Jul 11, 2024 · The 2025 conference will feature 4 keynote presentations, technical sessions on Heterogeneous: 2D and 3D Integration/Emerging Technologies/Fan-Out, Wafer/Panel ...
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Jul 6, 2024 · Die stacking using 3D-wafer level packaging copper/polymer through-Si via technology and Cu/Sn interconnect bumping. Y Civale, DS Tezcan, HGG Philipsen, P ...
Jul 11, 2024 · (Invited) Wafer-level Packaging Platform for MEMS Sensor Applications. Hee ... (Invited)Novel Interconnect Processes for Advanced Semiconductor Packaging.
Jul 18, 2024 · Figure 4 depicts a high-level overview of the proposed solution in place of ... level, wafer level, product ID, etc.). The component data used for this ...
ISE Labs Expands Capabilities, Doubles Lab Space with Opening ...
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Jul 11, 2024 · ... solutions for IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level packaging, flip chip ...
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Jul 5, 2024 · Wafer Level Packaging of MEMS · TriPleX integrated photonics for optical MEMS ... A picture of a custom packaging for a specific opto-fluidic solution for cell ...
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Jul 19, 2024 · Furthermore, THD is lower than 3.0% from 1.0 kHz to 8.9 kHz. A promising solution of piezoelectric MEMS speaker for in-ear applications is demonstrated in this ...
Jul 18, 2024 · Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions for semiconductor... Trymax Wafer Level Packaging DCP™ Plasma Treatment. Apr ...
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Jul 23, 2024 · Current designs rely on planar wafer- or chip-level integration, which is limited by pressure range, chip size, and low reliability. We propose a small-size ...
Jul 11, 2024 · Wafer Level Packaging of MEMS · TriPleX integrated photonics for optical MEMS ... A picture of a custom packaging for a specific opto-fluidic solution for cell ...
Missing: Novel | Show results with:Novel