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    Ic - MCQ

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    etasuresh
    The document discusses key aspects of monolithic integrated circuits (ICs) including that they consist of both active and passive components, their performance depends on the substrate, oxidation is used for isolation, doping involves adding impurities to change semiconductor properties, metallization provides interconnection between components, packaging provides protection and safety, testing checks reliability and quality, optical masking enables pattern transfer during etching which selectively removes unwanted surface areas, system on chips include both analog and digital circuits, advantages are small size, low cost and high packing density, and inductors cannot be integrated on-chip.

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    Ic - MCQ

    Uploaded by

    etasuresh
    770 views6 pages
    The document discusses key aspects of monolithic integrated circuits (ICs) including that they consist of both active and passive components, their performance depends on the substrate, oxidation is used for isolation, doping involves adding impurities to change semiconductor properties, metallization provides interconnection between components, packaging provides protection and safety, testing checks reliability and quality, optical masking enables pattern transfer during etching which selectively removes unwanted surface areas, system on chips include both analog and digital circuits, advantages are small size, low cost and high packing density, and inductors cannot be integrated on-chip.

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    ic -mcq

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    The document discusses key aspects of monolithic integrated circuits (ICs) including that they consist of both active and passive components, their performance depends on the substrate, oxidation is used for isolation, doping involves adding impurities to change semiconductor properties, metallization provides interconnection between components, packaging provides protection and safety, testing checks reliability and quality, optical masking enables pattern transfer during etching which selectively removes unwanted surface areas, system on chips include both analog and digital circuits, advantages are small size, low cost and high packing density, and inductors cannot be integrated on-chip.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as DOC, PDF, TXT or read online from Scribd
    Download as doc, pdf, or txt
    770 views6 pages

    Ic - MCQ

    Uploaded by

    etasuresh
    The document discusses key aspects of monolithic integrated circuits (ICs) including that they consist of both active and passive components, their performance depends on the substrate, oxidation is used for isolation, doping involves adding impurities to change semiconductor properties, metallization provides interconnection between components, packaging provides protection and safety, testing checks reliability and quality, optical masking enables pattern transfer during etching which selectively removes unwanted surface areas, system on chips include both analog and digital circuits, advantages are small size, low cost and high packing density, and inductors cannot be integrated on-chip.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as DOC, PDF, TXT or read online from Scribd
    Download as doc, pdf, or txt
    of 6

    onolithic IC consists of: Both active and passive components Your Answer:

    2.
    In Monolithic IC: Performance depends on the substrate Your Answer:

    3.
    Oxidation is used for: Isolation Your Answer:

    4.
    Doping means: Addition of impurity material in semiconductor band structure Your Answer:

    5.
    Metallization is used for: Interconnection Your Answer:

    6.
    Packaging is used for: (c) Both (a) and (b) Your Answer:

    7.
    Testing is used for:

    (c) Both (a) and (b) Your Answer:

    8.
    Optical masking is used: Pattern transfer Your Answer:

    9.
    Etching is used for: Selective removal of the unwanted surface Your Answer:

    10.
    System on chip means: It consists of both analog and digital IC Your Answer:

    11.
    Advantages of IC are: Your Answer: (blank)

    12.
    Inductor design in an IC: Is not possible Your Answer:

    Monolithic IC consist s of:


    Active components

    Passive components Both active and passive components None of the above

    In Monolithic IC:
    Performance depends on the substrate Performance does not depend on the substrate Performance depends on interconnects Performance depends on packaging

    Oxidation is used for:


    Isolation Interconnection Doping None of the above

    Doping means:
    Addition of impurity material in semiconductor band structure Removing of impurity material in semiconductor band structure Cleaning the surface None of the above

    Metallization is used for:


    Interconnection Protection Packaging None of the above

    Packaging is used for:


    (a) Protection (b) Safety (c) Both (a) and (b) (d) None of the above

    Testing is used for:


    (a) Checking reliability (b) Quality control (c) Both (a) and (b) (d) None of the above

    Optical masking is used:


    Pattern transfer Protection Cleaning None of the above

    Etching is used for:


    Selective removal of the unwanted surface Cleaning Interconnection None of the above

    System on chip means:


    It consists of both analog and digital IC Only analog IC Only digital IC None of the above

    Advantages of IC are:
    Small size Low cost Packing density high None of the above

    Inductor design in an IC:


    Is not possible Is possible Is possible with discrete components None of the above

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