research-article

Minimizing Thermal Gradient and Pumping Power in 3D IC Liquid Cooling Network Design

Authors:

Evangeline F. Y. Young,

Bei YuAuthors Info & Claims

DAC '17: Proceedings of the 54th Annual Design Automation Conference 2017

Article No.: 70, Pages 1 - 6

https://doi.org/10.1145/3061639.3062285

Published: 18 June 2017 Publication History

Abstract

Liquid cooling shows great potential in resolving the huge thermal obstacle in 3D ICs. However, it brings new challenges including large thermal gradient and high pumping requirement. In this paper, liquid cooling networks with flexible topology are investigated to achieve more desirable trade-offs between energy efficiency and thermal profile. Specifically, a fast thermal model for the cooling network is proposed and analyzed, followed by our optimization methodologies to construct cooling networks targeting at pumping power saving and thermal gradient reduction, respectively. Experimental results show that, under the same constraints, the cooling network can save as much as 84.03% pumping power or reduce 37.65% thermal gradient compared to straight microchannels.

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Cited By

Su Y(2024)Mesoscale multi-component energy density transport for natural convective microchip cooling with solid–liquid–gas phase changesApplied Thermal Engineering10.1016/j.applthermaleng.2023.121808236(121808)Online publication date: Jan-2024
https://doi.org/10.1016/j.applthermaleng.2023.121808
Salvi SJain A(2021)A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs)IEEE Transactions on Components, Packaging and Manufacturing Technology10.1109/TCPMT.2021.306403011:5(802-821)Online publication date: May-2021
https://doi.org/10.1109/TCPMT.2021.3064030
Kadambarajan JPothiraj S(2021)TSV Aware 3D IC Partitioning with Area OptimizationArabian Journal for Science and Engineering10.1007/s13369-021-05604-9Online publication date: 13-Apr-2021
https://doi.org/10.1007/s13369-021-05604-9
Show More Cited By

Minimizing Thermal Gradient and Pumping Power in 3D IC Liquid Cooling Network Design
1. Hardware
  1. Electronic design automation

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cover image ACM Conferences

DAC '17: Proceedings of the 54th Annual Design Automation Conference 2017

June 2017

533 pages

ISBN:9781450349277

DOI:10.1145/3061639

Copyright © 2017 ACM.

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EDAC: Electronic Design Automation Consortium
SIGDA: ACM Special Interest Group on Design Automation
IEEE-CEDA

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SIGBED: ACM Special Interest Group on Embedded Systems

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Association for Computing Machinery

New York, NY, United States

Publication History

Published: 18 June 2017

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Research Grants Council of the Hong Kong Special Administrative Region, China

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DAC '17

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SIGDA

DAC '17: The 54th Annual Design Automation Conference 2017

June 18 - 22, 2017

TX, Austin, USA

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Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

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DAC '25

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62nd ACM/IEEE Design Automation Conference

June 22 - 26, 2025

San Francisco , CA , USA

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Cited By

Su Y(2024)Mesoscale multi-component energy density transport for natural convective microchip cooling with solid–liquid–gas phase changesApplied Thermal Engineering10.1016/j.applthermaleng.2023.121808236(121808)Online publication date: Jan-2024
https://doi.org/10.1016/j.applthermaleng.2023.121808
Salvi SJain A(2021)A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs)IEEE Transactions on Components, Packaging and Manufacturing Technology10.1109/TCPMT.2021.306403011:5(802-821)Online publication date: May-2021
https://doi.org/10.1109/TCPMT.2021.3064030
Kadambarajan JPothiraj S(2021)TSV Aware 3D IC Partitioning with Area OptimizationArabian Journal for Science and Engineering10.1007/s13369-021-05604-9Online publication date: 13-Apr-2021
https://doi.org/10.1007/s13369-021-05604-9
Kandlikar SGanguly A(2020)Fundamentals of Heat Dissipation in 3D IC Packaging and Thermal-Aware Design3D Microelectronic Packaging10.1007/978-981-15-7090-2_13(369-395)Online publication date: 24-Nov-2020
https://doi.org/10.1007/978-981-15-7090-2_13
Koibuchi MFujiwara INiwa NTotoki THirasawa S(2019)The Case for Water-Immersion Computer BoardsProceedings of the 48th International Conference on Parallel Processing10.1145/3337821.3337830(1-10)Online publication date: 5-Aug-2019
https://dl.acm.org/doi/10.1145/3337821.3337830
Han JTorres-Castro KWest RVarhue WSwami NStan M(2019)Microfluidic Cooling for 3D-IC with 3D Printing Package2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)10.1109/S3S46989.2019.9320506(1-3)Online publication date: 14-Oct-2019
https://doi.org/10.1109/S3S46989.2019.9320506
Sivakumar PPandiaraj KJeyaPrakash K(2019)Optimization of thermal aware multilevel routing for 3D ICAnalog Integrated Circuits and Signal Processing10.1007/s10470-019-01513-yOnline publication date: 12-Oct-2019
https://doi.org/10.1007/s10470-019-01513-y
Hwang LKwon BWong M(2018)Accurate Models for Optimizing Tapered Microchannel Heat Sinks in 3D ICs2018 IEEE Computer Society Annual Symposium on VLSI (ISVLSI)10.1109/ISVLSI.2018.00021(58-63)Online publication date: Jul-2018
https://doi.org/10.1109/ISVLSI.2018.00021

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