Development of MCM-D technology with photosensitive benzocyclobutene
CB Adamo, A Flacker, HM Cavalcanti… - … 30th Symposium on …, 2015 - ieeexplore.ieee.org
2015 30th Symposium on Microelectronics Technology and Devices …, 2015•ieeexplore.ieee.org
This paper evaluates the development of Multi-Chip Module Deposited (MCM-D) technology
using photosensitive benzocyclobutene (BCB) to produce passive devices. The polymer
was used as the dielectric and Ni-P/Au was used as the conductor film. The resistors' sheet
resistance was measured with both TLM and direct measurement while the measurements
of the capacitors and inductors required the usage of a Vector Network Analyzer (VNA) and
treatment of the obtained s-parameters matrix in order to extract the values of both the …
using photosensitive benzocyclobutene (BCB) to produce passive devices. The polymer
was used as the dielectric and Ni-P/Au was used as the conductor film. The resistors' sheet
resistance was measured with both TLM and direct measurement while the measurements
of the capacitors and inductors required the usage of a Vector Network Analyzer (VNA) and
treatment of the obtained s-parameters matrix in order to extract the values of both the …
This paper evaluates the development of Multi-Chip Module Deposited (MCM-D) technology using photosensitive benzocyclobutene (BCB) to produce passive devices. The polymer was used as the dielectric and Ni-P/Au was used as the conductor film. The resistors' sheet resistance was measured with both TLM and direct measurement while the measurements of the capacitors and inductors required the usage of a Vector Network Analyzer (VNA) and treatment of the obtained s-parameters matrix in order to extract the values of both the capacitances and inductances.
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