This document summarizes the components of a sputtering system including a sputtering chamber, pumping system, vacuum gauges, manipulator, magnetrons, effusion cells, electron beam evaporator, quartz balance, gas dosing system, and accessories. The key components are a sputtering chamber equipped for magnetron sputtering, thermal deposition, and e-beam evaporation with various ports, a pumping system including a turbo pump and forepump, two magnetron sources, two effusion cells, an electron beam evaporator, a quartz thickness monitor, and a gas dosing system.
This document summarizes the components of a sputtering system including a sputtering chamber, pumping system, vacuum gauges, manipulator, magnetrons, effusion cells, electron beam evaporator, quartz balance, gas dosing system, and accessories. The key components are a sputtering chamber equipped for magnetron sputtering, thermal deposition, and e-beam evaporation with various ports, a pumping system including a turbo pump and forepump, two magnetron sources, two effusion cells, an electron beam evaporator, a quartz thickness monitor, and a gas dosing system.
This document summarizes the components of a sputtering system including a sputtering chamber, pumping system, vacuum gauges, manipulator, magnetrons, effusion cells, electron beam evaporator, quartz balance, gas dosing system, and accessories. The key components are a sputtering chamber equipped for magnetron sputtering, thermal deposition, and e-beam evaporation with various ports, a pumping system including a turbo pump and forepump, two magnetron sources, two effusion cells, an electron beam evaporator, a quartz thickness monitor, and a gas dosing system.
This document summarizes the components of a sputtering system including a sputtering chamber, pumping system, vacuum gauges, manipulator, magnetrons, effusion cells, electron beam evaporator, quartz balance, gas dosing system, and accessories. The key components are a sputtering chamber equipped for magnetron sputtering, thermal deposition, and e-beam evaporation with various ports, a pumping system including a turbo pump and forepump, two magnetron sources, two effusion cells, an electron beam evaporator, a quartz thickness monitor, and a gas dosing system.
1.1. 1 set Sputtering chamber 1.1.1. 1 set Vacuum Chamber in UHV standard, made of stainless steel, equipped with connecting flanges in UHV standard in different sizes for connecting current and further equipment. Base pressure 10 - 8 mbar. The chamber is equipped with a large, easy access vacuum door which is dual viton sealed with differential pumping in the seal interspace. This maintains an excellent base pressure whilst providing perfect internal access. The system employs efficient double wall water cooling throughout.
Including ports for: Magnetron (2xDN100CF) + Effusion Cell (2xDN40CF) + EBV source (2xDN40CF) Manipulator DN 160CF Pumping system, DN 160CF Gas dosing system, DN 40CF Large vacuum door with observation windows 1.1.2. 1 set Pumping System For create necessary vacuum conditions for sputtering measurements pumping system includes turbomolecular pump with pumping speed not less than 510 l/s and dry forevacuum pump with pumping speed 15 m 3 /h. Into the PLD chamber also installed special vacuum gauges allows pressure measurements.
SL700 turbo molecular pump (pumping speed for N 2 690 l/s) Scroll SC15D for forevacuum (pumping speed 15 m 3 /h) Tubing and wiring Safety valve and vent valve all electromagnetic PCU, electronic microprocessor pump control unit for operation pump group (forevacuum pumps, UHV-pumps), measurement electronics and electronic power units with vacuum inter-locks. 1.1.3. 1 set Chamber Vacuum Gauges 1.1.3.1 1 pcs PENINGVAC gauge PTR 90 (5x10 -9 mbar atm) with cable 1.1.3.2. 1 pcs Pirani gauge TTR91 (5x10 -4 mbar atm) with cable for forevacuum 1.1.4 1 set UHV Manipulator with manual shutter and water cooling, 2-axes for Sputtering Chamber 1.1.4.1. 1 pcs PTS-Z-Motion Module manual. Motorized upgrade possible any time. This module includes the Z-motion module. Travel length of Z-Motion Module is 50 mm. Z-Motion Specification: Resolution = 0.01 mm manual. 1.1.4.2. 1 pcs PTS-R1 continuous, primary rotation module R1 motorized
Resolution: 1 degree manual, 0.1 degree motorized, rotation speed: max. 20 rpm 1.1.4.3. 1 pcs PTS Sample receiving station for PTS sample holder (sample holder contained in point 1.6.1.)
Sample receiving station complete with all electrical and mechanical feedthroughs and connections (LEMO thermocouple), thermoelement material thermocouple type K
Cooling: water 1.1.4.4. 1 pcs Sample Heating Power Supply HEAT1-PS
Max Power Heating Standard: 600 W resistance heating Heater current Standard: 0 10A at max 30V Maximum: 0 20A at max 30V Temperature Range: 20C 2320C for thermocouple type C (dependent on sample holder type or evaporator) -200C 1250C for thermocouple K (dependent on sample holder type and the conditions in the chamber) Thermoelement type: Standard thermocouple type K and C (other thermocouple for order) Temperature control: Process temperature control with PID Controller
Internal mounting Target diameter 50,8 mm (2) Target thickness 16mm, non-ferromagnetic targets Ferromagnetic targets: Fe 1mm, Ni 2-3mm thick Target clamps and adjustable dark space shield (anode) SmCo magnet array, bakeable 200C Metal seals vacuum-to-air, He-leak rate <1x10 -9 mbar x l/s For DC, AC, RF and pulsed operation Cooling water requirements: 1 l/(min x kW), minimum 1 l/min PTFE water tubes 4/6mm 45-tilt with DN 16CF rotatable Chimney on top of magnetron CF100 flange assembly Gas tube with VCR-4 connector on CF16 Pneumatic shutter deflection angle 90 UHV rotary feedthrough on CF16, bakeable 200C RF-DC-connecting box with 7/16-jack 1.2.2. 1 pcs RF Power supply for magnetron source (Advanced Energy) with Matchbox (Advanced Energy)
Power: 300W. Frequency: 13,56 MHz. Interface: port/ RS232 1.2.3. 1 pcs DC Power Supply (Advanced Energy)
Air Cooling Power: 500W 1.3. Effusion cell EF 40C1 - set
1.2.1. 2 pcs Effusion cell EF 40C1 - is a UHV component designed for indirect resistive heating and getting highly constant evaporation rates
Heater: Ta wire Thermocouple: Type C (W/Re 5/26%) Typical operating temperature: 250 1500C Maximum outgasing temperature: 1600C Temperature stability: 1C Mounting flange: DN 40CF In-vacuum O.D.: 35 mm In-vacuum length: As specified Power consumption: ~300W Working distance: 100 150 mm Degassing without water: 500C Manual Shutter Crucible 1.3.2. 2 pcs Effusion Cell Power Supply HEAT1-PS is the power supply designed for heating sample on sample holder under clean UHV- conditions using resistance heating method (heater is located close to the sample which becomes hot)
Specification:
Max Power Heating Standard: 300W r (max 600W for order) Heater current Standard: 0 10A at max 30V Maximum: 0 20A at max 30V Temperature Range 20C 1500C for thermocouple type C (dependent on sample holder type or evaporator) - 200C 1250C for thermocouple K (dependent on sample holder type and the conditions in the chamber) Thermoelement type Standard thermocouple type K and C (other thermocouple for order) Temperature control Process temperature control with PID Controller Process parameters finds optimized process PID parameters with autotuning function. Ramp heating Ramp function of protects the sample against overheating Communication Interfaces EIA-232, 2 wire EIA-485 Dimensions 483 mm x 133 x 350 mm
1.4 Electron Beam Evaporator EBV 40A1-SET 1.4.1. 1 pcs EBV 40A1 is designed for thin film growth and molecular beam epitaxy.
Specification:
Outlet beam diameter for evaporated material : 4-19 mm Temperature range for evaporated materials : 160-2300C Electron energy : 0-1500 eV , (typically 600-800 eV) Max. power: 300W, Range of the filament current: typicaly 1,8-2,2 A: max 2,3 A
Evaporating rod diameter: option1: 0,5-2,5mm; step 0,5mm option 2: 2-6 mm, step 2mm Temperature monitor of the cooling cylinder: 0-100C, temperature of water - cooled copper cylinder Cooling system: Water flow > 0,5 l/min at temperature T = 30C on the end. Max pressure 6 bar Insertion depth.: min. 212 mm, OD: 34,8 mm Mounting flange: DN 40 CF Evaporating area: 5-20mm Recommended distance between end of the evaporator and a sample: approximately 70-75mm Fully bakeable: up to 250C Working distance: 25 75mm
1.4.2. 1 pcs Electron Beam Evaporator Power Supply EBV40A-PS
Specification: Beam energy: 0 1500eV, Filament current: 0-7,5A, resolution < 1V, ripple < 0,05A Operating modes: auto/manual Communication interfaces: without ( Option: RS232/485/422, USB, Profibus DPV1, Modbus EtherNet/IP, Bluetooth) 1.5. Quartz Balance QO 40A1 - SET 1.5.1. 1 pcs Quartz Balance QO 40A1 - provides a useful, progressive indication of coating thickness during the coating process, making reproducible coatings possible. Its function is based on quartz crystals which oscillate at varying rates depending on the thickness of a coating. Crystal face is parallel to the water tubes.
Special shield / tube of the chamber for protect the quartz balance before evaporation when the quartz balance is not working.
Specification:
Cooling: water 0.8 l/min using 6 mm O.D. tube, Mounting flange: DN 40CF, Manual shutter, Temperature of evaporating layer: - to 300C - sensor head need to use water cooling, - to 160C - sensor head neednt use water cooling, Miniature Coax Cable (S-50), Crystal: industry standard 14 mm diameter, frequency vibrations 6 MHz. 1.5.2. 1 set Thickness monitor TMC-13 with oscillator
TMC13 is the newest technology electronics designed for monitoring and controlling any coating and deposition processes. Up to six channel inputs and two additional vacuum gauge channels together with 6,7 TFT display makes this unit really unique and universal.
Sensor inputs can be assigned to different materials with individual parameters as well. High speed and high accuracy measuring
process controlled by DSP processor improves the film quality and repeatability. It brings also the features of accuracy, stability and instrument configuration.
QMC Sensor Inputs: standard: 6 (include one oscillator) Frequency range: 1-6 MHz, Frequency Resolution: standard: 0.1 Hz at 4 reading/sec 6,7" TFT touch panel display Digital Interface Standard: RS-232 Power 100-120/200-240 VAC, 50/60 Hz, 20 W Cables.
1.5.3. 1 pcs Standard linear shift Z=100 mm 1.6.
Gas dosing system:
Process gas 3 lines. Mass flow controlled for 4 gases. Ar direct connection to each magnetron. Include: o Valve, o Flowmeter : 0 to 100 sccm, o Connection hoses. Provision for one additional gas lines (Oxygen, Nitrogen), Provision for gas venting 1.7. Accessories 1.7.1. 1 pcs PTS Sample holder for 2 sample
Sample holder with molybdenum with heating up to 500 C, resistive indirect heating 1.7.2. 1 set 19" cabinet for all electronics units 1.7.3. 1 set Main frame
Adjustable rigid steel frames for the system, comprising mounting plate sandwich design (stainless steel, isolating plate and stainless steel mounting plate) and large wheel for easy displacement of the system. 1.7.4. 1 pcs Chiller