Location via proxy:   [ UP ]  
[Report a bug]   [Manage cookies]                
Scribd Logo
Upload

Welcome to Scribd!

  • 71 views

    Wave Soldering

    Uploaded by

    AjayChandrakar
    ws

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd

    Wave Soldering

    Uploaded by

    AjayChandrakar
    71 views3 pages
    ws

    Copyright

    © © All Rights Reserved

    Available Formats

    PDF, TXT or read online from Scribd

    Did you find this document useful?

    Is this content inappropriate?

    ws

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    71 views3 pages

    Wave Soldering

    Uploaded by

    AjayChandrakar
    ws

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    You are on page 1of 3

    Wave soldering

    technology prevails (certain major appliances).

    1 Wave solder process

    A simple wave soldering machine.

    There are many types of wave solder machines; however,


    the basic components and principles of these machines
    are the same. The basic equipment used during the process is a conveyor that moves the PCB through the dierent zones, a pan of solder used in the soldering process,
    a pump that produces the actual wave, the sprayer for the
    ux and the preheating pad. The solder is usually a mixture of metals. A typical solder has the chemical makeup
    of 50% tin, 49.5% lead, and 0.5% antimony.[1]

    Selective soldering machine

    Wave soldering is a bulk soldering process used in the


    manufacture of printed circuit boards. The circuit board
    is passed over a pan of molten solder in which a pump
    produces an upwelling of solder that looks like a standing
    wave. As the circuit board makes contact with this wave,
    the components become soldered to the board. Wave soldering is used for both through-hole printed circuit assemblies, and surface mount. In the latter case, the components are glued onto the surface of a printed circuit
    board (PCB) by placement equipment, before being run
    through the molten solder wave.

    2 Fluxing
    Flux in the wave soldering process has a primary and a
    secondary objective. The primary objective is to clean
    the components that are to be soldered, principally any
    oxide layers that may have formed.[2] There are two types
    of ux, corrosive and noncorrosive. Noncorrosive ux
    requires precleaning and is used when low acidity is required. Corrosive ux is quick and requires little precleaning, but has a higher acidity.[3]

    As through-hole components have been largely replaced


    by surface mount components, wave soldering has been
    supplanted by reow soldering methods in many largescale electronics applications. However, there is still 3 Preheating
    signicant wave soldering where surface-mount technology (SMT) is not suitable (e.g., large power devices and Preheating helps to accelerate the soldering process and
    high pin count connectors), or where simple through-hole to prevent thermal shock.[4]
    1

    11 FURTHER READING

    Cleaning

    through the process and can measure the temperature prole,along with contact times,wave parallelism and wave
    Some types of ux, called no-clean uxes, do not re- heights. These xture combined with analysis software
    quire cleaning; their residues are benign after the sol- allows the production engineer to establish and then condering process.[5] Typically no-clean uxes are especially trol the wave solder process.
    sensitive to process conditions, which may make them
    undesirable in some applications.[5] Other kinds of ux,
    however, require a cleaning stage, in which the PCB is 9 See also
    washed with solvents and/or deionized water to remove
    ux residue.
    Dip soldering
    Thermal proling

    Finish and quality

    Quality depends on proper temperatures when heating


    and on properly treated surfaces.

    Solder types

    Dierent combinations of tin, lead and other metals are


    used to create solder. The combinations used depend on
    the desired properties. The most popular combination is
    63% tin, 37% lead. This combination is strong, has a
    low melting range, and melts and sets quickly. Higher
    tin compositions gives the solder higher corrosion resistances, but raises the melting point. Another common
    composition is 11% tin, 37% lead, 42% bismuth, and
    10% cadmium. This combination has a low melting point
    and is useful for soldering components that are sensitive
    to heat.[6]

    Eects of cooling rate

    It is important that the PCBs be allowed to cool at a reasonable rate. If they are cooled too fast, then the PCB can
    become warped and the solder can be compromised. On
    the other hand, if the PCB is allowed to cool too slowly,
    then the PCB can become brittle and some components
    may be damaged by heat. The PCB should be cooled
    by either a ne water spray or air cooled to decrease the
    amount of damage to the board.[7]

    Thermal proling

    Thermal proling is the act of measuring several points


    on a circuit board to determine the thermal excursion it
    takes through the soldering process. In the electronics
    manufacturing industry, SPC (Statistical Process Control) helps determine if the process is in control, measured against the reow parameters dened by the soldering technologies and component requirements.[8] Products like the Solderstar WaveShuttle and the Optiminer
    have been developed special xtures which are passed

    Solder mask

    10 References
    [1] Robert H. Todd, Dell K. Allen, Leo Alting (1994).
    Manufacturing Processes Reference Guide. p. 393.
    [2] http://www.ipctraining.org/dvd/47c/script.pdf
    [3] Todd p. 396
    [4] Michael Pecht (1993). Soldering Processes and Equipment. p. 56.
    [5] Giles Humpston, David M. Jacobson (2004). Principles
    of Soldering. p. 118.
    [6] Todd p. 395
    [7] Todd, Robert H.; Allen, Dell K.(1994). Manufacturing
    Processes Reference Guide. New York: Industrial Press
    Inc.
    [8] http://www.ipc.org/TOC/IPC-7530.pdf

    11 Further reading
    Seeling, Karl (1995). A study of lead-free alloys.
    AIM, 1, Retrieved April 18, 2008, from http:
    //www.aimsolder.com/techarticles/A%20Study%
    20of%20Lead-Free%20Solder%20Alloys.pdf
    Biocca, Peter (2005, April 5). Lead-free wave
    soldering. Retrieved April 18, 2008, from EMSnow Web site: http://www.emsnow.com/npps/
    story.cfm?ID=10669

    12
    12.1

    Text and image sources, contributors, and licenses


    Text

    Wave soldering Source: https://en.wikipedia.org/wiki/Wave_soldering?oldid=694313094 Contributors: Michael Hardy, Julesd, Finlay


    McWalter, Altenmann, Cholling, Giftlite, BenFrantzDale, Sam Hocevar, Vsmith, Smalljim, Share Bear, Hooperbloob, Visviva, Jet57,
    Bushytails, Woohookitty, Christopher Thomas, RxS, Rjwilmsi, Borborygmus, Mgroat, Shaddack, GeeJo, Sylve, ScottWinder~enwiki,
    SmackBot, Bluebot, Absentmindedprof, Dual Freq, Robosh, Atakdoug, Wizard191, Iridescent, MottyGlix, CmdrObot, Cydebot, Peripitus, Viscious81, BetacommandBot, Electron9, Jauricchio, MrMarmite, Jahoe, Edurant, Nar Rauko, Chapmanc, Andy.gock, Jirisundstrum,
    VolkovBot, Volsfan, Davin, Funeral, Gdzuber, Flyer22 Reborn, Radon210, Assbackward, PixelBot, XLinkBot, Addbot, Ravenlord888,
    Harry1717, Yobot, Fraggle81, Zithan, Felyza, Smart1234, A01102381, Dallascowboys618, Pedro ximenez, Pinethicket, Patyrc52, Humanoc, Example111, John of Reading, Racerx11, ZroBot, Dennish2, H3llBot, ClueBot NG, Captconan, Jeremy112233, Blahmoomoo,
    Elizabethnorton, Professor1776 and Anonymous: 105

    12.2

    Images

    File:Ecoselect_2_E_E.JPG Source: https://upload.wikimedia.org/wikipedia/commons/f/f2/Ecoselect_2_E_E.JPG License: CC BY-SA


    3.0 Contributors: Own work Original artist: Pedro ximenez
    File:Solder_wave.ogg Source: https://upload.wikimedia.org/wikipedia/commons/b/b7/Solder_wave.ogg License: CC BY-SA 3.0 Contributors: No machine-readable source provided. Own work assumed (based on copyright claims). Original artist: No machine-readable
    author provided. Pedro ximenez assumed (based on copyright claims).
    File:Wavesolderingmachine.jpg Source: https://upload.wikimedia.org/wikipedia/en/4/46/Wavesolderingmachine.jpg License: Cc-bysa-3.0 Contributors: ? Original artist: ?

    12.3

    Content license

    Creative Commons Attribution-Share Alike 3.0

    You might also like