Thermal behavior of silver nanoparticles for low-temperature interconnect applications
Journal of electronic materials, 2005•Springer
Low-temperature sintering behavior of Ag nanoparticles was investigated. The nano Ag
particles used (∼ 20 nm) exhibited obvious sintering behavior at significantly lower
temperatures (∼ 150° C) than the T m (960° C) of silver. Coalescence of the nano Ag
particles was observed by sintering the particles at 150° C, 200° C, and 250° C. The thermal
profile of the nanoparticles was examined by a differential scanning calorimeter (DSC) and a
thermogravimetric analyzer (TGA). Shrinkage of the Ag-nanoparticle compacts during the …
particles used (∼ 20 nm) exhibited obvious sintering behavior at significantly lower
temperatures (∼ 150° C) than the T m (960° C) of silver. Coalescence of the nano Ag
particles was observed by sintering the particles at 150° C, 200° C, and 250° C. The thermal
profile of the nanoparticles was examined by a differential scanning calorimeter (DSC) and a
thermogravimetric analyzer (TGA). Shrinkage of the Ag-nanoparticle compacts during the …
Abstract
Low-temperature sintering behavior of Ag nanoparticles was investigated. The nano Ag particles used (∼20 nm) exhibited obvious sintering behavior at significantly lower temperatures (∼150°C) than the Tm (960°C) of silver. Coalescence of the nano Ag particles was observed by sintering the particles at 150°C, 200°C, and 250°C. The thermal profile of the nanoparticles was examined by a differential scanning calorimeter (DSC) and a thermogravimetric analyzer (TGA). Shrinkage of the Ag-nanoparticle compacts during the sintering process was observed by thermomechanical analysis (TMA). Sintering of the nanoparticle pellet led to a significant increase in density and electrical conductivity. The size of the sintered particles and the crystallite size of the particles increased with increasing sintering temperature.
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