrator vehicles.
This presentation will describe two approaches for the incorporation of CNTs in CFRP composites t... more This presentation will describe two approaches for the incorporation of CNTs in CFRP composites to increase the electrical conductivity (EC). The addition of the CNTs in the resin bulk, to improve its properties prior to infusion: A CNT-resin masterbatch has been used as raw material to achieve good quality dispersion, thereby avoiding the use of CNTs in powder format whilst maintaining similar EC results and processability. The addition of CNT-based buckypaper on top of the CFRP structure for enhanced surface electrical properties: Optimization of buckypaper manufacturing process to enable the incorporation of the CNT within the composite structure. Several laminates have been manufactured by resin infusion: panels based on BP only, on doped resin (0,1%wt) only and also on the combination of both. SEM analyses, cross checked EC tests (X/Y and through thickness) and ILSS tests have been performed to compare their properties and assess any possible filtering effects.
Manufacturing of advanced high thermal conductivity materials Based on diamond composites complia... more Manufacturing of advanced high thermal conductivity materials Based on diamond composites compliant with standard hybrid technologies. Thermal conductivities in the order of 600W/m°C CTE approximately 6-7 ppm/°C Maximum density 6.5 g/cm3 (CuW 13g/cm3). Based on nano-composites compliant with standard hybrid technologies Thermal conductivity in the range of 500-800W/mK CTE between 7-10 ppm/K Density: 6.2-7.5 g/cm3 Compatible with industrial production mean Improved process to enable 3D shaped diamond composite base plate Using advanced metal injection molding (MIM) process. 3D shaped base plate will help to comply with high power matching electrical constraints.
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Diamond is one of the best wide band-gap semiconductor materials available for high power devices... more Diamond is one of the best wide band-gap semiconductor materials available for high power devices development in terms of high current capability, high temperature operability, breakdown voltage and switching speed. Unfortunately, fabrication technology for diamond devices is still experimental and immature. Furthermore, one of the most critical fields to be addressed for practical diamond devices implementation concerns the development of power packaging solutions, given that limitations in the device packaging would hinder the performance of the device and act as the limiting factor for a technology that is still in a development state. Of special interest are the induced stresses and deformations caused by the thermo-mechanical mismatch between materials. These stresses and strains will be considerably different than the ones obtained with silicon or SiC dies, and it will be especially noticeable in high temperature applications due to the higher temperature swings and the reliability constraints that arise from the coefficient of thermal expansion mismatch and stiffness difference. In this paper, a Finite Element Method for thermo-mechanical simulation of a high-temperature thermal cycle for a full-stacked diamond die SOT-227 power module is introduced and compared to silicon- and SiC-die modules. Special interest is addressed to the analysis of stress and deformations generated in the die and die-attach solder layer.
The “PLATFORM” manufacturing ecosystem for pilot production of pre-commercial CNT-based nano-enab... more The “PLATFORM” manufacturing ecosystem for pilot production of pre-commercial CNT-based nano-enabled products, consists of three pilot lines (PPLs) for the manufacture of buckypapers, doped prepregs and doped veils. The PPLs have been constructed with the ultimate goal to commercialize these products in the European market in 2020/2022.This goal requires having the PPLs in compliance with the applicable product safety regulation by that date (CE marking). The main EU regulation for new machinery (as the PPLs) is the Directive 2006/42/EC on Machinery (MD). This Directive sets out the general mandatory Essential Health and Safety Requirements (EHSRs) related to the design and construction of machinery, while particular technical specifications for fulfilling them are provided in European harmonized standards. Application of harmonized standards is voluntary but confers a presumption of conformity with the EHSRs they cover. The PPLs are unique machines for own use and must comply with ...
The emergence of new SiC and GaN wide band gap technologies in Europe, Japan and in the US repres... more The emergence of new SiC and GaN wide band gap technologies in Europe, Japan and in the US represents a real breakthrough with regard to Si and GaAs technologies for high power applications in electronics. Breakthrough in terms of: High power density from 2 to 6 W/mm (even 10W/mm) High voltage operation Very high breakdown voltages (100V for the SiC, 70V for the GaN) Output impedance close to 50W simplified output matching network of HPA, less losses High temperature nominal operation The increased of dissipated power and the associated power density in electronic equipments for space applications is a common problem between the different industries. Space markets are ideal customers for this new technology in areas like: Radars, Communication systems, Processing, High Power TWT, etc… Today’s thermal solutions have reached or are about to reach their limits: Emerging solutions must be validated in a relevant environment New solutions must be developed. Conference proceedings: ISBN 9...
The development of GaN technologies has challenged packaging research, not only in terms of mater... more The development of GaN technologies has challenged packaging research, not only in terms of materials but also in terms of configurations, active cooling etc. New materials, new structures and new housing concepts need to be assessed. The thermal dissipation of existing materials for electronic packaging components are not meeting the spec ifications needed for the heat management of wide band-gap semiconductors. The high breakdown voltage, high operating temperature capability and high power densities that are required, impacts on the packaging options and increases the need for optimized thermal and power management. New packaging concepts are needed. Objectives of presented work: Study housing concepts in terms of: power dissipation, high frequency performance, high temperature operation, manufacturability, cost and space requirements Develop the most promising packaging Validate the packaging through demonstrators meeting the technical objectives Conference proceedings: ISBN 978...
GaN power transistors will roughly increase power density by more than an order of magnitude for ... more GaN power transistors will roughly increase power density by more than an order of magnitude for large devices compared to present solutions (0.5 W/mm to 5 W/mm for space applications including de-ratings). The consequences of this will directly impact on packaging technology. The thermal resistance needs to be significantly reduced if the advantages obtained at die level are to be maintained at the module and equipment level. The AGAPAC project aims to address this critical challenge for space satellite applications. COnference proceedings: ISBN 978-2-9527218-8-2
This paper provides a review of past terrorist attacks on metro vehicles and systems over the pas... more This paper provides a review of past terrorist attacks on metro vehicles and systems over the past 50 years, describing the attack methodology and the immediate and subsequent impact on the passengers, staff and infrastructure. Based on these trends it describes the set-up and execution of an explosives test on a decommissioned Metro de Madrid vehicle and discusses the response of the vehicle structure to the blast. This paper also details the blast simulation work undertaken to support the physical tests and provide recommendations into the SecureMetro demonstrator vehicle design process. The analysis of blast effect and consequences for the vehicle materials and structure led to the identification of key areas for improvement and potential solutions and design criteria were proposed.A demonstrator vehicle with new design solutions to improve blast resilience was designed, built and blast tested.The findings are discussed including an assessment of the impact of the technologies an...
Aircraft structures appear to be strategic components to be manufactured in composite materials f... more Aircraft structures appear to be strategic components to be manufactured in composite materials for reducing weight, although new questions regarding electrical conductivity have arisen such as static discharge, electrical bonding and grounding, interference shielding and current return through the structure. These functions can be met by the use of technologies based on nanocomposites, which indeed combine mechanical properties, electrical and thermal conductivity. Based on the needs to provide advanced concepts and technologies for increased and optimised use of light-weight composite smart materials, the main objective of ELECTRICAL is the development of novel multifunctional composite structures with bulk electrical conductivity and self-sensing capabilities. The project will investigate and develop alternative emerging methods to manufacture nanoreinforced carbon based composites compatible with current industrial manufacturing processes of composites. The main goals will be: –...
Presentation of the results of the SecureMetro blast testing program carried out on material pane... more Presentation of the results of the SecureMetro blast testing program carried out on material panels, vehicle subcomponents as well as full scale and demonstrator vehicles.
This presentation will describe two approaches for the incorporation of CNTs in CFRP composites t... more This presentation will describe two approaches for the incorporation of CNTs in CFRP composites to increase the electrical conductivity (EC). The addition of the CNTs in the resin bulk, to improve its properties prior to infusion: A CNT-resin masterbatch has been used as raw material to achieve good quality dispersion, thereby avoiding the use of CNTs in powder format whilst maintaining similar EC results and processability. The addition of CNT-based buckypaper on top of the CFRP structure for enhanced surface electrical properties: Optimization of buckypaper manufacturing process to enable the incorporation of the CNT within the composite structure. Several laminates have been manufactured by resin infusion: panels based on BP only, on doped resin (0,1%wt) only and also on the combination of both. SEM analyses, cross checked EC tests (X/Y and through thickness) and ILSS tests have been performed to compare their properties and assess any possible filtering effects.
Manufacturing of advanced high thermal conductivity materials Based on diamond composites complia... more Manufacturing of advanced high thermal conductivity materials Based on diamond composites compliant with standard hybrid technologies. Thermal conductivities in the order of 600W/m°C CTE approximately 6-7 ppm/°C Maximum density 6.5 g/cm3 (CuW 13g/cm3). Based on nano-composites compliant with standard hybrid technologies Thermal conductivity in the range of 500-800W/mK CTE between 7-10 ppm/K Density: 6.2-7.5 g/cm3 Compatible with industrial production mean Improved process to enable 3D shaped diamond composite base plate Using advanced metal injection molding (MIM) process. 3D shaped base plate will help to comply with high power matching electrical constraints.
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