This document provides the dimensions in millimeters for a 148-lead chip scale package ball grid array (CSP_BGA) integrated circuit. Key specifications include a 9.10mm x 9.00mm square form factor with 148 solder balls arranged in a grid array underneath, and ball diameter between 0.25mm to 1.40mm maximum. Tolerances are given for ball positioning, seating plane, and coplanarity.
This document provides the dimensions in millimeters for a 148-lead chip scale package ball grid array (CSP_BGA) integrated circuit. Key specifications include a 9.10mm x 9.00mm square form factor with 148 solder balls arranged in a grid array underneath, and ball diameter between 0.25mm to 1.40mm maximum. Tolerances are given for ball positioning, seating plane, and coplanarity.
This document provides the dimensions in millimeters for a 148-lead chip scale package ball grid array (CSP_BGA) integrated circuit. Key specifications include a 9.10mm x 9.00mm square form factor with 148 solder balls arranged in a grid array underneath, and ball diameter between 0.25mm to 1.40mm maximum. Tolerances are given for ball positioning, seating plane, and coplanarity.
This document provides the dimensions in millimeters for a 148-lead chip scale package ball grid array (CSP_BGA) integrated circuit. Key specifications include a 9.10mm x 9.00mm square form factor with 148 solder balls arranged in a grid array underneath, and ball diameter between 0.25mm to 1.40mm maximum. Tolerances are given for ball positioning, seating plane, and coplanarity.
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a 148-Lead Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-148) Dimensions shown in millimeters
9.10 A1 CORNER INDEX AREA 9.00 SQ 16 14 12 10 15 13 11 9 8 7 6 5 4 3 2 1 8.90 A B C D BALL A1 E PAD CORNER F 7.50 G BSC SQ H TOP VIEW J K L M N P R T
