High Density Embedded 3D Stackable Via RRAM in Advanced MCU Applications. Abstract: An innovative 3D stackable wing-shaped Via RRAM is firstly proposed ...
The new 3D stackable RRAM is fully compatible with the pure FinFET logic process without extra mask and process for embedded MCU applications [3]. The unit Via ...
High Density Embedded 3D Stackable Via RRAM in Advanced MCU Applications ... A New High Density 3D Stackable Via RRAM for Computing-in-Memory SOC Applications.
Mar 28, 2024 · High Density Embedded 3D Stackable Via RRAM in Advanced MCU Applications. Conference Paper. Jun 2023. Yao-Hung Huang · Yu-Cheng Hsieh · Yu-Cheng ...
Download Citation | High-Density Embedded 3-D Stackable Via RRAM in 16 ... High Density Embedded 3D Stackable Via RRAM in Advanced MCU Applications.
High Density Embedded 3D Stackable Via RRAM in Advanced MCU Applications. VLSI Technology and Circuits 2023: 1-2; 2021. [c2]. view. electronic edition via DOI ...
Apr 25, 2024 · High Density Embedded 3D Stackable Via RRAM in Advanced MCU Applications. ... Dynamic pH Sensor with Embedded Calibration Scheme by Advanced ...
An ultra-low-voltage MCU featuring single-rail SRAM was developed using 22 nm FDX technology and an adaptive reverse body bias scheme, achieving a leakage power ...
Jul 30, 2021 · Panasonic realized an embedded application of RRAM on MCU in 2013. ... Demonstration of 3D vertical RRAM with ultra-low-leakage, high ...
Missing: Via | Show results with:Via
Jan 18, 2024 · A Memory Device With MoS2 Channel For High-Density 3D NAND Flash ... Derrick Meyer on Higher Automotive MCU Performance With Interface IP ...
We're smart, efficient, and great to work with! Clients: Google · Airbus · MIT. Excellent Track Record. World Class R&D.