Optoelectronic Fusion Technology
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".
Deadline for manuscript submissions: 31 December 2024 | Viewed by 228
Special Issue Editors
Interests: silicon photonic devices and integration; photonic signal processing and applications; transmission, switching and sensing photonics
Special Issues, Collections and Topics in MDPI journals
Interests: microwave photonics integration; optoelectronic fusion; thin-film lithium niobate devices and integration
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The advancement of information technology hinges on breakthroughs in both microelectronics and optoelectronics. After decades of independent progress, both fields have shown their limitations. Integrating microelectronics and optoelectronics can harness the mature processes and functions of microelectronics, with the ultra-wideband and low-power benefits of optoelectronics. This integration addresses challenges like high-speed, low-power consumption and intelligence, driving the evolution of future chips and information networks. It will allow for the multi-functional integration of communications, sensing, and computing chips, as well as optoelectronic intelligent chips, promoting innovation in ultra-broadband optical networks, satellite communications, artificial intelligence, etc. Accordingly, this Special Issue aims to present research papers, communications, and review articles focusing on heterogeneous multi-dimensional fusion integration, optoelectronic fusion collaborative simulation analysis, high-quality optoelectronic chip wafer-level preparation, packaging, and testing, optoelectronic fusion intelligent information processing, perception, computing, and other core optoelectronic fusion technologies.
Prof. Dr. Jianping Chen
Prof. Dr. Sha Zhu
Guest Editors
Manuscript Submission Information
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Keywords
- optoelectronic chip
- optoelectronic fusion technology
- heterogeneous integration
- wafer-level chip fabrication, packaging and testing
- intelligent information processing, perception, and computing
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