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33 pages, 9944 KiB  
Article
An Experimental Investigation of Noise Sources’ Contribution in the Multi-Chip Module Open-Loop Comb-Drive Capacitive MEMS Accelerometer
by Mariusz Jankowski, Michał Szermer, Piotr Zając, Piotr Amrozik, Cezary Maj, Jacek Nazdrowicz, Grzegorz Jabłoński and Bartosz Sakowicz
Electronics 2024, 13(13), 2599; https://doi.org/10.3390/electronics13132599 - 2 Jul 2024
Viewed by 2292
Abstract
The paper presents the noise analysis of a MEMS and ASIC readout integrated circuit (ROIC) constituting the accelerometer developed in the frame of the InnoReh project, aiming at the development of methods for monitoring patients with imbalance disorders. Several experiments were performed at [...] Read more.
The paper presents the noise analysis of a MEMS and ASIC readout integrated circuit (ROIC) constituting the accelerometer developed in the frame of the InnoReh project, aiming at the development of methods for monitoring patients with imbalance disorders. Several experiments were performed at different temperatures and in different configurations: ROIC alone, ROIC with emulated parasitic capacitances, MEMS and ROIC in separate packages, and MEMS and ROIC in a single package. Many noise/interference sources were considered. The results obtained experimentally were compared to the results of theoretical investigations and were within the same order of magnitude, although in practice, the observed noise was always greater than the theoretical estimation. The paper also includes an in-depth analysis to explain these differences. Moreover, it is argued that, in terms of noise, the MEMS sensing element, and not the ROIC, is the quality-limiting factor. Full article
(This article belongs to the Section Microelectronics)
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14 pages, 7568 KiB  
Article
A Dynamic Range Preservation Readout Integrated Circuit for Multi-Gas Sensor Array Applications
by Soon-Kyu Kwon and Hyeon-June Kim
Chemosensors 2024, 12(4), 60; https://doi.org/10.3390/chemosensors12040060 - 9 Apr 2024
Viewed by 1120
Abstract
This study introduces a readout integrated circuit (ROIC) tailored for multi-gas sensor arrays featuring a proposed baseline calibration scheme aimed at mitigating the issue of sensor baseline variation. Unlike previous approaches, the proposed scheme stores each sensor’s baseline value and dynamically updates the [...] Read more.
This study introduces a readout integrated circuit (ROIC) tailored for multi-gas sensor arrays featuring a proposed baseline calibration scheme aimed at mitigating the issue of sensor baseline variation. Unlike previous approaches, the proposed scheme stores each sensor’s baseline value and dynamically updates the signal extraction range accordingly during ROIC operation. This adjustment allows for the optimal use of the ROIC’s dynamic range, enhancing sensor uniformity and accuracy without the need for complex additional circuitry or advanced post-processing algorithms. We fabricated a prototype ROIC using a 180 nm CMOS process, achieving a low power consumption of 0.43 mW and a conversion rate of 50 kSPS. The prototype boasts an integrated noise level of 9.9 μVRMS across a frequency range of 0.1 Hz to 5 kHz and a dynamic range of 142.6 dB, coupled with superior linearity, indicated by a maximum integral non-linearity (INL) of −75.71 dB. This design significantly reduces sensor offset scattering to within 1 LSB of the A/D reference scale. In this study, the efficacy of the proposed scheme was validated using Figaro TGS-2600. The ROIC targets a sensitivity range from 0.54 to 0.23 for gas concentrations ranging from 5 ppm to 20 ppm and a resolution of 39 Ω for sensor resistance range from 10 kΩ to 90 kΩ. The enhancements in performance make the proposed ROIC a promising solution for precise gas concentration detection in sensor applications. Full article
(This article belongs to the Section Electrochemical Devices and Sensors)
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13 pages, 4443 KiB  
Communication
A Thin-Film Pinned-Photodiode Imager Pixel with Fully Monolithic Fabrication and beyond 1Me- Full Well Capacity
by Joo Hyoung Kim, Francois Berghmans, Abu Bakar Siddik, Irem Sutcu, Isabel Pintor Monroy, Jehyeok Yu, Tristan Weydts, Epimitheas Georgitzikis, Jubin Kang, Yannick Baines, Yannick Hermans, Naresh Chandrasekaran, Florian De Roose, Griet Uytterhoeven, Renaud Puybaret, Yunlong Li, Itai Lieberman, Gauri Karve, David Cheyns, Jan Genoe, Paweł E. Malinowski, Paul Heremans, Kris Myny, Nikolas Papadopoulos and Jiwon Leeadd Show full author list remove Hide full author list
Sensors 2023, 23(21), 8803; https://doi.org/10.3390/s23218803 - 29 Oct 2023
Viewed by 2184
Abstract
Thin-film photodiodes (TFPD) monolithically integrated on the Si Read-Out Integrated Circuitry (ROIC) are promising imaging platforms when beyond-silicon optoelectronic properties are required. Although TFPD device performance has improved significantly, the pixel development has been limited in terms of noise characteristics compared to the [...] Read more.
Thin-film photodiodes (TFPD) monolithically integrated on the Si Read-Out Integrated Circuitry (ROIC) are promising imaging platforms when beyond-silicon optoelectronic properties are required. Although TFPD device performance has improved significantly, the pixel development has been limited in terms of noise characteristics compared to the Si-based image sensors. Here, a thin-film-based pinned photodiode (TF-PPD) structure is presented, showing reduced kTC noise and dark current, accompanied with a high conversion gain (CG). Indium-gallium-zinc oxide (IGZO) thin-film transistors and quantum dot photodiodes are integrated sequentially on the Si ROIC in a fully monolithic scheme with the introduction of photogate (PG) to achieve PPD operation. This PG brings not only a low noise performance, but also a high full well capacity (FWC) coming from the large capacitance of its metal-oxide-semiconductor (MOS). Hence, the FWC of the pixel is boosted up to 1.37 Me- with a 5 μm pixel pitch, which is 8.3 times larger than the FWC that the TFPD junction capacitor can store. This large FWC, along with the inherent low noise characteristics of the TF-PPD, leads to the three-digit dynamic range (DR) of 100.2 dB. Unlike a Si-based PG pixel, dark current contribution from the depleted semiconductor interfaces is limited, thanks to the wide energy band gap of the IGZO channel material used in this work. We expect that this novel 4 T pixel architecture can accelerate the deployment of monolithic TFPD imaging technology, as it has worked for CMOS Image sensors (CIS). Full article
(This article belongs to the Section Sensing and Imaging)
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12 pages, 4227 KiB  
Article
The Design of a Low-Noise, High-Speed Readout-Integrated Circuit for Infrared Focal Plane Arrays
by Yusong Mu, Zilong Zhao, Chong Chen, Di Yuan, Jing Wang, Hansong Gao and Yaodan Chi
Sensors 2023, 23(21), 8715; https://doi.org/10.3390/s23218715 - 25 Oct 2023
Cited by 1 | Viewed by 2069
Abstract
This paper describes the design of a low-noise, high-speed readout-integrated circuit for use in InGaAs infrared focal plane arrays, and analyzes the working principle and noise index of the pixel circuit in detail. The design fully considers the dynamic range, noise, and power [...] Read more.
This paper describes the design of a low-noise, high-speed readout-integrated circuit for use in InGaAs infrared focal plane arrays, and analyzes the working principle and noise index of the pixel circuit in detail. The design fully considers the dynamic range, noise, and power consumption of the pixel circuit in which a capacitance transimpedance amplifier structure is adopted as the input stage circuit, and chip fabrication via an XFAB 0.18 µm CMOS process is successfully realized. The ROIC adopts monolithic integration and implements various functions, such as windowing, subsampling, and different integration and readout modes. The ROIC reached an array scale of 32 × 32, a frame rate of 100 Hz, and a readout rate of 20 Mbps with an analog power consumption of less than 52 mW. The measurement results show that the input reference noise can be reduced to 143 e- via the CDS, and the fully customized scheme has certain advantages in the research of high-performance ROICs. Full article
(This article belongs to the Special Issue Advanced CMOS Integrated Circuit Design and Application II)
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14 pages, 7797 KiB  
Article
High-Linearity and High-Speed ROIC of Ultra-Large Array Infrared Detectors Based on Adaptive Compensation and Enhancement
by Zhongjie Guo, Bin Wang, Suiyang Liu, Ruiming Xu and Ningmei Yu
Sensors 2023, 23(12), 5667; https://doi.org/10.3390/s23125667 - 17 Jun 2023
Cited by 3 | Viewed by 1600
Abstract
In order to solve the problem of limited linearity and frame rate in the large array infrared (IR) readout integrated circuit (ROIC), a high-linearity and high-speed readout method based on adaptive offset compensation and alternating current (AC) enhancement is proposed in this paper. [...] Read more.
In order to solve the problem of limited linearity and frame rate in the large array infrared (IR) readout integrated circuit (ROIC), a high-linearity and high-speed readout method based on adaptive offset compensation and alternating current (AC) enhancement is proposed in this paper. The efficient correlated double sampling (CDS) method in pixels is used to optimize the noise characteristics of the ROIC and output CDS voltage to the column bus. An AC enhancement method is proposed to quickly establish the column bus signal, and an adaptive offset compensation method is used at the column bus terminal to eliminate the nonlinearity caused by the pixel source follower (SF). Based on the 55 nm process, the proposed method is comprehensively verified in an 8192 × 8192 IR ROIC. The results show that, compared with the traditional readout circuit, the output swing is increased from 2 V to 3.3 V, and the full well capacity is increased from 4.3 Me- to 6 Me-. The row time of the ROIC is reduced from 20 µs to 2 µs, and the linearity is improved from 96.9% to 99.98%. The overall power consumption of the chip is 1.6 W, and the single-column power consumption of the readout optimization circuit is 33 μW in the accelerated readout mode and 16.5 μW in the nonlinear correction mode. Full article
(This article belongs to the Section Sensing and Imaging)
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24 pages, 378 KiB  
Article
Sound Corporate Governance and Financial Performance: Is There a Link? Evidence from Manufacturing Companies in South Africa, Nigeria, and Ghana
by Leviticus Mensah and Murad Abdurahman Bein
Sustainability 2023, 15(12), 9263; https://doi.org/10.3390/su15129263 - 8 Jun 2023
Cited by 6 | Viewed by 3243
Abstract
The study aimed to compare the effect of sound corporate governance on manufacturing companies in South Africa, Nigeria, and Ghana on financial performance. The study used a purposive sampling method to select 60 manufacturing companies, of which twenty-nine (29) were from South Africa, [...] Read more.
The study aimed to compare the effect of sound corporate governance on manufacturing companies in South Africa, Nigeria, and Ghana on financial performance. The study used a purposive sampling method to select 60 manufacturing companies, of which twenty-nine (29) were from South Africa, 17 were from Nigeria, and 14 were from Ghana. The study employed GMM and FMOLS to estimate the effect of corporate governance on the firm’s financial performance. According to the study, South Africa has the longest average board tenure at 7.85 years, followed by Nigeria at 4.7 years and Ghana at 3.9 years. The average board tenure was found to have a positive and statistically significant effect on the return on invested capital (ROIC) of the firms in South Africa and Ghana, and a positive and statistically insignificant effect was found for the firms in Nigeria. The study indicated that the firms in South Africa have the highest percentage of female directors at 24.26%, followed by Ghana at 17.8% and Nigeria at 17.3%. The study showed that female representation on the corporate board has a positive and statistically significant effect on all firms’ return on net operating assets (RONOA). The study provides policy implications for shareholders, boards of directors, and other stakeholders by enabling them to build confidence in the corporate governance structure of manufacturing companies in the three countries. Full article
(This article belongs to the Special Issue Corporate Governance for Sustainable Finance)
18 pages, 5053 KiB  
Article
Sound Activity Monitor Circuit for Low Power Consumption of Always-On Microphone Applications
by Jong Pal Kim
Appl. Sci. 2022, 12(23), 11947; https://doi.org/10.3390/app122311947 - 23 Nov 2022
Viewed by 2035
Abstract
A novel sound activity monitor (SAM) circuit for low power consumption of always-on microphone applications is presented. To reduce average power consumption, the ultra-low-power SAM is essential and operates a readout integrated circuit (ROIC) in low power mode with silent input or in [...] Read more.
A novel sound activity monitor (SAM) circuit for low power consumption of always-on microphone applications is presented. To reduce average power consumption, the ultra-low-power SAM is essential and operates a readout integrated circuit (ROIC) in low power mode with silent input or in normal power mode with voice input. A novel SAM with an architecture that does not include an envelope detector is proposed to achieve low power consumption. A new architecture is also proposed to improve MEMS sensitivity by connecting the SAM input to the source follower (SF) output instead of connecting the SAM input to the MEMS port already connected to the SF. In addition, in order to prevent inefficient frequent operation mode conversion, a feature of delaying the transition to the low-power mode after the sound is silenced is implemented. The proposed architecture is designed and verified based on the standard 0.18 µm CMOS process. The SAM, which consists of two-stage amplifiers (OA, AMP2), comparators, and a logic circuit, consumes a 1 µA current. The analog path consisting of SF, OA, and AMP2 in low power mode has a maximum amplification gain of 63 dB and a noise of 72 nVrms/√Hz at 1 kHz. Full article
(This article belongs to the Special Issue Selected Papers from IMETI 2021)
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15 pages, 2684 KiB  
Article
Single Snapshot Imaging of Optical Properties (SSOP) for Perfusion Assessment during Gastric Conduit Creation for Esophagectomy: An Experimental Study on Pigs
by Lorenzo Cinelli, Eric Felli, Luca Baratelli, Silvère Ségaud, Andrea Baiocchini, Nariaki Okamoto, María Rita Rodríguez-Luna, Ugo Elmore, Riccardo Rosati, Stefano Partelli, Jacques Marescaux, Sylvain Gioux and Michele Diana
Cancers 2021, 13(23), 6079; https://doi.org/10.3390/cancers13236079 - 2 Dec 2021
Cited by 5 | Viewed by 2019
Abstract
Anastomotic leakage (AL) is a serious complication occurring after esophagectomy. The current knowledge suggests that inadequate intraoperative perfusion in the anastomotic site contributes to an increase in the AL rate. Presently, clinical estimation undertaken by surgeons is not accurate and new technology is [...] Read more.
Anastomotic leakage (AL) is a serious complication occurring after esophagectomy. The current knowledge suggests that inadequate intraoperative perfusion in the anastomotic site contributes to an increase in the AL rate. Presently, clinical estimation undertaken by surgeons is not accurate and new technology is necessary to improve the intraoperative assessment of tissue oxygenation. In the present study, we demonstrate the application of a novel optical technology, namely Single Snapshot imaging of Optical Properties (SSOP), used to quantify StO2% in an open surgery experimental gastric conduit (GC) model. After the creation of a gastric conduit, local StO2% was measured with a preclinical SSOP system for 60 min in the antrum (ROI-A), corpus (ROI-C), and fundus (ROI-F). The removed region (ROI-R) acted as ischemic control. ROI-R had statistically significant lower StO2% when compared to all other ROIs at T15, T30, T45, and T60 (p < 0.0001). Local capillary lactates (LCLs) and StO2% correlation was statistically significant (R = −0.8439, 95% CI −0.9367 to −0.6407, p < 0.0001). Finally, SSOP could discriminate resected from perfused regions and ROI-A from ROI-F (the future anastomotic site). In conclusion, SSOP could well be a suitable technology to assess intraoperative perfusion of GC, providing consistent StO2% quantification and ROIs discrimination. Full article
(This article belongs to the Special Issue New Technologies and Advancements in Gastro-Esophageal Cancer Surgery)
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20 pages, 13614 KiB  
Article
Readout Integrated Circuit for Small-Sized and Low-Power Gas Sensor Based on HEMT Device
by Seungjun Lee, Joohwan Jin, Jihyun Baek, Juyong Lee and Hyungil Chae
Sensors 2021, 21(16), 5637; https://doi.org/10.3390/s21165637 - 21 Aug 2021
Cited by 8 | Viewed by 3312
Abstract
This paper presents a small-sized, low-power gas sensor system combining a high-electron-mobility transistor (HEMT) device and readout integrated circuit (ROIC). Using a semiconductor-based HEMT as a gas-sensing device, it is possible to secure high sensitivity, reduced complexity, low power, and small size of [...] Read more.
This paper presents a small-sized, low-power gas sensor system combining a high-electron-mobility transistor (HEMT) device and readout integrated circuit (ROIC). Using a semiconductor-based HEMT as a gas-sensing device, it is possible to secure high sensitivity, reduced complexity, low power, and small size of the ROIC sensor system. Unlike existing gas sensors comprising only HEMT elements, the proposed sensor system has both an ROIC and a digital controller and can control sensor operation through a simple calibration process with digital signal processing while maintaining constant performance despite variations. The ROIC mainly consists of a transimpedance amplifier (TIA), a negative-voltage generator, and an analog-to-digital converter (ADC) and is designed to match a minimum target detection unit of 1 ppm for hydrogen. The prototype ROIC for the HEMT presented herein was implemented in a 0.18 µm complementary metal–oxide–semiconductor (CMOS) process. The total measured power consumption and detection unit of the proposed ROIC for hydrogen gas were 3.1 mW and 2.6 ppm, respectively. Full article
(This article belongs to the Section Physical Sensors)
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19 pages, 4698 KiB  
Review
Low-Cost Microbolometer Type Infrared Detectors
by Le Yu, Yaozu Guo, Haoyu Zhu, Mingcheng Luo, Ping Han and Xiaoli Ji
Micromachines 2020, 11(9), 800; https://doi.org/10.3390/mi11090800 - 24 Aug 2020
Cited by 45 | Viewed by 8380
Abstract
The complementary metal oxide semiconductor (CMOS) microbolometer technology provides a low-cost approach for the long-wave infrared (LWIR) imaging applications. The fabrication of the CMOS-compatible microbolometer infrared focal plane arrays (IRFPAs) is based on the combination of the standard CMOS process and simple post-CMOS [...] Read more.
The complementary metal oxide semiconductor (CMOS) microbolometer technology provides a low-cost approach for the long-wave infrared (LWIR) imaging applications. The fabrication of the CMOS-compatible microbolometer infrared focal plane arrays (IRFPAs) is based on the combination of the standard CMOS process and simple post-CMOS micro-electro-mechanical system (MEMS) process. With the technological development, the performance of the commercialized CMOS-compatible microbolometers shows only a small gap with that of the mainstream ones. This paper reviews the basics and recent advances of the CMOS-compatible microbolometer IRFPAs in the aspects of the pixel structure, the read-out integrated circuit (ROIC), the focal plane array, and the vacuum packaging. Full article
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31 pages, 826 KiB  
Article
Does Water, Waste, and Energy Consumption Influence Firm Performance? Panel Data Evidence from S&P 500 Information Technology Sector
by Liliana Nicoleta Simionescu, Ștefan Cristian Gherghina, Ziad Sheikha and Hiba Tawil
Int. J. Environ. Res. Public Health 2020, 17(14), 5206; https://doi.org/10.3390/ijerph17145206 - 19 Jul 2020
Cited by 7 | Viewed by 4420
Abstract
This paper aimed to investigate the impact of water, waste, and energy consumption on firm performance for a sample of enterprises that belong to the S&P 500 Information Technology sector over the period of 2009–2020. The quantitative framework covered both accounting (e.g., return [...] Read more.
This paper aimed to investigate the impact of water, waste, and energy consumption on firm performance for a sample of enterprises that belong to the S&P 500 Information Technology sector over the period of 2009–2020. The quantitative framework covered both accounting (e.g., return on assets—ROA; return on common equity—ROE; return on capital—ROC; return on invested capital—ROIC) and market-based measures of performance (e.g., price-to-book value—PB), alongside firm and corporate governance specific variables. By estimating multivariate panel data regression models, the empirical results provided support for a negative impact of total water use on PB but a positive effect on ROA. With reference to the total waste, the econometric outcomes revealed a negative influence on the entire selected performance measures, whereas total energy consumption did not reveal any statistically significant influence. Full article
(This article belongs to the Special Issue Sustainable Consumption in Environmental Issues: A Global Perspective)
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14 pages, 6630 KiB  
Article
Wafer-Level-Based Open-Circuit Sensitivity Model from Theoretical ALEM and Empirical OSCM Parameters for a Capacitive MEMS Acoustic Sensor
by Jaewoo Lee, Jong-Pil Im, Jeong-Hun Kim, Sol-Yee Lim and Seung-Eon Moon
Sensors 2019, 19(3), 488; https://doi.org/10.3390/s19030488 - 25 Jan 2019
Cited by 1 | Viewed by 4689
Abstract
We present a simple, accurate open-circuit sensitivity model based on both analytically calculated lumped and empirically extracted lumped-parameters that enables a capacitive acoustic sensor to be efficiently characterized in the frequency domain at the wafer level. Our mixed model is mainly composed of [...] Read more.
We present a simple, accurate open-circuit sensitivity model based on both analytically calculated lumped and empirically extracted lumped-parameters that enables a capacitive acoustic sensor to be efficiently characterized in the frequency domain at the wafer level. Our mixed model is mainly composed of two key strategies: the approximately linearized electric-field method (ALEM) and the open- and short-calibration method (OSCM). Analytical ALEM can separate the intrinsic capacitance from the capacitance of the acoustic sensor itself, while empirical OSCM, on the basis of one additional test sample excluding the membrane, can extract the capacitance value of the active part from the entire sensor chip. FEM simulation verified the validity of the model within an error range of 2% in the unit cell. Dynamic open-circuit sensitivity is modelled from lumped parameters based on the equivalent electrical circuit, leading to a modelled resonance frequency under a bias condition. Thus, eliminating a complex read-out integrated circuit (ROIC) integration process, this mixed model not only simplifies the characterization process, but also improves the accuracy of the sensitivity because it considers the fringing field effect between the diaphragm and each etching hole in the back plate. Full article
(This article belongs to the Special Issue Eurosensors 2018 Selected Papers)
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13 pages, 6673 KiB  
Article
An Analog-Front ROIC with On-Chip Non-Uniformity Compensation for Diode-Based Infrared Image Sensors
by Mao Ye, Gongyuan Zhao, Yao Li and Yiqiang Zhao
Sensors 2019, 19(2), 298; https://doi.org/10.3390/s19020298 - 13 Jan 2019
Cited by 4 | Viewed by 5164
Abstract
This paper proposes a CMOS front-end readout-integrated circuit (ROIC) with on-chip non-uniformity compensation technique for a diode-based uncooled infrared image sensor. Two techniques are adopted to achieve on-chip non-uniformity compensation: a reference dummy metal line is introduced to alleviate the dominant non-uniformity with [...] Read more.
This paper proposes a CMOS front-end readout-integrated circuit (ROIC) with on-chip non-uniformity compensation technique for a diode-based uncooled infrared image sensor. Two techniques are adopted to achieve on-chip non-uniformity compensation: a reference dummy metal line is introduced to alleviate the dominant non-uniformity with IR-drop presented in large pixel array, and a current splitting architecture-based variable current source for diode bias is proposed to compensate other residual non-uniformity. A differential integrator is chosen as the main amplifier of readout circuit for its superior noise performance. For low power design, a pulse-powered row buffer is designed in this work. The proposed ROIC for 384 × 288 diode-based detector array is fabricated with a 0.35- μ m CMOS process. It occupies an area of 4.4 mm × 15 mm, and the power consumption is 180 mW. The measured result shows that with the proposed on-chip non-uniformity compensation, the output voltage variation is greatly reduced from 2.5 V to 60 mV. Full article
(This article belongs to the Special Issue Advanced CMOS Image Sensors and Emerging Applications)
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12 pages, 2590 KiB  
Review
Update of Single Event Effects Radiation Hardness Assurance of Readout Integrated Circuit of Infrared Image Sensors at Cryogenic Temperature
by Laurent Artola, Ahmad Al Youssef, Samuel Ducret, Franck Perrier, Raphael Buiron, Olivier Gilard, Julien Mekki, Mathieu Boutillier, Guillaume Hubert and Christian Poivey
Sensors 2018, 18(7), 2338; https://doi.org/10.3390/s18072338 - 18 Jul 2018
Cited by 6 | Viewed by 4215
Abstract
This paper review presents Single Event Effects (SEE) irradiation tests under heavy ions of the test-chip of D-Flip-Flop (DFF) cells and complete readout integrated circuits (ROIC) as a function of temperature, down to 50 K. The analyses of the experimental data are completed [...] Read more.
This paper review presents Single Event Effects (SEE) irradiation tests under heavy ions of the test-chip of D-Flip-Flop (DFF) cells and complete readout integrated circuits (ROIC) as a function of temperature, down to 50 K. The analyses of the experimental data are completed using the SEE prediction tool MUSCA SEP3. The conclusions derived from the experimental measurements and related analyses allow to update the current SEE radiation hardness assurance (RHA) for readout integrated circuits of infrared image sensors used at cryogenic temperatures. The current RHA update is performed on SEE irradiation tests at room temperature, as opposed to the operational cryogenic temperature. These tests include SET (Single Event Transient), SEU (Single Event Upset) and SEFI (Single Event Functional Interrupt) irradiation tests. This update allows for reducing the cost of ROIC qualifications and the test setup complexity for each space mission. Full article
(This article belongs to the Special Issue Sensors and Materials for Harsh Environments)
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11 pages, 4763 KiB  
Article
High Accuracy Open-Type Current Sensor with a Differential Planar Hall Resistive Sensor
by Sungho Lee, Sungmin Hong, Wonki Park, Wonhyo Kim, Jaehoon Lee, Kwangho Shin, Cheol-Gi Kim and Daesung Lee
Sensors 2018, 18(7), 2231; https://doi.org/10.3390/s18072231 - 12 Jul 2018
Cited by 14 | Viewed by 5392
Abstract
In this paper, we propose a high accuracy open-type current sensor with a differential Planar Hall Resistive (PHR) sensor. Conventional open-type current sensors with magnetic sensors are usually vulnerable to interference from an external magnetic field. To reduce the effect of an unintended [...] Read more.
In this paper, we propose a high accuracy open-type current sensor with a differential Planar Hall Resistive (PHR) sensor. Conventional open-type current sensors with magnetic sensors are usually vulnerable to interference from an external magnetic field. To reduce the effect of an unintended magnetic field, the proposed design uses a differential structure with PHR. The differential structure provides robust performance to unwanted magnetic flux and increased magnetic sensitivity. In addition, instead of conventional Hall sensors with a magnetic concentrator, a newly developed PHR with high sensitivity is employed to sense horizontal magnetic fields. The PHR sensor and read-out integrated circuit (IC) are integrated through a post-Complementary metal-oxide-semiconductor (CMOS) process using multi-chip packaging. The current sensor is designed to measure a 1 A current level. The measured performance of the designed current sensor has a 16 kHz bandwidth and a current nonlinearity of under ±0.5%. Full article
(This article belongs to the Section Physical Sensors)
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