NJM8080

DUAL AUDIO OPERATIONAL AMPLIFIER

FEATURES DESCRIPTION
● Supply Voltage ±2V to ±18V The NJM8080 is dual operational amplifier designed for
● Low Input Noise Voltage 5nV/√ Hz typ. at f=1kHz audio applications. NJM8080 finely refines to every detail
● Wide Gain Bandwidth Product 15 MHz typ. from Si-wafer to circuit layout, stick in a thorough
● Low Distortion 0.0005% typ. improvement in sound quality. The NJM8080 features high
● Slew Rate 5V/μs typ. resolution and crispy-clear high frequency sound, which
● Bipolar Technology can fully perform the digital sound source with loss-less.
● Package Outline SOP8
NJM8080 features low noise, wide gain-bandwidth, low
MSOP8 (TVSP8)*
distortion and high output current, and various reliabilities
*meet JEDEC MO-187-DA / thin type
and conveniences are improved. NJM8080 can widely be
SSOP8
used as the standard audio operational amplifier.
● Internal ESD Protection
Human Body Model (HBM) ±2000V typ.
● Wide Temperature Range -40°C to 125°C

■ RELATED PRODUCT
APPLICATIONS PRODUCT NAME FEATURES
● Home Audio
3.5nV/√Hz, 0.001%, 6.8V/μs, 19MHz
● Car Audio NJM8068
● Active Filters (Low noise, low distortion audio Op-Amp)
● Servo Control Amplifiers
● Headphone Amplifiers

■ EQUIVALENT CIRCUIT

V+

-INPUT

+INPUT OUTPUT

V-

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■ PIN CONFIGURATIONS
PRODUCT NAME NJM8080G NJM8080RB1 NJM8080V
Package SOP8 MSOP8 (TVSP8) SSOP8
(Top View)

A OUTPUT 1 8 V+

A -INPUT 2 7 B OUTPUT
Pin Functions
A +INPUT 3 6 B -INPUT

V- 4 5 B +INPUT

■ PRODUCT NAME INFORMATION

NJM8080 G (TE2)

Part Number Package Taping Form

■ ORDER INFORMATION
PRODUCT HALOGEN- TERMINAL WEIGHT MOQ
PACKAGE RoHS MARKING
NAME FREE FINISH (mg) (pcs)
NJM8080G SOP8 Yes Yes Pure Sn 8080 88 2500
NJM8080RB1 MSOP8 (TVSP8) Yes Yes Sn2Bi 8080 18 2000
NJM8080V SSOP8 Yes Yes Sn2Bi 8080 42 2000

■ ABSOLUTE MAXIMUM RATINGS

PARAMETER SYMBOL RATING UNIT
+ -
Supply Voltage V /V ±18 V
(1)
Differential Input Voltage VID ±36 V
(2) - -
Input Voltage VIN V -0.3 to V +36 V
- +
Output Terminal Input Voltage VO V -0.3 to V +0.3 V
(3) (4)
Power Dissipation 2-Layer / 4-Layer
SOP8 PD 690 / 1000 mW
MSOP8 (TVSP8) 510 / 680
SSOP8 430 / 540
Storage Temperature Range Tstg -65 to 150 ºC
Maximum Junction Temperature Tjmax 150 ºC

■ THERMAL CHARACTERISTICS
PACKAGE SYMBOL VALUE UNIT
(4)
Junction-to-Ambient Thermal Resistance 2-Layer / 4-Layer
SOP8 Θja 181 / 125 °C/W
MSOP8 (TVSP8) 245 / 184
SSOP8 291 / 231
(4)
Junction-to-Top of Package Characterization Parameter 2-Layer / 4-Layer
SOP8 Ψjt 49 / 43 °C/W
MSOP8 (TVSP8) 51 / 45
SSOP8 46 / 45
(1) Differential voltage is the voltage difference between +INPUT and -INPUT.
+.
(2) Input voltage is the voltage should be allowed to apply to the input terminal independent of the magnitude of V
The normal operation will establish when any input is within the “Common-Mode Input Voltage Range” of electrical characteristics.
(3) Power dissipation is the power that can be consumed by the IC at Ta=25ºC, and is the typical measured value based on JEDEC
condition.
(4) 2-Layer: Mounted on glass epoxy board. (76.2×114.3×1.6 mm: based on EIA/JDEC standard, 2-layer FR-4)
4-Layer: Mounted on glass epoxy board. (76.2×114.3×1.6 mm: based on EIA/JDEC standard, 4-layer FR-4), internal Cu area: 74.2 x
74.2 mm

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■ POWER DISSIPATION vs. AMBIENT TEMPERATURE

Power Dissipation vs. Temperature Power Dissipation vs. Temperature

2-Layer 4-Layer

1100 1100
SOP8
1000 1000
Power Dissipation PD [mW]

Power Dissipation PD [mW]

900 900
SOP8
800 800
MSOP8 (TVSP8)
700 MSOP8
TVSP8
(TVSP8)
700
600 600
500 500
400 400
300 300
200 200 SSOP8
100 SSOP8
100
0 0
0 25 50 75 100 125 150 0 25 50 75 100 125 150
Ambient Temperature [°C] Ambient Temperature [°C]

RECOMMENDED OPERATING CONDITIONS

PARAMETER SYMBOL CONDITIONS VALUE UNIT
+ -
Supply Voltage V /V Ta=25°C ±2 to ±18 V
Operating Temperature Range Topr -40 to 125 °C

■ ELECTRICAL CHARACTERISTICS (V+/V-=±15V, Ta=25°C, unless otherwise noted.)

PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT
INPUT/OUTPUT CHARACTERISTICS
Input Offset Voltage VIO RS≤10kΩ - 0.3 3 mV
Input Bias Current IB - 100 500 nA
Input Offset Current IIO - 5 200 nA
Input Resistance RIN - 0.5 - MΩ
Open-Loop Voltage Gain AV RL≥2kΩ,VO=±10V 90 110 - dB
Maximum Output Voltage VOM RL≥2kΩ ±12 ±13.5 - V
Common-Mode Input Voltage Range VICM ±12 ±13.5 - V
Common-Mode Rejection Ratio CMR RS≤10kΩ 80 110 - dB
POWER SUPPLY
Supply Voltage Rejection Ratio SVR RS≤10kΩ 80 110 - dB
Supply Current ISUPPLY - 6 9 mA
AC CHARACTERISTICS
Slew Rate SR RL≥2kΩ - 5 - V/μs
Gain Bandwidth Product GBW f=10kHz - 15 - MHz
Total Harmonic Distortion + Noise THD+N AV=20dB,VO=5V,RL=2kΩ,f=1kHz - 0.0005 - %
Equivalent Input Noise Voltage en f=1kHz - 5 - nV/√Hz

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■ TYPICAL CHARACTERISTICS

Gain/Phase vs. Frequency Gain/Phase vs. Frequency

+ - + -
V /V =±15V, Gv=40dB, RL=2kΩ, CL=10pF V /V =±15V, Gv=40dB, RL=2kΩ, Ta=25ºC
50
Gain
40 40
Gain CL=330pF
30 Ta=125ºC
CL=100pF
Phase 20
Voltage Gain [dB]

Voltage Gain [dB]

Ta=25ºC CL=10pF
20 0 0

Phase [deg]
CL=680pF

Phase [deg]
10 Ta=-40ºC -30 0 -30
Phase
0 -60 CL=10pF -60
Ta=-40ºC
-20 CL=100pF
-10 -90 -90
Ta=25ºC
-20 -120 -120
Ta=125ºC -40 CL=330pF
-30 -150 CL=680pF -150

-40 -180 -60 -180

10k 100k 1M 10M 100M 10k 100k 1M 10M 100M
Frequency [Hz] Frequency [Hz]

Maximum Output Voltage vs. Output Current Maximum Output Voltage vs. Load Resistance
+ - + -
V /V =±15V V /V =±15V, Gv=open
15 15
Ta=-40ºC +VOM
+VOM
Maximum Output Voltage [V]

10 10 Ta=125ºC
Maximum Output Voltage [V]

Ta=125ºC
Ta=85ºC
Ta=85ºC

5 Ta=25ºC 5 Ta=25ºC

Ta=-40ºC

0 0
Ta=25ºC
Ta=-40ºC
Ta=85ºC
-5 -5
Ta=25ºC
Ta=125ºC
Ta=85ºC
-10 -VOM -10 Ta=125ºC -V
-VOM
OM

Ta=-40ºC
-15 -15
1 10 100 100 1k 10k 100k
Output Current [mA] Load Resistance[Ω]

THD+N vs. Output Voltage THD+N vs. Output Voltage

+ - + -
V /V =±15V, GV=20dB, RL=2kΩ, Ta=25ºC V /V =±2V, GV=20dB, RL=2kΩ, Ta=25°C
0.1 1

0.01
THD+N [%]

f=20Hz
THD+N [%]

f=20kHz
f=1kHz
f=20kHz
0.1

0.001

f=1kHz

f=20Hz

0.0001 0.01
0.1 1 10 0.01 0.1 1
Output Voltage [Vrms] Output Voltage [Vrms]

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■ TYPICAL CHARACTERISTICS

Maximum Output Voltage Swing vs. Frequency Voltage Noise vs. Frequency
+ - + -
V /V =±15V, RL=2kΩ, Ta=25ºC V /V =±15V, GV=40dB, RF=2kΩ, Ta=25ºC
30 30

Equivalent Input Noise Voltage

Maximum Output Voltage Swing

25 25

20 20
VOPP [Vpp]

[nV/Hz]
15 15

10 10

5 5

0 0
1k 10k 100k 1M 10M 1 10 100 1k 10k 100k
Frequency[Hz] Frequency [Hz]

Supply Current vs. Supply Voltage Supply Current vs. Temperature

RL=open RL=open
8 8

7 Ta=-40ºC
7
+ -
Ta=25ºC V /V =±18V
Supply Current [mA]

Supply Current [mA]

6 6 + -
V /V =±15V

5 5

4 4
+ -
V /V =±2V
3 Ta=85ºC 3
Ta=125ºC

2 2

1 1

0 0
0 ±2 ±4 ±6 ±8 ±10 ±12 ±14 ±16 ±18 -50 -25 0 25 50 75 100 125 150
+ -
Supply Voltage V /V [V] Ambient Temperature [ºC]

Input Offset Voltage vs. Temperature Input Offset Voltage vs. Supply Voltage
3 3
Input Offset Voltage [mV]

+ -
Input Offset Voltage [mV]

2 V /V =±2V 2
+ -
V /V =±15V Ta=25ºC Ta=-40ºC

1 1

0 + -
0 Ta=85ºC
V /V =±18V Ta=125ºC

-1 -1

-2 -2
-50 -25 0 25 50 75 100 125 150 0 ±2 ±4 ±6 ±8 ±10 ±12 ±14 ±16 ±18
+ -
Ambient Temperature [ºC] Supply Voltage V /V [V]

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 NJM8080

■ TYPICAL CHARACTERISTICS

Input Offset Voltage Input Offset Voltage

vs. Common-Mode Input Voltage vs. Common-Mode Input Voltage
+ - +
V /V =±15V V /V=-±2V
3 3
Input Offset Voltage [mV]

Ta=85ºC

Input Offset Voltage [mV]

2 2
Ta=-40ºC Ta=85ºC

1 1 Ta=-40ºC

Ta=25ºC
Ta=125ºC
0 0
Ta=25ºC Ta=125ºC

-1 -1

-2 -2
-15 -10 -5 0 5 10 15 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0
Common-Mode Input Voltage [V] Common-Mode Input Voltage [V]

Input Bias Current vs. Temperature Open-Loop Voltage Gain vs. Temperature
VICM=0V V+/V-=±15V, RL=2kΩ to GND
400 120

350 115
Open-Loop Voltage Gain [dB]
Input Bias Current [nA]

300 110

250 + -
V /V =±15V + - 105
V /V =±2V

200 100

150 95

100 +
V /V =±18V
-
90

50 85

0 80
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Ambient Temperature [ºC] Ambient Temperature [°C]

CMR vs. Temperature SVR vs. Temperature

+ - + -
V /V =±15V, VCM=-12.2V~12.2V V /V =±9V±18V
120 120
Supply Voltage Rejection Ratio [dB]
Common-Mode Rejection Ratio [dB]

115 115

110 110

105 105

100 100

95 95

90 90

85 85

80 80
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Ambient Temperature [ºC] Ambient Temperature [ºC]

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 NJM8080

■ TYPICAL CHARACTERISTICS

Maximum Output Voltage vs. Temperature Maximum Output Voltage vs. Supply Voltage
Gv=open, RL=2kΩ, RL to GND RL=2kΩ to GND
18 18
15

Maximum Output Voltage [V]

Maximum Output Voltage [V]

12 + - +VOM 12
V /V =±18V
+ -
V /V =±15V
9
6 +
V /V =±2V
-
6
3
0 0 Ta=25ºC Ta=-40ºC Ta=85ºC Ta=125ºC

-3 + -
V /V =±2V
-6 -6
+ -
-9 + - V /V =±15V
V /V =±18V
-VOM
-12 -12
-15
-18 -18
-50 -25 0 25 50 75 100 125 150 ±2 ±4 ±6 ±8 ±10 ±12 ±14 ±16 ±18
+ -
Ambient Temperature [ºC] Supply Voltage V /V [V]

Pulse Response
+ -
V /V =±15V, RL=2kΩ, Ta=25ºC
Voltage [0.5V/div]

Vin

CL=10pF

CL=680pF
CL=330pF

Time [1μs/div]

Ver.6.0 -7-
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 NJM8080

■ TEST CIRCUITS

● ISUPPLY ● VIO, CMR, SVR

RG=50Ω, RF=50kΩ

V+ RF

A
V+
RG

VO

RG
RF V-
V-
VS=V+-V-

● VOH, VOL
VOH; Vin+ = 1V, Vin- = -1V
VOL; Vin+ = -1V, Vin- = 1V

V+

VO

RL
Vin- Vin+ V-

● SR
RL=2kΩ

90% 90%
V+
Vo
ΔV ΔV
VO
10% 10%
Δt Δt
50Ω RL
V-

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 NJM8080
SOP8
Unit: mm
■ PACKAGE DIMENSIONS

DETAIL F D
T
e/2

8 5

E1 E

1
4

U
h ×45 °
6 ×e
∞0 M U M

θ
CCC Z A2 A

A1
Z
S EA T I N G
PLANE 8 ×b
bbb M Z U S T S
D ESCR IPTI ON S YMBOL INC H MI LLIM ETER
MIN NC M MAX M IN NC M MAX
TOT AL T HICKN ESS A .053 .0 69 1 .35 1.7 5
ST AND O FF A1 .004 .0 10 0.10 0.2 5 θ1
MOLD THI CKNES S A2 . 049 - 1. 25 -
LEAD WIDT H b . 014 .019 0. 35 0.49
L/ F THI CKNE SS C .007 .0 10 0.19 0.2 5
D .189 .1 97 4.80 5.0 0
BODY SIZE
E1 .15 0 . 157 3.80 4. 00
E .228 .2 44 5.80 6.2 0
LE AD PI TCH e .050 BSC 1.2 7 BS C
θ2
L . 015 .049 0 .40 1.25
h . 010 .02 0 0 .25 0.50
θ 0° 7° 0° 7°
θ1 5° 15 ° 5° 15 ° C
θ2 2° 7° 12 ° 2° 7° 12 °
LE AD ED GE O FFSE T
L EAD OFFS ET
∞O
b bb
.010
.010
0.25
0.25
[0.25]
CO PLAN ARIT Y CC C . 004 0.10 L DETAIL F

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 NJM8080
SOP8
Unit: mm
■ EXAMPLE OF SOLDER PADS DIMENSIONS

0.72 1.27
1.27

5.72

3.81

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 NJM8080
MSOP8 (TVSP8) JEDEC MO-187-DA/THIN TYPE
Unit: mm
■ PACKAGE DIMENSIONS
2. 9 ± 0 . 1 0 ∼10ﾟ

8 5

2.8 ± 0.1

4.0 ± 0.2

0.55 ± 0.1
1 4
0 . 4 75 ± 0 .1 0 . 65 0. 1 2 7 +0.05
-0.03
1.0max
0.1 ± 0.05

0 . 08
0 . 2 ± 0. 0 5
0 . 05 M

■ EXAMPLE OF SOLDER PADS DIMENSIONS

0.23 0.65
1 .0

3.5

1.95

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 NJM8080
SSOP8
Unit: mm
■ PACKAGE DIMENSIONS

3.5 +0 .3
-0 .1 0 ∼10 °

8 5

4.4 ± 0. 2

6.4 ± 0 .3

0. 5 ± 0 .2
1 4
0.9max 0.65
1 .15 ± 0.1

+0.1
0.15 -0.05
0.1 ± 0.1

0.1

0.22 ±0.1
0.1 M

■ EXAMPLE OF SOLDER PADS DIMENSIONS

0.35 0.65
1. 0

5.9 0

1.95

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 NJM8080
SOP8
Unit: mm
■ PACKING SPEC
REEL DIMENSIONS / TAPING DIMENSIONS

F e e d d i r e c t i on

330

12
8
12.4 8

TAPING STATE

Insert direction

Sealing with covering tape

(TE2)

Empty tape Devices Empty tape

Feed direction Trailer 60pcs 2500pcs/reel Leader 60pcs

PACKING STATE

Label

Label

ESD Label

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 NJM8080
MSOP8 (TVSP8) MEET JEDEC MO-187-DA/THIN TYPE
Unit: mm
■ PACKING SPEC
TAPING DIMENSIONS
Fe ed d ir ec ti on
SYMBOL DIMENSION REMARKS
P2 P0 φD0 T A 4.4 BOTTOM DIMENSION
B 3.2 BOTTOM DIMENSION
D0 1.5 +0.1

E
0
D1 1.5 +0.1
0
E 1.75±0.1

F
F 5.5±0.05

W
P0 4.0±0.1
W1
B

P1 8.0±0.1
P2 2.0±0.05
T 0.30±0.05
T2 1.75 (MAX.)
A P1 φD1 T2
W 12.0±0.3
W1 9.5 THICKNESS 0.1max

REEL DIMENSIONS
W1

SYMBOL DIMENSION
C D A φ254±2
B φ100±1
C φ 13±0.2
B
A

D φ 21±0.8
E E 2±0.5
W 13.5±0.5
W1 2.0±0.2

TAPING STATE

Insert direction

Sealing with covering tape

(TE1)

Empty tape Devices Empty tape Covering tape

Feed direction more than 20pitch 2000pcs/reel more than 20pitch reel more than 1round

PACKING STATE
Label
Label

Put a reel into a box

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 NJM8080
SSOP8
Unit: mm
■ PACKING SPEC
TAPING DIMENSIONS
F e e d d i r e ct i o n
SYMBOL DIMENSION REMARKS
P2 P0 φ D0 T A 6.7 BOTTOM DIMENSION
B 3.9 BOTTOM DIMENSION

E
D0 1.55±0.05
D1 1.55±0.1

F
E 1.75±0.1

W
F 5.5±0.05
W1
B

P0 4.0±0.1
P1 8.0±0.1
P2 2.0±0.05
A P1 φ D1 T2 T 0.3±0.05
T2 2.2
W 12.0±0.3
W1 9.5 THICKNESS 0.1max

REEL DIMENSIONS
W1

SYMBOL DIMENSION
C D A φ254±2
B φ100±1
C φ 13±0.2
B
A

D φ 21±0.8
E E 2±0.5
W 13.5±0.5
W1 2±0.2

TAPING STATE

Insert direction

Sealing with covering tape

(TE1)

Empty tape Devices Empty tape Covering tape

Feed direction more than 20pitch 2000pcs/reel more than 20pitch reel more than 1round

PACKING STATE
Label Label

Put a reel into a box

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 NJM8080

■ RECOMMENDED MOUNTING METHOD

INFRARED REFLOW SOLDERING PROFILE

f
260°C e
230°C a Temperature ramping rate 1 to 4°C/s
220°C d
Pre-heating temperature 150 to 180°C
b
180°C Pre-heating time 60 to 120s
c Temperature ramp rate 1 to 4°C/s
150°C d 220°C or higher time shorter than 60s
e 230°C or higher time shorter than 40s
f Peak temperature lower than 260°C
g Temperature ramping rate 1 to 6°C/s
The temperature indicates at the surface of mold package.
Room
Temp.
a b c g

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 NJM8080

[ CAUTION ]

1. New JRC strives to produce reliable and high quality semiconductors. New JRC's semiconductors are intended for specific
applications and require proper maintenance and handling. To enhance the performance and service of New JRC's
semiconductors, the devices, machinery or equipment into which they are integrated should undergo preventative maintenance
and inspection at regularly scheduled intervals. Failure to properly maintain equipment and machinery incorporating these
products can result in catastrophic system failures

2. The specifications on this datasheet are only given for information without any guarantee as regards either mistakes or
omissions. The application circuits in this datasheet are described only to show representative usages of the product and not
intended for the guarantee or permission of any right including the industrial rights.
All other trademarks mentioned herein are the property of their respective companies.

3. To ensure the highest levels of reliability, New JRC products must always be properly handled.
The introduction of external contaminants (e.g. dust, oil or cosmetics) can result in failures of semiconductor products.

4. New JRC offers a variety of semiconductor products intended for particular applications. It is important that you select the
proper component for your intended application. You may contact New JRC's Sale's Office if you are uncertain about the
products listed in this catalog.

5. Special care is required in designing devices, machinery or equipment which demand high levels of reliability. This is
particularly important when designing critical components or systems whose failure can foreseeably result in situations that
could adversely affect health or safety. In designing such critical devices, equipment or machinery, careful consideration
should be given to amongst other things, their safety design, fail-safe design, back-up and redundancy systems, and diffusion
design.

6. The products listed in the catalog may not be appropriate for use in certain equipment where reliability is critical or where the
products may be subjected to extreme conditions. You should consult our sales office before using the products in any of the
following types of equipment.

Aerospace Equipment
Equipment Used in the Deep Sea
Power Generator Control Equipment (Nuclear, steam, hydraulic, etc.)
Life Maintenance Medical Equipment
Fire Alarms / Intruder Detectors
Vehicle Control Equipment (Airplane, railroad, ship, etc.)
Various Safety Devices

7. New JRC's products have been designed and tested to function within controlled environmental conditions. Do not use
products under conditions that deviate from methods or applications specified in this catalog. Failure to employ New JRC
products in the proper applications can lead to deterioration, destruction or failure of the products. New JRC shall not be
responsible for any bodily injury, fires or accident, property damage or any consequential damages resulting from misuse or
misapplication of its products. Products are sold without warranty of any kind, either express or implied, including but not
limited to any implied warranty of merchantability or fitness for a particular purpose.

8. Warning for handling Gallium and Arsenic (GaAs) products (Applying to GaAs MMIC, Photo Reflector). These products use
Gallium (Ga) and Arsenic (As) which are specified as poisonous chemicals by law. For the prevention of a hazard, do not burn,
destroy, or process chemically to make them as gas or power. When the product is disposed, please follow the related
regulation and do not mix this with general industrial waste or household waste.

9. The product specifications and descriptions listed in this catalog are subject to change at any time, without notice.

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