Thermocompression bonding technology for multilayer superconducting quantum circuits
Abstract
Extensible quantum computing architectures require a large array of quantum bits operating with low error rates. A quantum processor based on superconducting devices can be scaled up by stacking microchips that perform wiring, shielding, and computational functionalities. In this article, we demonstrate a vacuum thermocompression bonding technology that utilizes thin indium films as a welding agent to attach pairs of lithographically patterned chips. At 10 mK, we find a specific dc bond resistance of 49.2 μΩ cm2. We show good transmission up to 6.8 GHz in a tunnel-capped, bonded device as compared to a similar uncapped device. Finally, we fabricate and measure a set of tunnel-capped superconducting resonators, demonstrating that our bonding technology can be used in quantum computing applications.
- Publication:
-
Applied Physics Letters
- Pub Date:
- September 2017
- DOI:
- 10.1063/1.5003169
- arXiv:
- arXiv:1705.02435
- Bibcode:
- 2017ApPhL.111l3501M
- Keywords:
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- Physics - Applied Physics;
- Condensed Matter - Superconductivity;
- Quantum Physics
- E-Print:
- 5 pages main, 3 figures and 1 table