Past year
All results
- All results
- Verbatim
Nov 27, 2023 · Novel Microfabrication & MEMS. Wafer-level vacuum packaging, monolithic device integration, 3D microstructures for vacuum microelectronics. More info. Design ...
Jul 23, 2024 · This paper introduces a cost-effective, high-performance approach to achieving wafer level vacuum packaging (WLVP) for MEMS-based uncooled infrared sensors.
Missing: Novel | Show results with:Novel
Jun 17, 2024 · CEA-Leti offers a competitive fan-out wafer-level packaging technology using 8” wafers. Based on the reconstruction of substrates around individual chips.
Apr 15, 2024 · This book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging.
Missing: Novel | Show results with:Novel
Nov 9, 2023 · We have developed a 5-in-1 fan-out wafer-level packaging (FOWLP) that integrates one fully operative artificial intelligence (AI) chip with approximately 2,500 ...
Jun 24, 2024 · This paper presents the design of a novel 3×3 piezoelectric micromirror array (PMMA) with an 84.6 % fill factor and describes a three-dimensional hidden ...
Jan 24, 2024 · Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging.
Mar 6, 2024 · Learn about silicon optical bench, mirror arrays, actuation, spatial light valves and micromirrors. Our novel wafer-level packaging (WLP) approach to ...
Jun 11, 2024 · FO-PLP excels in this area by offering the means to encapsulate diverse elements such as passive devices, multiple logic dies, and even MEMS sensors into a ...
Nov 17, 2023 · ICs and MEMS can be integrated using two methods, including hybrid multi-chip integration/ multi-chip solution and system-on-chip (SoC) integration/SoC ...
Missing: Novel | Show results with:Novel