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    BGA Reballing Jig With Vacuum

    Uploaded by

    lampropeltis
    This document describes a BGA reballing jig that uses vacuum to securely hold circuit boards in place for reballing. The jig features a collector box for excess solder balls, locating pins for precise alignment of the stencil, and a handle to separate the stencil from the board. It also includes an inlet for vacuum suction and interchangeable table plates to accommodate different types of BGAs. The reusable frame holds a stencil to apply paste or flux while excess solder balls escape through vents. This particular jig can hold nine BGAs using vacuum on its table plate.

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    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd

    BGA Reballing Jig With Vacuum

    Uploaded by

    lampropeltis
    114 views1 page
    This document describes a BGA reballing jig that uses vacuum to securely hold circuit boards in place for reballing. The jig features a collector box for excess solder balls, locating pins for precise alignment of the stencil, and a handle to separate the stencil from the board. It also includes an inlet for vacuum suction and interchangeable table plates to accommodate different types of BGAs. The reusable frame holds a stencil to apply paste or flux while excess solder balls escape through vents. This particular jig can hold nine BGAs using vacuum on its table plate.

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    © Attribution Non-Commercial (BY-NC)

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    This document describes a BGA reballing jig that uses vacuum to securely hold circuit boards in place for reballing. The jig features a collector box for excess solder balls, locating pins for precise alignment of the stencil, and a handle to separate the stencil from the board. It also includes an inlet for vacuum suction and interchangeable table plates to accommodate different types of BGAs. The reusable frame holds a stencil to apply paste or flux while excess solder balls escape through vents. This particular jig can hold nine BGAs using vacuum on its table plate.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    114 views1 page

    BGA Reballing Jig With Vacuum

    Uploaded by

    lampropeltis
    This document describes a BGA reballing jig that uses vacuum to securely hold circuit boards in place for reballing. The jig features a collector box for excess solder balls, locating pins for precise alignment of the stencil, and a handle to separate the stencil from the board. It also includes an inlet for vacuum suction and interchangeable table plates to accommodate different types of BGAs. The reusable frame holds a stencil to apply paste or flux while excess solder balls escape through vents. This particular jig can hold nine BGAs using vacuum on its table plate.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
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    BGA REBALLING JIG with vacuum

    Collector box for excess solderballs Locating pin for precision alignment to stencil Handle to push down to separate stencil from BGA vertically Inlet for vacuum Change table plate to suit different type of BGA

    Reuseable frame. Only change the stencil for different type of BGA

    Stencil for paste / flux application

    Escape for excess solderballs Stencil for solderballs replacement

    This table plate hold 9 BGA by vacuum

    AVI PRECISION ENGINEERING PTE LTD


    1, KALLANG SECTOR #04-03, SINGAPORE 349276. TEL: +65 67483866. FAX: +65 67484810. Email: avipre@avipre.com.sg, avipre@avipre.com, Company Reg No: 199300584M Web: http://www.avipre.com.sg Skype: avipre

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