In this paper, a novel wafer level packaging solution for microelectromechanical system (MEMS) device is reported. Microfabrication processes were developed ...
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In this paper, a novel wafer level packaging solution for microelectromechanical system (MEMS) device is reported. Microfabrication processes were developed ...
Nov 5, 2007 · To satisfy this demand, this paper presents a novel method for hermetic and near-vacuum packaging of MEMS devices. We use wafer-level bonding ...
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Bibliographic details on A Novel Wafer-Level Packaging Solution For Mems.
This paper introduces a robust and cost-effective solution for heterogeneous 3D integration. View. Show abstract. Note: High temperature pressure sensor for ...
A novel wafer level package strategy for RF MEMS is presented in this paper, considering the important issues such as the seal material, RF feedthrough and ...
The packaging process involves bonding a capping wafer to the MEMS wafer before dicing. This provides a stable and hermetically sealed environment for robust ...
A radio-frequency micro-electro-mechanical system (RF MEMS) wafer-level packaging (WLP) method using pre-patterned benzo-cyclo-butene (BCB) polymers with a ...
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This book provides the reader with useful and practical information on the modeling, simulation and integration of RF-MEMS, and it is particularly suitable for ...
This paper presents wafer-level packaging (WLP) solution for RF-MEMS applications based on through-wafer via (TWV) technology in high-resistivity silicon ...