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Effect of Channel Profile Engineering on Hot Carrier Reliability in nMOSFETs with 100 nm Channel Lengths

Effect of Channel Profile Engineering on Hot Carrier Reliability in nMOSFETs with 100 nm Channel Lengths

MRS Proceedings, 1997
Abstract
ABSTRACTHot-carrier effect was studied for different channel doping profiles in nMOSFET devices with effective channel length near 100 nm using a device simulator. The test structures for device simulation were generated using gate oxide thickness of 3 nm. The channel doping profiles used were abrupt- and graded-retrograde types with low surface and high substrate concentrations, and conventional step profiles with high surface and low substrate concentrations. For accurate device simulation, a hydrodynamic model for semiconductors was used to simulate the non-local transport phenomena in the devices. The simulation results indicate that for ultra-short channel devices, the current drivability and the hot-carrier effects depend on the shape of channel doping profiles. For a given supply voltage, the hot-carrier effects in ultra-short channel devices can be controlled by optimizing the channel doping profiles.

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