Interview Questions
Interview Questions
1. Introduction.
2. Projects/Work/PnR tool experience.
3. Challenges/Problems
4. Solutions/possible fixes of point 3.
Experience in ICC
o Role + responsibility
o On which flow have worked?
o Congestion reason and solutions ; how you provide partial blockage?
o Suppose we are having 200 x 200 um area, we provide partial blockage of
30% blk and 70% plc allowed, all the cells seat in the middle of blockage ?
What can be done ? (As the area is larger provide smaller partial
blk so spreading will be uniform)
o What is keepout margin, cell padding and float pins?
o Input to cts (skew, transition etc)
o Have you done cts building ? how?
o What is skew?
o If we are having hold violations in design, by decreasing the freq can we do
tapeout of the chip ? why?
o On what parameters cell delay depends?
o Dc topo synthesis
o Ways to fix Setup violations
o What you will check after inserting buffer to capture flop ? (setup,hold
margin ).What will be checked on what flops?
o Define hold time.Scenario given and asked foe effect on hold time.
o Inputs to cts
o Why we use special buffer for cts?
o What is duty cycle distortion ?
o Float pins, why used?
o What is structured clock and its Advantages and disadvantages.
o Why we have multiple clocks ports in structured clock.
o What is crosstalk noise and how it impact timing (setup/hold) ?
o IR drop violations : reason and how we fix it ?
o If there is IR drop issue can we tapeout the chip by decreasing the freq?
o What is crosstalk delay?
o Explain CRPR, why we add derates /OCV to design.
o For how many scenarios you solved the timing?
o CTS challenges in any projects
What is macro modelling ?
6. Float pins ? Can float pins be used for std cells also?
7. What is crosstalk noise and how it impact timing (setup/hold) ?
8. Chip level experience
2. How do you switch between two tools (eg. ICC and encounter) and what
are the inputs?
3. Def Contents
4. Difference between hvt,lvt and ulvt .How does it affects the power.
5. How you do eco and in which tool?
6. What things solved in pt?
7. If I want to early my clock for one of the macros how I can do it? ( we use
float pins)
8. How someone decides to delay/early clock for macro(regarding macro pins
if required).
9. What celtic library contains?
10. If congestion occurs, how you solve .(using GUI also)
11. How you will solve setup violation if nothing more we can do in data
path.
12. Ways to fix setup and hold violations
1) Most recent experience you had in place and route side can you let me know which tools or
which part of the flow you have taken in that project
2) Let me break my questions in of these stage in placement, routing, CTS
3) What all does tool do if we are giving place_opt?
4) Have you had any experience in any technology node, 20nm and below?
5) From which foundry is it TSMC or SAMSUNG?
6) For this lower node we had some specific rule so that technology style to accommodate this
for placement step. Do you know happened to know what they might?
Means technology rules with respect to placement? (standard cell aspect rules)
7) Have you seen any rule like minimum VTH rule, like minimum width VTH had with. Example
like: cell which takes only 2 placement stage and I place it all by itself is it legal placement?
8) Now CTS, we uses clock_opt for CTS, can you describe the same means what does ICC do
when we are giving clock_opt?
9) Do you know which commend we use for defining the skew target?
10) How about once we finish CTS, after that clock_opt means what kind of optimization happen?
11) Now route_opt, what steps happen in route_opt?
12) route_opt -initial_route what ICC does it?
13) After detail routing I see degradation, like skew and transition violations in clock tree. Is there
a way out after detail routing to fix?
14) How about some advance rules in routing for lower technology? And compare with 28nm 45nm
15) Is there any rule which comes in 16nm and 14nm but it wasn't appearing in 20nm or 28nm.
rules means spicing or end-of-line
16) How about double-pattern?
17) Did you do routing also in TSMC16nm or 14nm?
18) For lower layers, how do you accommodate one net in 2 masks?
19) How are you with scripting?
20) How much you know TCL(detail in TCL)
21) How complicated place and route flows you have worked on?
22) For how much % you have to come up with flows? OR for how much % you to start with
scratch with flow?
23) Do you create a flow or is it ready to go?
24) How fast you can pick up any new tool?
25) How difficult to switch from ASTRO to ICC?
26) How much experience do you have with ICV?
27) Do you have experience with in Synopsys ICV or stand alone ICV?
28) How you rate your experience in ICC?
29) What is the most challenging issue you faced in ICC during any of those acoustic periods?
30) Lets say you are done with placement, you are very near to close timing at placement with idle
clock, and now you go to the CTS and then you do CTS optimization, and you see lots of clock
enable timing violations, so now how will debug this issue or what you can do at placement
stage that you can overcome this timing issue?
31) You done with CTS and post CTS optimization but timing is not closed and lots of hold
violations is there? So what you will do at CTS stage to improve hold timing.
32) Have you worked on any Low Power projects?
33) In case of Multi domain design using UPF, check_mv_design is clean before placement and
after placement it throws lots of errors and warnings saying Always ON net is driven by normal
cell. How you will debug these issues?
34) Lets say, you are done with routing and design is clean for timing and DRC. Then you take it to
PT and you see there are lots of max_trans violations (in the range of 40ps 50ps), so how you
will fix this violations?
35) I have completed Place & Route and tool is complaining about 100 transition violations so
how will you fix these violations? I dont want to do it manually, is there any other technique to
do fix this?
36) Have you tried to solve above issue with the tool (not by inserting buffer)?
37) I close timing in ICC through routing stage and now I would like to optimize it for leakage in
ICC. What should you do for leakage_opt?
38) I want to improve the dynamic power in ICC what all the things we can do in placement stage?
39) How to improve dynamic power at routing stage?