R. Ramos, et al. Applied Surface Science, Volume 443, 15 June 2018, Pages 619-627.
https://doi.org/10.1016/j.apsusc.2018.02.259
Manuscript of the published article:
Applied Surface Science, Volume 443, 2018, Pages 619-627.
https://doi.org/10.1016/j.apsusc.2018.02.259
Study of nitrogen ion doping of titanium
dioxide films
Raul Ramos, Diego Scoca, Rafael Borges Merlo, Francisco Chagas Marques,
Fernando Alvarez, Luiz Fernando Zagonel*
"Gleb Wataghin" Institute of Physics
University of Campinas – UNICAMP
13083-859, Campinas, São Paulo, Brazil
This study reports on the properties of nitrogen doped titanium dioxide (TiO2) thin films
considering the application as transparent conducting oxide (TCO). Sets of thin films were
prepared by sputtering a titanium target under oxygen atmosphere on a quartz substrate at
400 or 500°C. Films were then doped at the same temperature by 150 eV nitrogen ions. The
films were prepared in Anatase phase which was maintained after doping. Up to 30at%
nitrogen concentration was obtained at the surface, as determined by in situ x-ray
photoelectron spectroscopy (XPS). Such high nitrogen concentration at the surface lead to
nitrogen diffusion into the bulk which reached about 25 nm. Hall measurements indicate that
average carrier density reached over 1019 cm-3 with mobility in the range of 0.1 to 1 cm2V-1s-1.
Resistivity about 3.10-1 cm could be obtained with 85% light transmission at 550 nm. These
results indicate that low energy implantation is an effective technique for TiO2 doping that
allows an accurate control of the doping process independently from the TiO2 preparation.
Moreover, this doping route seems promising to attain high doping levels without significantly
affecting the film structure. Such approach could be relevant for preparation of N:TiO2
transparent conduction electrodes (TCE).
Keywords: nitrogen ion doping, titanium dioxide, Anatase, transparent conducting oxide,
diffusion; electronic transport.
*Corresponding author: zagonel@ifi.unicamp.br
DOI: 10.1016/j.apsusc.2018.02.259
R. Ramos, et al. Applied Surface Science, Volume 443, 15 June 2018, Pages 619-627.
https://doi.org/10.1016/j.apsusc.2018.02.259
Graphical abstract
Highlights
A two-step process for preparation of N:TiO2 transparent conductor is proposed.
Low energy nitrogen ions are used after Anatase thin film deposition.
Approach allows excellent control of crystal, optical and electronic properties.
High temperatures enable thermal diffusion of Nitrogen inside Anatase film.
Resistivity as low as 3.10-1 cm while transparency at 550nm is about 85%.
DOI: 10.1016/j.apsusc.2018.02.259
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https://doi.org/10.1016/j.apsusc.2018.02.259
1 Introduction
The increasing demand of energy efficiency and cost-effectiveness for display and energy
technologies pushes continuously towards the search of new materials to surpass industry
standards. In flat panel displays, light emitting devices and some solar cells, efficiency is linked
to the performance of the transparent conducting electrodes (TCEs) used which allows front
electrical contacts and simultaneously letting visible light in or out of the device. While tindoped indium oxide (ITO) is an industry standard TCE, it presents a high cost linked to indium
scarcity. Most alternatives available today, such as ZnO or SnO2, has interesting niche
applications. New and better TCEs, both in terms of cost and efficiency, are of great interest
for several wide or niche applications.
Since titanium oxide (TiO2) doped with niobium has been proposed as TCE by Hasegawa group
see refs. [1,2], several studies discussed the optical and electrical properties of TiO2 doped
with Nb, Ta, W, and N [3,4,5,6]. Moreover, it has been shown that, by doping TiO2 with
nitrogen, it is possible to reduce its optical gap and favor catalytic activity with visible light,
with considerable interest for water splitting, among other applications [7,8]. Since then,
several studies explored the properties of nitrogen doped titanium oxides (mainly Anatase and
Rutile) prepared in various ways with respect to its optical, catalytic and transport properties.
Nitrogen doped TiO2 has already been synthetized by reactive sputtering and by post
treatments with ammonia or ion implantations, among others. Using electron cyclotron
resonance plasma sputtering under O2 and N2 gases, H. Akazawa showed that it is possible to
continuously control carrier concentration and obtained films with a resistivity of 0.2 cm with
a maximum transparence in the visible of about 80%, but the films were frequently
amorphous, while large crystalline grains might favor better conductivity at similar
transparency [4,6]. Using reactive d.c. magnetrons sputtering in an Ar+O2+N2 gas mixture, N.
Martin et al. obtained about 25cm with about 30% transmission, depositing TiNxOy. Again, in
this study, crystal structure was difficult to control and, besides Rutile and Anatase, even Ti3O5
was observed [9]. In another work by J.-M. Chappé et al., also using d.c. reactive magnetron
sputtering, prepared TiOxNy films with visible light transmittance ranging from very low to
nearly 80%, with a resistivity ranging from 10-3cm to 50 cm and with a complex crystal
structure where Anatase was not the majority phase present [10]. Given the inherent difficulty
in controlling independently composition and crystal structure/quality in reactive sputtering,
splitting the processes in two parts is an interesting alternative. In this approach, Anatase or
Rutile samples can be prepared and doped a posteriori with nitrogen by, for instance, ion
implantation or NH3 gas [11,12,13]. Using this approach, H. Shen et al. showed that
implantation with 200 eV nitrogen ions successfully doped Anatase nanoparticles and
enhanced photocatalytic efficiency without changing the crystal structure [13].
Considering that ion doping of TiO2 could be relevant for TCE preparation, in this work, we
deposited Anatase thin films at 400 and 500°C and then doped by low energy nitrogen ion
implantation at 150eV from a simple laboratory ion gun. Such process allows doping pure
Anatase thin films with controllable nitrogen amounts and following closely its properties. By
heating the sample during the ion implantation, we could allow the diffusion of nitrogen from
the surface into the bulk, thus developing a dopant profile. The results indicate that low
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energy nitrogen doping of Anatase is a promising route for preparation of this material, N:TiO2
or TiNxOy as a TCO.
2 Experimental Methods
Sample preparation was performed in two sequential steps. First, a Ti target was sputtered
using an ion beam (Ion Beam Deposition) to grow a thin film on amorphous quartz substrate.
Argon was used as inert gas for bombarding the Ti target at an energy of 1.5keV. During the
deposition, a partial pressure of 2.510-2 Pa of oxygen was maintained (chamber base pressure
was about 210-4 Pa). Such partial pressure results in Anatase films with well-defined x-ray
diffraction peaks [14]. During the deposition, Argon partial pressure in the chamber was about
110-2Pa. During a second step, nitrogen ions were implanted at low energy, 150 eV, into the
thin film surface. The ions were produced in a Kaufman cell fed with 5 sccm of Nitrogen and
0.5 sccm of hydrogen, resulting in 2.110-2 Pa and 2.110-3 Pa partial pressures in the chamber
respectively (Argon and oxygen were not used in this step). Such sample preparation was
performed in a custom-built system that features two ion guns (one pointing to a sputter
target and the other to the sample holder) in one vacuum chamber that is directly connected
to another chamber for in situ X-ray Photoemission Spectroscopy analysis. More details of the
deposition system and its capabilities can be found in references [15] and [16]. Hydrogen was
used in analogy with ref. [17] (see also references there in) to remove oxygen from the surface
to make it more reactive for incoming nitrogen. Indeed, the formation enthalpy favors TiO2
over TiN [18] and in principle residual oxygen gas and water vapor in the vacuum chamber
could keep the surface partially oxidized preventing nitrogen intake. The ion gun points
perpendicularly to the sample surface and is located about 30 cm from the sample. The
samples were prepared at different substrate temperatures (for both steps): 400 and 500°C
and with different implantation times: 0, 10, 30 and 60 minutes. Film thickness was evaluated
by perfilometry and it ranges from 70 to 100 nm.
Just after preparation, samples were in situ analyzed in UHV by X-ray Photoemission
Spectroscopy (XPS) using Al K radiation. Spectra were fitted using Avantage software.
Average inelastic mean free path for Anatase and kinetic energies from 900-1100 eV are
estimated as about 2 nm [19]. X-ray diffraction (XRD) was performed using Cu Kand keeping
incidence angle at 1°. In this geometry, the average penetration depth is estimated as 0.05 m
for Anatase [20]. Sheet resistance was measured using 4-probe technique. Mobility, resistivity
and carrier concentration were determined by Hall measurements using the Van der Pauw
method in an Ecopia-3000 device using a 0.55 T permanent magnet. For Hall measurements,
indium was used to provide ohmic contacts. Optical transparency measurements were
performed in an Agilent 8453 device which uses a CCD detector.
Resistance versus temperature measurement was performed for the sample deposited at
500°C and implanted for 60 minutes (at the same temperature). The measurement was carried
out in a CTI Cryodine closed-cycle helium refrigerator in the temperature range from 80 K to
300 K. The electrical data was acquired using a Keithley model 2602A SourceMeter and the
indium contacts previously used for Hall measurement, in the van der Pauw geometry. A
DOI: 10.1016/j.apsusc.2018.02.259
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constant current of 10 A was applied between two contacts and the voltage was measured
between the other two, in a parallel configuration. A complete thermal loop was carried out to
confirm the reproducibility of the data.
“a ple’s orpholog
as studied
Ato i For e Mi ros op AFM a d Tra s issio
Electron Microscopy (TEM). TEM analysis was performed in a JEOL 2100F TEM equipped with a
Field Emission Gun (FEG) operating at 200 kV with an energy resolution of about 1 eV. EELS
was obtained using a Gatan GIF Tridiem installed in this TEM and Gatan Digital Micrograph
routines were used for quantification. The data were acquired in Scanning Transmission
Electron Microscopy (STEM) mode in the form of spectrum lines (the electron beam is focused
on the sample and a spectrum is acquired for each position along a line forming a bidimensional dataset). Topographic images of the sample’s surface were taken with an Innova
Bruker Atomic Force Microscope (AFM) in non-contact mode.
3 Results and Discussions
3.1 Composition and Structural characterization
The effectiveness of the ion implantation at 150 eV was demonstrated by the presence of large
amounts of nitrogen at the surface, as observed by in situ XPS. Figure 1 shows XPS spectra for
the sample prepared at 500°C for 60 minutes, with similar results for all other samples. Main
features observed by XPS are expected for TiO2 and for TiN. In situ XPS on TiO2 samples grown
at 400 and 500°C (not shown) are similar to those in ref [14] and [21], typical for Anatase film
close to stoichiometry. It must be noted that absolute binding energies are not accurately
known due to some degree of uncontrolled spectral shift that is attributed to sample charging.
From the indicated decomposition into several proposed chemical bounds, it is possible to
observe that nitrogen concentration is similar to that of oxygen and that a TiOxNy alloy was
created at the surface (TiN and TiO2 components are observed in the Ti 2p spectrum). It is
noteworthy in Figure 1(c) the presence of two XPS peaks for N 1s, one, smaller, at higher
binding energy, and another, bigger, close to 396 eV (that is in turn composed of two peaks).
Such smaller and bigger peaks are attributed to interstitial nitrogen and substitutional
nitrogen, respectively [12,13,22,23]. In our case, interstitial N accounts to about 10% of the
total amount of nitrogen observed on the surface, a much lower value when compared to ref.
[8], which used NH3 as nitrogen source, or ref. [13], which used 200 eV nitrogen ions without
hydrogen. Therefore, depending on the incorporation route, different chemical locations are
possible. This difference is relevant since depending on nitrogen site different diffusion
mechanisms apply [12].
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Ti 2p
O 1s
Ti - O
20
Counts/s (x1000)
Counts/s (x1000)
25
a)
20
Ti - N - O
15
10
15
b)
Ti - O
Ti - O
Ti - N
Ti - N
10
5
533
532
531
530
529
528
464
Binding Energy (eV)
460
456
Binding Energy (eV)
N 1s
Counts/s (x1000)
8
c)
N substitutional
6
N Interstitial
4
2
408
404
400
396
392
Binding Energy (eV)
Figure 1: In situ x-ray photoemission spectra from sample grown at 500°C and implanted (at the same
temperature) for 60 minutes with 150 eV nitrogen ions. The spectra include decomposition into
components for different expected chemical bounds in the sample.
To evaluate if hydrogen was significantly affecting N 1s spectra, a sample was prepared
without hydrogen gas during the implantation step. N1s peaks for samples prepared with and
without hydrogen at 500°C and implanted for 60 minutes are shown in Figure 2. The spectra
show that even without hydrogen the peak is still present and with similar (although smaller)
ratio with respect to main N 1s peak. This shows that it does not depend on presence of
hydrogen during the nitriding process, in contrast to literature suggestion [24]. However, as
discussed below, total nitrogen concentration is smaller without hydrogen, indicating that
hydrogen contributes to nitrogen incorporation at the surface, possibly by removing
oxygen.[17]
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Intensity (Normalized)
1.0
60' - 500°C with H2
60' - 500°C without H2
N 1s
N Intertitial
0.5
0.0
405
400
395
Binding Energy (eV)
Figure 2: X-ray photoemission spectra are shown for samples prepared with and without hydrogen in
the gas feed to the ion gun. The peak associated to Nitrogen in interstitial sites is observed in both
samples.
To support the given interpretation of XPS results, SRIM simulations have been performed
[25,26]. Simulations considered nitrogen ions (N+) on Anatase. Average penetration depth is
about 0.9 nm while 90% of implanted nitrogen ion reaches a depth within 1.7 nm. These
simulations indicate that XPS is probing exactly the implanted region and hence is suitable to
investigate the nitrogen intake by the sample from the ion beam.
Following the procedures detailed in references [27] and [28], we used XPS results to calculate
the elemental concentrations of surface components. The results are shows in Figure 3 for
samples prepared at 400 and at 500°C with implantation times ranging from 0 to 60 minutes. It
is observed that in the first few minutes of implantation, a significant nitrogen concentration
builds up at the surface and after the concentration increases yet to reach about 33at.%. This
is explained by the high reactivity of the nitrogen ion beam and the low diffusion coefficient of
nitrogen into the interior of the thin film. In such scenario, we consider that a high nitrogen
concentration builds up during the first moments and is maintained by the ion beam creating a
high nitrogen chemical potential at the surface. This nitrogen concentration will be the driving
force for nitrogen diffusion into the thin film. The extent of the diffusion will depend mainly on
the temperature but also on several details of the thin film microstructure, such as vacancies,
grain boundaries, stress, and so on. This process is in tight analogy to the plasma or ion beam
nitriding of steels at low temperatures where nitrogen diffusion is also slow [29,30]. It is
important to note that for both studied temperatures, with sufficient nitriding time, the
surface builds a titanium oxynitride alloy with stoichiometry close to TiO1N1 (note such result
applies only at the outer 2 nm of the thin film surface). It is also interesting that the sample
prepared without hydrogen had a nitrogen concentration of only 25at.% while the sample
prepared with hydrogen in the same conditions (500°C – 60 minutes) had 33at.% of nitrogen at
the surface. Again this indicates that hydrogen may favor oxygen removal opening sites for
nitrogen chemical adsorption and reaction, even if nitrogen arrives at 150eV at the surface and
the sample is in high vacuum.
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500°C
400°C
80
Ti
O
N
60
Concentration (at. %)
Concentration (at. %)
80
40
20
0
Ti
O
N
60
40
20
0
0
10
20
30
40
50
Implantation Time (min)
60
0
10
20
30
40
50
60
Implantation Time (min)
Figure 3: Nitrogen, Oxygen and Titanium concentration obtained by in situ XPS for samples prepared at
400° and 500°C for several implantation times. Lines are a guide to the eyes. Nitrogen concentration
reaches about 33at.%.
X-ray diffractograms are shown in Figure 4 for samples prepared at 400 and 500° without
nitrogen implantation and implanted for 10, 30 and 60 minutes, as before. It is observed that
all samples display peaks associated with Anatase phase with considerable intensity indicating
the crystalline nature of the thin films. Moreover, implantation with Nitrogen and Hydrogen
does not disturb the crystal structure, similarly to what has been reported in the literature for
200eV nitrogen implantation into Anatase thin films [13]. The position of the Anatase (101)
peak remains within (25.30±0.05)° for all diffractograms while reference Anatase (101) is
expected at 25.33° according to ICSD 9852. It must be noted that samples are kept at
deposition temperature during the implantation and are therefore annealed what could affect
their crystalline structure. It is also noteworthy that peak ratios do not agree with expected
values for Anatase powder and hence the films should have some texture [31].
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500°C
400°C
10'
30'
10'
0'
2(°)
60
30
40
50
2(°)
105
101
211
105
50
200
40
Anatase
004
30
200
101
Anatase
004
0'
211
30'
60'
Intensity (Normalized)
Intensity (Normalized)
60'
60
Figure 4: Diffractograms from grazing incidence X-ray Diffraction for TiO2 films prepared at 400 and
500°C and implanted for the time indicated in each curve. Anatase lines are indicated in the bottom
according to ICSD 9852.
Transmission Electron Microscopy was applied to determine the extent of nitrogen diffusion
into the film from the surface. For that, we considered only the sample prepared at 500°C for
60 minutes, considering that other samples would have a shallower nitrogen penetration
depth. Figure 5 shows a cross-section of the sample. Apart from the amorphous quartz
substrate and the protective coating used for FIB lamella preparation, we can observe the N
implanted TiO2 thin film in two layers, on top a layer that apparently has been modified by the
implantation/diffusion process and on the bottom the pristine Anatase film. HRTEM images
indicate the presence of atomic planes and grains from bottom to top of the thin film, again
confirming the Anatase film preserved its crystal structure even after nitrogen shallow
implantation (shallower than 2nm from SRIM simulations) and subsequent diffusion.
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Figure 5: TEM cross-section micrograph from sample prepared at 500°C and implanted for 60 minutes.
(a) A modified region at the surface is observed. (b) HR-TEM shows atomic planes from small grains from
bottom to the top of the thin film. The insert shows a SAED pattern obtained nearby on a region with
larger grains.
Electron energy loss spectroscopy was used to detect nitrogen and determine its profile in the
sample cross-section. Figure 6(a) shows the profiles of nitrogen, oxygen and titanium from the
surface to the interior of the thin film. The detection of nitrogen was difficult due to sample
damage: apparently the electron beam removed nitrogen during beam exposure. For this
reason (and also because of diffraction and thickness effects were not taken into account), the
results in Figure 6(a) may underestimate the original concentration (due to damage even in
reduced dose measurements) or other systematic error (due to the other mentioned effects).
However, it can accurately be considered semi-quantitatively to measure the diffusion depth.
In Figure 6(a), a complementary error function fitting is added to the nitrogen profile as a thin
line. Despite the noise, it is clear that nitrogen is detected down to 25 nm or so (where
estimated nitrogen concentrations decreases to 10% of its surface value). The presence of
nitrogen is also clear in the fine-structure of Titanium and oxygen absorption edges, shown in
Figure 6 (b). Again, a transition from one edge shape to the other is observed around 30 nm
from the surface. Moreo er, it is i teresti g to ote that the o tai ed itroge profile did ’t
affect the crystal structure as observed by RH-TEM (Figure 5 (b)), that is, no amorphous layer
was found despite the observed nitrogen concentration. Indeed, in some studies, the presence
of nitrogen in reactive sputtering leads to amorphous N:TiO2 films [4].
(b)
(a)
Normalized Intensity
Concentration (at. %)
1.5
N:TiO2
60
Nitrogen
Titanium
Oxygen
50
40
30
5
TiO2
1.0
0.5
0.0
0
0
10
20
30
40
50
Depth within the TiO2 Film ( nm )
DOI: 10.1016/j.apsusc.2018.02.259
60
460
470
520
540
560
Electron Energy Loss ( eV )
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Figure 6: (a) Nitrogen, Oxygen and Titanium semi-quantitative profile determined by STEM-EELS on a
cross-section lamella. A complementary error function fit was added to nitrogen profile. (b) Averaged
EEL spectra of titanium 2p and oxygen 1s absorption edges indicating the difference from the upper
(nitrogen doped) layer to the bottom (pristine) TiO 2.
Atomic force microscopy was used to gather a broader idea of the growth and also a clearer
picture of the surface before and after ion implantation. The average surface roughness is
about 1 nm for all samples, indicating a smooth growth of TiO2 Anatase thin film by reactive
sputtering and also that implantation at 150eV does not induce surface roughening. Illustrative
results, for samples growth at 400°C without implantation and implanted for 30 minutes, are
shown in Figure 7. Without implantation, the surface shows small grains having about 40-60
nm in diameter, but the height difference from peak to valley is just about 3 nm. After
implantation, crystal grains are partially revealed, as indicated by arrows in Fig. 7(b), and their
diameter is in fact about 200 to 300 nm, a result more consistent with TEM observations. As
we consider that the ion implantation at 150eV or the annealing time did ’t change the crystal
structure, grains should have diameters in the hundreds of nanometers from the beginning of
the deposition, but ion polishing was necessary to reveal the actual grains due to preferential
sputtering of different crystal orientations [32].
Figure 7: AFM images of the surface of samples implanted by 0 minutes (undoped) and 30 minutes, both
prepared at 400°C, are shown is (a) and (b), respectively. Ion implantation reveals partially the grains by
preferential sputtering. Arrows in (b) indicate grain boundaries.
From XRD, XPS, TEM and AFM results, it is possible to form the following picture of the
implantation process: the ion beam is highly reactive and, with the help of hydrogen, creates a
high surface chemical potential which is, together with the process temperature, the driving
force for nitrogen diffusion into the thin TiO2 film. Considering that a roughly constant nitrogen
concentration builds up in the first minutes, a diffusion coefficient of nitrogen on anatase at
500°C can be calculated as approximately 210-8m2s-1, o sideri g the solutio of Fi k’s
second law for a constant surface concentration. R. G. Palgrave et al. fond similar values
(2.5310-8m2s-1) at 675° for rutile and also, analyzing very accurate nitrogen concentration
profiles, reported different diffusion coefficients, indicating more than one diffusion route
[12]. Moreover, they show that interstitial nitrogen diffuses much faster than substitutional
nitrogen. In this case, the quantitative concentration of nitrogen obtained by EELS should be
compared to the interstitial nitrogen concentration, which, from our in situ XPS results, is
about 3at.%, meaning a better agreement between EELS nitrogen concentration near the
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surface and XPS results. It must be noted that since only about half to one third of the film is
actually doped, the average nitrogen concentration is probably closer to 1-2at.%.
3.2 Electrical characterization
Very generally, the effect of nitrogen implantation and diffusion into the Anatase thin film can
be monitored by 4 probe electrical resistivity measurements. Such results, converted into
sheet resistance, are shown in Figure 8 (a). It is observed that sheet resistance drops by 7
orders of magnitude and reaches 54.7k/. These results are in close agreement with
resistivity, , as measured by van der Pauw method using indium contacts, shown in Figure
8(b). The films resistivity could be as low as 310-1 cm, for the sample prepared at 500°C and
implanted for 60 minutes (average nitrogen concentration about 1-2%). This resistivity is about
10 fold lower than reported for TiO1.88N0.12 (4at.% of nitrogen) prepared by plasma-assisted
molecular beam epitaxy [33]. Moreover, the presented results are very similar to N:TiO2
prepared by electron cyclotron resonance and by reactive sputtering in refs [4,6] (with slightly
lower light transmittance, see below) but higher than TiO2 doped with Nb, Ta or W, which may
show resistivity much lower than 10-2 cm [5,34,35]. In Figures 8 and 9 the symbols cover the
estimated uncertainty bars.
400 °C
500 °C
13
400 °C
500 °C
5
10
10
10
(cm)
Rs (/sq)
10
7
10
4
10
a)
0
3
10
1
10
-1
10
20
30
40
50
Implantation Time (min)
60
10
b)
0
10
20
30
40
50
60
Implantation Time (min)
Figure 8: (a) Sheet resistance and (b) Resistivity from all samples measured by 4-probe and van
der Pauw, respectively. The results are in close agreement.
Mobility and carrier concentration results are shown in Figure 9. Highest carrier concentration
is observed for sample implanted at 500°C and for 60 minutes and reaches up to 61019 cm-3.
Mobility values measured are always lower than 1 cm2v-1s-1 (and just above 0.1 cm2v-1s-1),
which is much lower (at least by one or even two orders of magnitude) than usual TCOs like
ITO or SnO2 [36]. Such mobility is however similar to reported to Nb doped TiO2 [34]. Note that
resistivity and carrier concentration values are calculated considering the full film thickness
and, as EELS Nitrogen profile showed (Figure 6(a)), nitrogen concentration is far from
homogenous along the thin film. If one takes into account that nitrogen is present in about one
third of the films (30 nm instead of 90 nm), then carrier concentration would be in such region
and in average about 21020 cm-3 (it should be higher close to the surface). Such corrected
carrier concentration starts to be similar to values obtained in the literature as 31020cm-3 for
Ta:TiO2 and 1021 cm-3 for Nb:TiO2 [35,34]. Industry standard TCEs have again similar carrier
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concentration values, such as 1.51020cm-3 for FTO, or about 2021 cm-3 for ITO and AZO [37, 38,
39]. Similarly, sheet resistance (or resistivity) in the doped region would be 3 fold smaller than
in the thin film average. Moreover, nitrogen concentration gradient may explain low mobility
since the region more relevant to electrical measurements has higher carrier concentration,
which in turn may reduce mobility.
400 °C
500 °C
400 °C
500 °C
-3
Carrier Density (cm )
18
10
10
16
10
1
14
2
10
12
10
Carrier Mobility (cm / Vs)
100
20
10
0.1
0
10
20
30
40
50
60
Implantation Time (min)
Figure 9: Hall mobility and carrier concentration measured by van der Pauw method. Carrier density is
show in open symbols while solid symbols show carrier mobility.
The temperature dependence of the resistance is shown in Figure 10 (a) for the sample
prepared at 500°C and implanted for 60 minutes. A very small hysteresis was observed. Failure
to fit data in an Arrhenius plot (LnR vs. 1/T) denoted that the resistance is not governed by
thermal activation, contrary to plasma-assisted molecular beam epitaxy N:TiO2 samples that
contained mostly substitutional nitrogen [33]. However, the resista e s ales as LogR α T-1/2, as
shown in Figure 10 (b). This suggests that the conduction mechanism close to room
temperature is variable range hopping (VRH). For this regime the resistivity should follow:
ρ(T) = ρ0 exp[T0/T] p,
(1)
where p = 1/4 for Mott (Mott-VRH) [40] and p = 1/2 for Efros and Shklovskii (ES-VRH) [41].
Both mechanisms were observed in ion implanted TiO2 single crystals [42] and disordered TiO2
thin films [43,44] in a wide temperature range. To determine which one of the mechanisms is
dominant in our sample we used the method proposed by Zabrodskii and Zinoveva [45] to
obtain the exponent p, where w(T) = - ∂log R /∂log T a d log
= log pT0 p – p log(T). By
plotting log(w) versus log(T) we can find the value of the exponent p from the slope of the
curve. As depicted in the insert of Figure 10(b), for T > 235 K the curve is fitted with p = 0.488 ±
0.007, very close to value expected for ES-VRH conduction mechanism. For lower
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R. Ramos, et al. Applied Surface Science, Volume 443, 15 June 2018, Pages 619-627.
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temperatures, the data diverge, indicating a change in the conduction mechanism. Further
study is necessary to understand this behavior but is outside the scope of this work.
T(K)
278
100
156
70
b)
5
10
5
Log(T)
R()
Resistance ()
10
4
10
2.3
0.27
Log(w)
a)
50
2.4
p = 0.488
0.22
100
150
200
250
4
10
300
0.06
0.08
Temperature (K)
T
0.10
-1/2
0.12
-1/2
(K
)
Figure 10. (a) Resistance versus temperature for the film prepared at 500°C and implanted for 60
-1/2
minutes. A small hysteresis was observed. (b) Logarithm plot of resistance versus T showing a linear
dependency (blue line) at high temperature. The inset shows the double-log plot of function w(T) and T
a d the alue of e po e t p , as deter i ed fro the slope of the ur e.
3.3 Optical Characterization
The UV-Vis-NIR light transmission spectra for the studied samples are shown in Figure 11. The
transmission spectra for amorphous quartz (used as substrate) and undoped anatase prepared
at 400 and 500° are also shown. Interference fringes are observed for the thin films and the
maximum transmission is in the range from 500 to 600 nm (green). It is observed that undoped
anatase have a transmission maximum very similar to amorphous quartz and that by doping
the thin films the transmission falls from about 90% to 85% (with respect to air). Such
observed transmission is better than some literature results for doped TiO2 with similar
resistivity, as indicated above. [4,6,34]. The transmission curves were simulated (not shown)
using the method described in ref [46] and the general shape is very well described considering
only the thickness and refraction indexes of the film and substrate. Transmission spectra
measured further into the IR up to 3000 nm (not shown) are still featureless with only one
absorption region near 2720 nm due to the quartz substrate.
500°C
80
60
40
0'
10'
30'
60'
Quartz
20
0
200
400
600
400°C
100
800
Wavelength (nm)
DOI: 10.1016/j.apsusc.2018.02.259
1000
Transmittance (%)
Transmittance (%)
100
80
60
40
0'
10'
30'
60'
Quartz
20
0
200
400
600
800
Wavelength (nm)
1000
R. Ramos, et al. Applied Surface Science, Volume 443, 15 June 2018, Pages 619-627.
https://doi.org/10.1016/j.apsusc.2018.02.259
Figure 11: Light transmission for samples prepared at 500 and 400°C. Amorphous quartz substrate and
undoped anatase thin film are also shown.
Absorption spectra can be used to determine the optical band-gap. Taking in account that
Anatase has an indirect band-gap and following the procedure indicated in [47], the optical
band gap can be obtained by plotting the square-root of the absorption coefficient as function
of the energy and extrapolating the absorption edge at high energies [48]. Figure 12 shows the
results for two extreme cases: undoped Anatase thin film prepared at 500°C and nitrogen
implanted for 60 minutes also prepared at 500°C. Optical band-gap in both cases is about 3.29
eV, in agreement with Anatase value [47,49]. This indicates that the doped region does not
affect significantly the overall light absorption edge. Similar results were obtained for all other
samples (not shown). Such result is in agreement to literature reports that indicate that gap
narrowing is related to substitutional nitrogen, which in our case could be restricted to the
surface. Interstitial nitrogen, on the other hand, does not reduce band-gap [12,50,51].
10
0' - 500°C
60' - 500°C
6
3
(10 cm )
-1 1/2
8
1/2
4
2
0
2
3
4
5
Energy (eV)
Figure 12: Square-root of the absorption coefficient for undoped and 60 minutes N doped Anatase films
prepared at 500°C. In both cases, the gap is about 3.29 eV.
3.4 Shelf stability
Finally, the shelf stability was evaluated by measuring the resistivity, mobility and carrier
concentration on the interval of some days for the sample implanted for 30 minutes at 500°C
(without any surface protection/coating). The results, shown in Figure 13, indicate that the
films maintains its resistivity with only a 40% resistivity increase, despite the fact that TiO2 is
thermodynamically favorable with respect to TiN. It is observed that the resistivity increases
slightly from (1.8±0.2) to (2.5±0.3) cm, see Figure 13 (a). This change is accompanied by a
decrease of carrier density and an increase in mobility, as shown in Figure 13(b) and (c). Such
changes could be due to surface oxidation that would displace nitrogen and reduce its
concentration. However, oxygen diffusion would be too slow to displace nitrogen deeper in
the thin film. The stability of this N:TiO2 film, even if not subjected to heat or UV light, is
interesting with respect to literature [52]. Further study is needed to compare the stability of
N:TiO2 to that of other TCOs [53].
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3.0
4
(a)
2.5
(b)
1.0
0.8
19
2.0
1.5
(cm²/Vs)
(cm)
-3
n (10 cm )
3
(c)
0.6
2
0.4
1
0.2
1.0
0
0
20
40
60
80
100
Time (days)
0.0
0
20
40
60
Time (days)
80
100
0
20
40
60
80
100
Time (days)
Figure 13: Resistivity, carrier concentration and mobility for shelf storage of the sample nitride for 30
minutes and prepared at 500°C.
4 Conclusions
In summary, a comprehensive study showed that, by implanting 150 eV nitrogen and hydrogen
ions into Anatase films, it is possible to build ~33% nitrogen surface concentrations which drive
nitrogen diffusion into the volume of the film. For the sample prepared at 500°C and
implanted for 60 minutes, the films resistivity could be as low as 310-1 cm while
transparency at 550nm is about 85%. In this case, nitrogen diffusion could reach about 25 to
30 nm deep into the thin film. Note that 150eV nitrogen ions are readily available with simple
laboratory ion guns.
The proposed two step deposition and doping technique could, as planned, provide Anatase
thin films with a nitrogen doped zone near the surface. Moreover, carrier densities and
conductivities similar to other established TCOs could be obtained. These results show the
effectiveness of nitrogen diffusion into the Anatase film from the surface due to the obtained
nitrogen surface concentration and applied temperature. Clearly, it was not possible to dope
with nitrogen the whole film or to create homogenously doped sample at 500°C and 60
minutes of implantation. However, by adjusting properly the nitriding implanting time, desired
thin film properties could be obtained. Indeed, the presented results indicate that, by doping
during longer times until the whole thin film is doped, it could be possible to obtain resistivities
lower than 10-1 cm.
This study supports the interpretations that interstitial nitrogen has higher binding energy in
XPS, that it diffuses faster in Anatase (with respect to Nitrogen in substitutional sites) and that
it does not affect Anatase optical bandgap.
Finally, low energy ion doping using simple ion guns can be applied to Anatase prepared by
other means, even colloidal synthesized nanoparticles. The high reactivity of low energy
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nitrogen ions associated with hydrogen ions, we speculate, could be also effective in other
Anatase samples kinds.
5 Acknowledgments
Part of this work was supported by FAPESP, projects 2014/23399-9 and 2012/10127-5.
TEM experiments were performed at the Brazilian Nanotechnology National Laboratory
(LNNano/CNPEM).
6 References
1- Yutaka Furubayashi, Taro HitosugiYukio YamamotoKazuhisa InabaGo Kinoda and Yasushi
HiroseToshihiro Shimada and Tetsuya Hasegawa, Appl. Phys. Lett. 86 (2005) 252101;
doi:10.1063/1.1949728.
2- Naoomi Yamada, Taro Hitosugi, Ngoc Lam Huong Hoang, Yutaka Furubayashi, Yasushi Hirose, Seiji
Konuma, Toshihiro Shimada, Tetsuya Hasegawa, Thin Solid Films 516 (2008) 5754–5757.
3- Takao Ishida, Masahisa Okada, Tetsuo Tsuchiya, Takashi Murakami, Miki Nakano, Thin Solid Films 519
(2011) 1934–1942.
4- H. Akazawa, Appl. Surf. Sci., 263 (2012) 307–313.
5- Utahito Takeuchi, Akira Chikamatsu, Taro Hitosugi, Hiroshi Kumigashira, Masaharu Oshima, Yasushi
Hirose, Toshihiro Shimada, and Tetsuya Hasegawa, Journal of Applied Physics 107 (2010) 023705.
6- H. Akazawa, Jpn. J. Appl. Phys., 49 (2010) 4–7.
7- R. Asahi, T. Morikawa, T. Ohwaki, K. Aoki, Y. Taga, Science, 293 (2001) 269-271
8- Hiroshi Irie, Yuka Watanabe , and Kazuhito Hashimoto, J. Phys. Chem. B, 107 (2003) 5483–5486.
9- N Martin, O Banakh, A.M.E Santo, S Springer, R Sanjinés, J Takadoum, F Lévy, Applied Surface Science
185 (2001) 123–133.
10- J.-M. Chappé, N. Martin, J. F. Pierson, G. Terwagne, J. Lintymer, J. Gavoille, J. Takadoum, Applied
Surface Science 225 (2004) 29–38.
11- Matthias Batzill, Erie H. Morales, Ulrike Diebold, Chemical Physics 339 (2007) 36–43.
12- Robert G. Palgrave, David J. Payne and Russell G. Egdell, Journal of Materials Chemistry, 19 (2009)
8418–8425.
13- Hong Shen, Lan Mi, Peng Xu, Weidian Shen, Pei-Nan Wang, Applied Surface Science 253 (2007)
7024–7028.
14- M. C. Marchi, S. A. Bilmes, C. T. M. Ribeiro, E. a. Ochoa, M. Kleinke, and F. Alvarez, J. Appl. Phys., 108
(2010) 064912.
15- P. Hammer, N.M. Victoria, F. Alvarez, J. Vac. Sci. Technol. A 16 (1998) 2941.
16- L.F. Zagonel, F. Alvarez, Materials Science and Engineering A 465 (2007) 194–198.
17- L. F. Zagonel, C.A. Figueroa, F. Alvarez, Surf. And Coat. Technol, 200 (2005) 2566.
doi:10.1016/j.surfcoat.2004.10.126.
18- National Institute of Standards, http://webbook.nist.gov (accessed 29 October 2017).
19- S. Tanuma, C. J. Powell, D. R. Penn:Surf. Interf. Anal. 21 (1994) 165.
20- I. C. Noyan and J. B. Cohen, Residual Stress: Measurement by Diffraction and Interpretation. New
York: Springer-Verlag, 1987.
21- D. Scoca, D., Morales, M., Merlo, R., Alvarez, F. & Zanatta, A. R. sensor, J. Appl. Phys. 117 (2015)
205304. doi: 10.1063/1.4921809
22- M. J. Powell, R. G. Palgrave, C. W. Dunnill, and I. P. Parkin, Thin Solid Films, 562 (2014) 223–228.
23- Cristiana Di Valentin, Emanuele Finazzi, Gianfranco Pacchioni, Annabella Selloni, Stefano Livraghi,
Maria Cristina Paganini, Elio Giamello, Chemical Physics 339 (2007) 44–56.
DOI: 10.1016/j.apsusc.2018.02.259
R. Ramos, et al. Applied Surface Science, Volume 443, 15 June 2018, Pages 619-627.
https://doi.org/10.1016/j.apsusc.2018.02.259
24- O. Diwald, T. L. Thompson, T. Zubkov, E. G. Goralski, S. D. Walck and J. T. Yates, J. Phys. Chem. B, 108
(2004) 6004–6008.
25 J. F. Ziegler, M. D. Ziegler, and J. P. Biersack, Nucl. Instruments Methods Phys. Res. Sect. B, 268 (2010)
1818–1823.
26- The Stopping and Range of Ions in Matter, http://www.srim.org (accessed 05 November 2017).
27- J. H. Scofield, J. Electron Spectros. Relat. Phenomena, 8 (1976) 129–137.
28- M. P. Seah and W. A. Dench, Surf. Interface Anal., 1 (1979) 2–11. doi:10.1002/sia.740010103
29- L. F. Zagonel, E. J. Mittemeijer, F. Alvarez, Material Science and Technology 25 (2009) 726. doi:
10.1179/174328408X332780
30- L. F. Zagonel, C. A. Figueroa, R. Droppa Jr., F. Alvarez, Surf. and Coat. Technol, 201 (2006) 452.
doi:10.1016/j.surfcoat.2005.11.137
31- K. Thamaphat, P. Limsuwan, and B. Ngotawornchai, Nat. Sci., 42 (2008) 357–361.
32- S. Cucattia, E.A. Ochoa, M. Morales, R. Droppa Jr., J. Garcia, H.C. Pinto, L.F. Zagonel, D. Wisnivesky,
C.A. Figueroa, F. Alvarez, Materials Chemistry and Physics, 149–150 (2015) 261–269.
33- Y. P. Yu, W. Liu, S. X. Wu, and S. W. Li, J. Phys. Chem. C 116 (2012) 19625−19629.
34- M. a. Gillispie, M. F. a. M. van Hest, M. S. Dabney, J. D. Perkins, and D. S. Ginley, J.Mater. Res. 22
(2007) 2832–2837.
35- T. Hitosugi, Y. Furubayashi, A. Ueda, K. Itabashi, K. Inaba, Y. Hirose, G. Kinoda, Y. Yamamoto, T.
Shimada, and T. Hasegawa, Jpn. J. Appl. Phys. 44 (2005) L1063–L1065.
36- Klaus Ellmer, Nature Photonics, 6 (2012) 809–817. doi:10.1038/NPHOTON.2012.282
37- Ziad Y. Banyamin, Peter J. Kelly, Glen West and Jeffery Boardman, Coatings, 4 (2014) 732-746.
doi:10.3390/coatings4040732.
38- A. Muthukumar, G. Giusti, M. Jouvert, V. Consonni, D. Bellet, Thin Solid Films 545 (2013) 302–309.
39- Tadatsugu Minami, Semicond. Sci. Technol. 20 (2005) S35–S44.
40- N. F. Mott, Journal of Non-Crystalline Solids 1 (1968) 1.
41- L. Efros and B. I. Shklovskii, Journal of Physics C 8 (1975) 49.
42- R. Fromknecht et al., Nucl. Instrum. Methods Phys. Res. B 120 (1996) 252.
43- A. Yildiz et al., J. Non-Cryst Solids 354 (2008) 4944.
44- Y. L. Zhao et al., AIP Advances 2 (2012) 012129.
45- A. G. Zabrodskii and K. N. Zinoveva, Soviet Physics - JETP 59 (1984) 425.
46 J. I. Cisneros, APPLIED OPTICS, Vol. 37, No. 22, 1 August 1998
47- H. Tang, K. Prasad, R. Sanjinès, P. E. Schmid, and F. Lévy, Journal of Applied Physics 75, 2042 (1994);
48- M. Landmann, E. Rauls, and W. G. Schmidt, J. Phys. Condens. Matter, 24 (2012) 195503.
49- XIANG Xia, SHI Xiao-Yan, GAO Xiao-Lin, JI Fang,WANG Ya-Jun, LIU Chun-Ming, ZU Xiao-Tao, CHIN.
Phys. Lett. 29 (2012) 027801.
50- S. A. Chambers, S. H. Cheung, V. Shutthanandan, S. Thevuthasan, M. K. Bowman and A. G. Joly,
Chem. Phys., 339 (2007) 27–35.
51- M. Batzill, E. H. Morales and U. Diebold, PRL 96 (2006) 026103.
52- Heather M. Mirletz, Kelly A. Peterson, Ina T. Martin, Roger H. French; Solar Energy Materials & Solar
Cells 143 (2015) 529–538.
53- Tadatsugu Minami, Toshihiro Miyata, and Takashi Yamamoto J. Vac. Sci. Technol. A 17 (1999) 1822.
DOI: 10.1016/j.apsusc.2018.02.259