This document provides information about Transil diodes that provide high overvoltage protection by clamping action. It details their electrical characteristics and ratings, and includes diagrams showing properties like peak pulse power dissipation, clamping voltage, and capacitance versus reverse voltage.
This document provides information about Transil diodes that provide high overvoltage protection by clamping action. It details their electrical characteristics and ratings, and includes diagrams showing properties like peak pulse power dissipation, clamping voltage, and capacitance versus reverse voltage.
This document provides information about Transil diodes that provide high overvoltage protection by clamping action. It details their electrical characteristics and ratings, and includes diagrams showing properties like peak pulse power dissipation, clamping voltage, and capacitance versus reverse voltage.
This document provides information about Transil diodes that provide high overvoltage protection by clamping action. It details their electrical characteristics and ratings, and includes diagrams showing properties like peak pulse power dissipation, clamping voltage, and capacitance versus reverse voltage.
I BREAKDOWN VOLTAGE RANGE : From 6.8V to 220 V. I UNI AND BIDIRECTIONAL TYPES I LOW CLAMPING FACTOR I FAST RESPONSE TIME I UL RECOGNIZED FEATURES SMB (JEDEC D0-214AA) Symbol Parameter Value Unit P PP Peak pulse power dissipation (see note 1) Tj initial = T amb 600 W P Power dissipation on infinite heatsink T amb = 50C 5 W I FSM Non repetitive surge peak forward current for unidirectional types tp = 10ms Tj initial = T amb 100 A T stg T j Storage temperature range Maximum junction temperature - 65 to + 175 150 C C T L Maximum lead temperature for soldering during 10 s. 260 C Note 1 : For a surge greater than the maximum values, the diode will fail in short-circuit. ABSOLUTE MAXIMUM RATINGS (T amb = 25C) DESCRIPTION Transil diodes provide high overvoltage protection by clamping action. Their instantaneous response to transient overvoltages makes them particu- larly suited to protect voltage sensitive devices such as MOS Technology and low voltage sup- plied ICs. August 2001- Ed: 5A Symbol Parameter Value Unit R th (j-l) Junction to leads 20 C/W R th (j-a) Junction to ambient on printed circuit on recommended pad layout 100 C/W THERMAL RESISTANCES SM6Txx 2/5 I I F V F VV CL V BR V RM I PP I RM V Symbol Parameter V RM Stand-off voltage V BR Breakdown voltage V CL Clamping voltage I RM Leakage current @ V RM I PP Peak pulse current T Voltage temperature coefficient V F Forward voltage drop ELECTRICAL CHARACTERISTICS (T amb = 25C) Types I RM @ V RM V BR @ I R V CL @ I PP V CL @ I PP T C max min nom max max max max typ note2 10/1000s 8/20s note3 note4 Uni directional Mar- king Bi directional Mar- king A V V V V mA V A V A 10 -4 /C pF SM6T6V8A DE SM6T6V8CA LE 1000 5.8 6.45 6.8 7.14 10 10.5 57 13.4 298 5.7 4000 SM6T7V5A DG SM6T7V5CA LG 500 6.4 7.13 7.5 7.88 10 11.3 53 14.5 276 6.1 3700 SM6T10A DP SM6T10CA LP 10 8.55 9.5 10 10.5 1 14.5 41 18.6 215 7.3 2800 SM6T12A DT SM6T12CA LT 5 10.2 11.4 12 12.6 1 16.7 36 21.7 184 7.8 2300 SM6T15A DX SM6T15CA LX 1 12.8 14.3 15 15.8 1 21.2 28 27.2 147 8.4 1900 SM6T18A EE SM6T18CA ME 1 15.3 17.1 18 18.9 1 25.2 24 32.5 123 8.8 1600 SM6T22A EK SM6T22CA MK 1 18.8 20.9 22 23.1 1 30.6 20 39.3 102 9.2 1350 SM6T24A EM SM6T24CA MM 1 20.5 22.8 24 25.2 1 33.2 18 42.8 93 9.4 1250 SM6T27A EP SM6T27CA MP 1 23.1 25.7 27 28.4 1 37.5 16 48.3 83 9.6 1150 SM6T30A ER SM6T30CA MR 1 25.6 28.5 30 31.5 1 41.5 14.5 53.5 75 9.7 1075 SM6T33A ET SM6T33CA MT 1 28.2 31.4 33 34.7 1 45.7 13.1 59.0 68 9.8 1000 SM6T36A EV SM6T36CA MV 1 30.8 34.2 36 37.8 1 49.9 12 64.3 62 9.9 950 SM6T39A EX SM6T39CA MX 1 33.3 37.1 39 41.0 1 53.9 11.1 69.7 57 10.0 900 SM6T68A FQ SM6T68CA NQ 1 58.1 64.6 68 71.4 1 92 6.5 121 33 10.4 625 SM6T75A FS SM6T75CA NS 1 64.1 71.3 - 78.8 1 103 5.8 134 30 10.5 575 SM6T100A FY SM6T100CA NY 1 85.5 95.0 100 105 1 137 4.4 178 22.5 10.6 500 SM6T150A GL SM6T150CA OL 1 128 143 150 158 1 207 2.9 265 15 10.8 400 SM6T200A GU SM6T200CA OU 1 171 190 200 210 1 274 2.2 353 11.3 10.8 350 SM6T220A GW SM6T220CA OW 1 188 209 220 231 1 328 2 388 10.3 10.8 330 Note 2 : Pulse test : t p < 50 ms. Note 3 : V BR = T * (T amb - 25) * V BR (25C). Note 4 : V R = 0 V, F = 1 MHz. For bidirectional types, capacitance value is divided by 2. Fig. 1: Peak pulse power dissipation versus initial junction temperature (printed circuit board). 10 s 1000 s % I PP 50 0 t PULSE WAVEFORM 10/1000 s 100 SM6Txx 3/5 Fig. 2 : Peak pulse power versus exponential pulse duration. Fig. 3 : Clamping voltage versus peak pulse current. Exponential waveform t p = 20 s ________ t p = 1 ms - t p = 10 ms ............... Note : The curves of the figure 3 are specified for a junction temperature of 25C before surge. The given results may be extrapolated for other junction temperatures by using the following formula : V BR = T * [T amb -25] * V BR (25C) For intermediate voltages, extrapolate the given results. SM6Txx 4/5 Fig. 6 : Transient thermal impedance junc- tion-ambient versus pulse duration. Mounting on FR4 PC Board with Recommended pad layout. Fig. 5 : Peak forward voltage drop versus peak forward current (typical values for unidirectional types). Fig. 4b : Capacitance versus reverse applied voltage for bidirectional types (typical values). Fig. 4a : Capacitance versus reverse applied voltage for unidirectional types (typical values). Fig. 7 : Relative variation of leakage current versus junction temperature. SM6Txx 5/5 Packaging : standard packaging is tape and reel. SOD15 = Standard packaging is in Film. PACKAGE MECHANICAL DATA SMB (Plastic) D E E1 c A1 A2 b L SM 6 T 100 C A SURFACE MOUNT 600W BIDIRECTIONAL No suffix: Unidirectional BREAKDOWN VOLTAGE ORDER CODE MARKING : Logo, Date Code, Type Code, Cathode Band (for unidirectional types only). REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.60 0.030 0.063 1.52 2.75 2.3 1.52 FOOTPRINT DIMENSIONS (Millimeter) SMB Plastic. Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result fromits use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap- proval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics 2001 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com Weight = 0.12 g