Mipi Whitepaper
Mipi Whitepaper
Mipi Whitepaper
Contents
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MIPI White Paper: Driving the Wires of Automotive https://mipi.org/mipi-white-paper-driving-wires-...
It’s not uncommon to hear new cars with advanced electronics referred to as
“smartphones on wheels” or “mobile data centers.” Regardless of the
analogy used, there’s no doubt that today’s increasingly connected vehicles
are very different from the cars of yesterday, sharing more in common with a
continuously connected device that’s just a fraction of its size: the mobile
smartphone.
These are all generally requiring that cars become smarter, connected and
more automated, which means additional electronics. As vehicles progress
along the Society of Automotive Engineers (SAE) levels of driving automation
shown in Figure 2, they will be enabled by increasingly sophisticated sensor
electronics and processing, brought together by high-speed interconnects.
The sensors driving automation can be broken down into four specific types,
each generating data at extremely high rates: optical cameras at rates of 12
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FIGURE1
Automotive leveraging the mobile smartphone
Source: MIPI Alliance
Gbps and rising, radio-based radars at 5 Gbps, light-based lidar sensors at 1
to 2 Gbps, and ultrasonic sensors in the range of 25 to 150 Mbps. Data from
each sensor is delivered to the one or more “central” processors or electronic
control units (ECUs) by a high-speed interface, often a dedicated one.
Estimates of the number of cameras per car vary widely, as shown in Figure
4, but production volume of hundreds of millions of cameras per year is
reminiscent of the large volumes seen in smartphones. Current estimates are
8-12 cameras per car in the immediate future.
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FIGURE2
Levels of driving automation
Source: ZF TRW / Mike Lemanski
FIGURE3
Automotive ADAS growth forecast
Source: Strategy Analytics
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The outlook for automotive electronics on the road to autonomy is not unlike
the mobile industry outlook in the early 2000s. The MIPI Alliance was formed
in 2003 by ARM, Nokia, STMicroelectronics and Texas Instruments at a
critical juncture in the cellphone market: the demand for smart, multimedia
handsets was exploding, yet the fragmentation of essential interface
technologies hindered product design and development. Within its first year,
the Alliance welcomed Intel, Motorola, Samsung and Philips to the
organization and introduced specifications that would remove a significant
pain point in the complexity of phone design—how to connect cameras to the
central application processor. Very quickly thereafter, MIPI set the goals of
connecting the application processor to higher resolution displays and early
3G cellular modems.
It
FIGURE4
Worldwide automotive camera sensors forecast
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Now in its 16th year, MIPI Alliance has developed roughly 50 specifications
that cover the full range of interface applications in a mobile device,
including those connecting application processors to modems, cameras,
displays, audio, storage, sensors, antennas, antenna tuners, power
amplifiers, filters, switches, batteries and other elements. These
standardized specifications have helped to facilitate interoperability among
component suppliers, simplify device designs (hence reducing cost), and
optimize performance and power, while allowing manufacturers to focus on
product differentiation and reduce their time to market.
As a result, today all major chip vendors and smartphone manufacturers use
MIPI Alliance specifications, and every smartphone on the market uses many
different MIPI Alliance specifications. The organization itself has more than
300 member companies that reflect the breadth of the mobile and mobile-
influenced ecosystem, including handset manufacturers (OEMs),
semiconductor companies, silicon IP provider companies, test equipment
companies, camera and display module providers, sensor providers, and most
recently, automotive OEMs and their Tier 1 suppliers.
Among the reasons MIPI specifications have been so broadly embraced are
specific technical attributes, captured within the four “pillars” of MIPI
interface performance in the mobile environment:
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to low
power has
been a key
enabler for
IoT
devices
that rely
on
batteries
lasting
years, or
more than
a decade
in some
cases.
Low EMI.
The
smaller
the device,
the less
space
between
FIGURE5
Illustration of the MIPI layered protocol approach for
its “multimedia” applications
Source: MIPI Alliance
components, which translates into a higher risk of EMI which can
undermine a device’s performance and reliability.MIPI interface
specifications reduce EMI through a combination of factors, including
low voltage swings on the high-speed PHYs; and critically supporting
slew rate control on these interfaces allowing OEMs the flexibility to
adjust the EMI profile within the end device.
Low pin count. High performance per wire conductor allows the
ecosystem’s chip, device and module manufacturers to minimize pin
count, leading to fewer interconnections on chips, and across printed
circuit board (PCB) traces. The resulting reduced complexity also
reduces manufacturing costs, thus expanding the addressable market
for devices, especially in the highly price-sensitive IoT space.
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set above the protocol. Add in software and a family of debug tools, and MIPI
implementations reduce design complexity and cost, simplify integration and
speed time to market. Figure 5 illustrates the layered structure of the MIPI
camera and display application stacks, with the CSI-2 and DSI-2 interface
protocols that operate over the D-PHY and/or C-PHY physical layers. Above
the protocol layers reside the command sets for camera (CCSSM) and display
(DCSSM).The MIPI I3C interface serves as the Camera Control Interface.
In this section, and summarized in Table 1, we describe some of the key MIPI
interface specifications that are being reused from the mobile ecosystem into
automotive.
Since its introduction in 2005, MIPI CSI-2 has become ubiquitous in several
industries.In automotive, it has been widely adopted as an interface for
cameras, and increasingly for radar and lidar sensor subsystems. With
support from the high-bandwidth D-PHY and C-PHY physical layers, and
support from the A-PHY physical layer in development, CSI-2 supports a wide
range of applications, resolutions, frame rates, color depths and high-
dynamic-range capabilities with flexible-pin-count PHY configurations.
CSI-2 supports image sensors around the entire vehicle, including at the
front for detecting pedestrians and other vehicles and on the sides for
alerting drivers when they’re drifting out of their lanes. Its support for
RAW20-pixel format capability ensures highly nuanced image capture even
when lighting changes suddenly and dramatically, such as when a vehicle
exits a dimly lit tunnel into bright sunlight.
As shown in Figure 6, cars today may use more than a dozen different
cameras, as well as radar and lidar sensors, all using the ubiquitous native
CSI-2 interface. In addition to a camera in the rear for backing up, there may
be a camera on each side of the vehicle to augment and eventually replace
the side mirrors for blind spot detection and lane-keeping assistance. For
automatic emergency braking or adaptive cruise control, there may be more
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TA B L E 1
MIPI interface specifications for Automotive
Source: MIPI Alliance
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In
FIGURE6
5 types of imaging sensors found in automobiles
Source: Michigan Tech Research Institute
addition to a CSI-2 interface for each of these cameras, there may be
additional CSI-2 interfaces for radar, lidar and other sensor systems. And as
vehicle automation evolves toward Level 5 self-driving capability, the number
of CSI-2 sensors could go much higher.
The CSI-2 protocol operates over the D-PHY/C-PHY physical layer interfaces
described below. The established CSI-2 v2.1 specification continues its
progression toward supporting higher performance cameras. In particular, it
offers support for cameras with resolutions of 40 megapixels and up, video
capture
beyond 4K/120fps and 8K/30fps, and the RAW20 color depth format
introduced to support advanced vision capabilities for embedded system
cameras and autonomous vehicles. CSI-2 v2.1 also supports data
compression using enhanced differential pulse-code modulation (DPCM) to
compress data while preserving edge detection, which is applicable to
vehicles driving in low light for functions such as road sign detection. The
recently released CSI-2 v3.0 (September 2019) CSI-2 specification already
includes specific features for automotive applications, including the
following:
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Today, CSI-2 underpins the higher data transfer rates of automotive cameras
for ADAS, such as rear-view and surround-view assistance as well as collision
mitigation and avoidance systems. Automotive SoCs ubiquitously support
CSI-2 interfaces to receive the image data from multiple cameras distributed
around the car, and the number of cameras and sensors on board is expected
to escalate quickly.
Looking forward, MIPI CSI-2 v4.0, currently scheduled for release in early
2020, will add the following critical safety and security features:
CSI-2 v4.0 will also enable the advanced, AI-powered vision capabilities
necessary to make autonomous and semi-autonomous vehicles safe and
practical. For example, interior cameras to detect drowsy or inattentive
drivers represent yet another potential use of CSI-2.
The DSI interface, later updated to DSI-2, was initially developed in the
mid-2000s to service smartphone displays with high resolution and high
frame rate, yet low power consumption. Today, the DSI-2 specification is the
display protocol utilizing either D-PHY or C-PHY to provide over 6
gigapixels/s of uncompressed image content for modern mobile, IT or IoT
displays. As the payload of displays has increased, the carrying capacity of
DSI-2 has also grown. This has been achieved through increasing the raw
bandwidth of the underlying PHYs and introducing digital image compression
or protocol efficiencies that remove video blanking, easily allowing for the
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FIGURE 7
Spider diagrams showing strengths of various sensors found in
automobiles
Source: www.cleantechnica.com
attachment of multiple displays in a daisy-chain fashion.
As displays become more customized to the form factor of the car, they
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probably will not follow typical consumer electronics formats. Due to its long
and successful history in the custom mobile market, DSI-2 is well-suited to
serving specialized displays of different sizes and resolutions.
The DSI-2 protocol is pin efficient because of the in-band, asymmetric, half-
duplex, D-PHY and C-PHY low-power escape mode for upstream
communications.DSI-2 can communicate display integrity, status, data
integrity and other information with no additional auxiliary channel (side
band). The upstream communications in DSI-2 will also remain an important
automotive protocol feature in automotive.
FIGURE 8
Example of automobile multiscreen dash stitched together as
single screen
Source: Stock Graphic
Automotive displays also take advantage of DSI-2’s ability to support multiple
smaller-screen displays that are stitched together in an instrumentation
console, as shown in Figure 8.
Automotive displays have unique requirements and will use features of DSI-2
not found in smartphones. These include functional safety capabilities, extra
link integrity for safety applications and HDCP content protection. In
particular, because premium content producers generally allow content to
flow over a “standard interface” accessible to the user only if it is “content
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The MIPI Alliance further created a MIPI Touch Framework for the ever-
familiar touch capability needed by infotainment and center console displays.
As with host-based audio synchronization, the local host processor
synchronizes display updates with the touch prompts received through the
MIPI Touch protocol and commands defined in an I3C sideband channel.
MIPI D-PHY & C-PHY: The Short-Reach Physical Interfaces for CSI-2
and DSI-2
MIPI Alliance has developed two physical layers (PHYs) for short-reach
connections to CSI-2-based cameras and DSI-2-based displays: MIPI D-PHY
and C-PHY.
The D-PHY and C-PHY interfaces are illustrated in Figure 9 in the CSI-2
camera use case, where the transmitter in the camera sends CSI-2 format
data to the receiver in the host application processor.
The choice between D-PHY and C-PHY can be made by the silicon provider,
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the
FIGURE 9
D-PHY and C-PHY lane configurations in the CSI-2 camera use
case
Source: MIPI Alliance
module provider, and/or the OEM. For applications that require an
embedded-clock PHY or one that operates at a lower symbol rate, C-PHY is
the most appropriate choice. For a conventional and simpler clock-
forwarding architecture, D-PHY is most appropriate. These PHYs have been
created so implementations can be pin-compatible in a dual-mode PHY for
maximum design flexibility.
Over the years, the D-PHY/C-PHY roadmaps have been developed to support
and anticipate requirements for the camera and display payloads. In 2017,
MIPI collected historical data for smartphone camera and display payloads
since MIPI’s formation in pre-smartphone 2003, and used these to influence
its camera and display specifications for 2020, including for the first
automotive use cases. This data is shown in Figure 10.
FIGURE 10
Display and camera payload forecast for smartphones and cars in
early 2020s
Source: MIPI Alliance
This data illustrates a trend in which display payloads grew by about 10X
every 5 years and camera payloads grew by about 5X every 5 years. A typical
high-end smartphone display in 2017 supported “4K60” performance,
measured by parameters such as 3840x2160-pixel resolution x 30 bpp (bits
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per pixel) x 60 fps (frames per second), requiring a 15 Gbps interface. At the
time, the projected 2020 display would require an increase to “10K120”
displays, with an interface supporting about 93 Gbps, largely driven by the
AR/VR use case of a display worn close to a person’s face with a display for
each eye. Figure 10 also identifies the camera use cases, which require about
half the interface bandwidth of displays. It also illustrates what was, at the
time, the expected first-generation long-reach bandwidth of A-PHY at 20
Gbps. This is discussed later in the paper. The decision ultimately was made
to set the bandwidth of A-PHY v1.0 at 16 Gbps.
FIGURE 11
Current implementation of bridged D-/C-PHY using proprietary
solutions
Source: MIPI Alliance
integrators currently must use “bridge solutions” or “bridges” to translate
the D-PHY/C-PHY signaling to longer-reach PHYs, often based on low-voltage
differential signaling (LVDS) technology. Such bridge solutions are shown in
Figure 11 below. Although individual bridge functions are shown in Figure
11, many such bridge functions are combined into a single chip, such as in
dual and quad hubs.
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Finally, while D-PHY and C-PHY are usually described as “short reach,” as
per the “15 cm” in smartphones and tablets, the most recent specification
versions of D-PHY and C-PHY have developed modestly longer reaches of 1 m
and beyond, with speeds that decrease with the longer reach. These longer
reaches will mostly benefit those IoT applications that need beyond “15 cm.”
Those applications such as automotive needing the 10–15 m reach may be
served by A-PHY.
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I3C uses an I²C-like interface with an open-drain data line (SDA) and a push-
pull clock line (SCL), where the open-drain SDA line allows a slave device to
take control of the interface to initiate an in-band interrupt, and the push-pull
SCL line is driven by the master to clock the communication bus at
frequencies up to 12.5 MHz. The ability of a peripheral device to gain the
attention of the controlling master on the SDA line without using a dedicated
signal line per device, as required in the I²C and SPI interfaces, is important.
It results in cost savings of many pins and reduced complexity in the number
of interfaces, PCBs and connectors.
The I3C master can dynamically assign 7-bit addresses to all MIPI I3C
devices while supporting the static addresses of legacy I²C devices, ensuring
full backward compatibility with I²C.
Operationally, a set of common command codes (CCCs) has been defined for
the most often used operations, such as enabling and disabling events,
managing MIPI I3C-specific features including dynamic addressing and
timing control and others. These CCCs can be broadcast (sent to all devices)
or directed at a specific device on the bus.
The
I3C
FIGURE12
MIPI I3C vs I²C: Energy consumption and raw bitrate
Source: MIPI Alliance
interface represents a shift in power performance while providing greater
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The automotive sensors, such as pressure, air flow, temperature and crash
detection often are widely distributed around a car. These sensors require
long-distance connections where digital sensor interfaces SENT and PSI5 are
used. Other groups of sensors are often localized within a module and can
consist of several to dozens of sensor connections. Today these sensors may
be connected via SPI or I2C within a module. I3C’s virtues of higher
performance, lower latency, lower energy per bit, lower pin count through in-
band interrupts and the flexible multi-drop configuration across multiple
sensors make it as highly valued in automotive as it is in smartphones.
In this architecture, MIPI I3C is an ideal interface for reliable and low-cost
connectivity between the module’s sensor and slaves inside an ECU. For
automotive applications such as imaging that require sensor data rates much
higher than that of MIPI I3C, MIPI I3C can be used for control and
management of the sensor. The faster MIPI CSI-2 interface can be used to
transport the high-speed data via D-PHY/C-PHY over short distances or
A-PHY over long distances. In this case, the two MIPI interfaces work
collaboratively to provide a reliable and well-managed camera and control
functionality.
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FIGURE13
Sensor module example using IMU and ECU
Source: MIPI Alliance
modem baseband and/or the RF integrated circuit (RFIC) transceiver. The
RFFE control interface has essentially replaced generations of proprietary
and less capable (often point-to-point) interfaces to front-end components,
thus simplifying the design, configuration and integration of an increasingly
complex RF front end consisting of multiple aggregations of RF bands and
channel combinations. Automakers and suppliers will continue to leverage
these advancements.
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FIGURE14
Sensor module architecture using MIPI I3C
Source: MIPI Alliance
flexibility in how they apply configuration changes. MIPI RFFE v2.1 also
extends the trace lengths of RFFE buses, up to 45 cm from the standard 15
cm. This enhancement reflects how cellular, Wi-Fi and other wireless
technologies are increasingly used in more than just smartphones. A longer
bus gives system designers more flexibility for devices such as laptops,
where the antenna may be up in a corner of the lid and the transceiver may
be underneath the keyboard.
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FIGURE15
MIPI RFFE multi-master control of front-end module (FEM)
peripherals
Source: MIPI Alliance
While visual information plays a critical and growing role in vehicle operation
and the in-car experience, audio is also important. MIPI SoundWire
consolidates key attributes of mobile and PC industry audio interfaces that
have migrated to automotive. It supports fully digital, multi-stream, multi-
channel audio with advanced capabilities over a two-wire multi-drop
interface. The existing SoundWire specification is designed for systems that
deliver audio and control data over a wire length of up to 50 cm, so it’s best
suited to audio endpoints within that distance from the SoC, such as in the
infotainment center or next to displays.
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passenger is watching news and children in the back are watching cartoons,
it might be useful to have “directional speakers” to create personal audio
zones with less interference to others in the car. This is available with the
proper audio algorithms operating over MIPI SoundWire, which enables
playback with continuous monitoring of interference so the audio algorithm
can adjust sound levels and directions in real time.
As
the
FIGURE16
JEDEC UFS using MIPI M-PHY and MIPI UniPro
Source: MIPI Alliance
capabilities of ADAS and ADS expand, the need for storage with higher
performance and lower power consumption will grow. Universal Flash
Storage (UFS), a JEDEC Solid State Technology Association specification, has
emerged as an ideal standard for data storage in vehicles. UFS is already
widely used for storage in smartphones and tablets, digital cameras and
other consumer electronics, bringing higher data transfer speed and
increased reliability to flash memory storage.
Infotainment and navigation are the major drivers for high-performance in-
vehicle data storage. Given that advanced connected cars can collect more
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than 1 GByte of data per second, transmitting all that data to cloud servers
and back is generally ineffective and inefficient, so a storage and compute
subsystem at the edge, on board the vehicle, solves the processing challenge.
These systems will become even more important with the transition from
ADAS to semi-autonomous and autonomous driving, especially with the use
of HD maps across all cities visited on a journey.
As shown in Figure 16, a UFS host device connects to the UFS storage
device via the M-PHY interface. M-PHY is a differential signaling interface
operating over discrete gears of operation and up to four lanes. M-PHY can
also operate without the discrete reference clock and reset signals as shown
in Figure 16, which is the desired UFS configuration. UFS 3.0 operates at
M-PHY Gear 4, for 11.6 Gbps per lane, or 23.2 Gbps per direction, with up to
two lanes. UniPro is the transport protocol for UFS storage. One of the
UniPro v1.8 features that most benefits automotive applications is its ability
to continuously monitor the symbol error rate of forward and reverse links,
as well as receiver performance, enabling it to “retrain” the communication
channel dynamically. This feature updates link settings if needed to ensure a
link delivers the same reliability and quality of service (QoS) at higher data
speeds—both of which are crucial to automotive, as systems are subject to
highly variable and sometimes extreme temperature conditions.
FIGURE17
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A key application for A-PHY is to support the camera and imaging sensors
and other surround sensors, including lidar and radar, for ADS and ADAS.
A-PHY will also support the increasingly large and high-resolution
infotainment displays in the center console and passenger seats, as well as
other display applications, such as digital rearview mirrors and rear-seat
displays.
1. In the short term, bridge chip providers can focus on the single long-reach
PHY standard A-PHY to reduce complexity and cost in the ecosystem. See
Figure 17.
2. In the long-term, the endpoints, such as cameras, SoCs and displays, can
natively support the integrated A-PHY and eliminate the bridge chips. See
Figure 18.
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FIGURE18
Native MIPI A-PHY integration in the endpoint devices,
eliminating bridge chips
Source: MIPI Alliance
Figure 18 illustrates the simplest direct connection between an A-PHY-
equipped image sensor and an A-PHY-equipped ECU or automotive chip.
Elimination of the bridge chips at each endpoint will reduce cost, cable
weight, power consumption and latency, and improve reliability.
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The two profiles will have at least one common speed gear to ensure
interoperability, while providing the automotive ecosystem with
implementation choices spanning performance, cost and complexity.
A-PHY will perform the role in automotive that C-PHY and D-PHY play in
mobile today, providing the high-speed connectivity to sensors and cameras
in the vehicle where the flow of data is primarily from the sensor or camera
to a central high-performance processor in an ECU. A-PHY will also be
applied to display connectivity, which demands ever-increasing video
resolutions to support next-generation in-vehicle infotainment applications,
including the use of displays to replace internal and rearview mirrors.
Figure 19 illustrates the reuse of MIPI protocols over short distances using
the mobile implementations, and over longer distances using A-PHY.
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FIGURE19
Automotive system diagram with optimized MIPI asymmetric
architecture
Source: MIPI Alliance
DisplayPort protocol specification for automotive use. To accommodate
these developing specifications, A-PHY includes a generic Data Link
Layer that accommodates different protocol adaptation layers, with a
plan to support VESA’s Vehicular DisplayPort protocol.
High EMC Immunity. MIPI has invested significantly to analyze and
measure the harsh automotive channel and has concluded that an
architecture based on a Narrowband Interference Canceller (NBIC) and
Retransmission Scheme (RTS) provides the most robust performance,
particularly for the applications requiring the higher data rates at
longer distances.
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FIGURE20
Symmetric and asymmetric automotive data flows
Source: MIPI Alliance
Conclusions
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The material contained herein is not a license, either expressly or impliedly, to any IPR owned or
controlled by any of the authors or developers of this material or MIPI.All materials contained herein
are protected by copyright laws, and may not be reproduced, republished, distributed, transmitted,
displayed, broadcast or otherwise exploited in any manner without the express prior written
permission of MIPI Alliance.MIPI, MIPI Alliance and the dotted rainbow arch and all related
trademarks, trade names, and other intellectual property are the exclusive property of MIPI Alliance
and cannot be used without its express prior written permission.
MIPI Alliance
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