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    Suggested Pad Layout: Based On IPC-SM-782

    Uploaded by

    Wagner Ribeiro
    This document provides suggested pad layout dimensions for various surface mount package types including MiniMELF, MELF, SOD-323, SOT-323, SC-59, SOT-363, MiniDIP, DF-S, and D2PAK. The dimensions are given in millimeters for the length, width, center, and other reference points of the suggested pad patterns. It notes that the dimensions are nominal values for reference and the actual pad layout may vary depending on the application or fabrication requirements.

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    © All Rights Reserved
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    Suggested Pad Layout: Based On IPC-SM-782

    Uploaded by

    Wagner Ribeiro
    44 views2 pages
    This document provides suggested pad layout dimensions for various surface mount package types including MiniMELF, MELF, SOD-323, SOT-323, SC-59, SOT-363, MiniDIP, DF-S, and D2PAK. The dimensions are given in millimeters for the length, width, center, and other reference points of the suggested pad patterns. It notes that the dimensions are nominal values for reference and the actual pad layout may vary depending on the application or fabrication requirements.

    Original Description:

    Diodos ap02001

    Original Title

    ap02001

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    This document provides suggested pad layout dimensions for various surface mount package types including MiniMELF, MELF, SOD-323, SOT-323, SC-59, SOT-363, MiniDIP, DF-S, and D2PAK. The dimensions are given in millimeters for the length, width, center, and other reference points of the suggested pad patterns. It notes that the dimensions are nominal values for reference and the actual pad layout may vary depending on the application or fabrication requirements.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    44 views2 pages

    Suggested Pad Layout: Based On IPC-SM-782

    Uploaded by

    Wagner Ribeiro
    This document provides suggested pad layout dimensions for various surface mount package types including MiniMELF, MELF, SOD-323, SOT-323, SC-59, SOT-363, MiniDIP, DF-S, and D2PAK. The dimensions are given in millimeters for the length, width, center, and other reference points of the suggested pad patterns. It notes that the dimensions are nominal values for reference and the actual pad layout may vary depending on the application or fabrication requirements.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    of 2

    Suggested Pad Layout

    Based on IPC-SM-782

    Figure 1 MiniMELF
    MicroMELF MELF SOD-323 SOD-123 SMA SMB SMC
    Dimensions QuadroMELF
    Z 3.0 4.8 6.3 3.75 4.9 6.6 6.7 9.3
    G 1.4 2.1 3.3 1.05 2.5 1.5 1.8 4.4
    X 1.5 1.7 2.7 0.65 0.7 1.7 2.3 3.3
    Y 0.8 ref. 1.3 ref. 1.5 ref. 1.35ref. 1.2 ref. 2.6 ref. 2.5 ref. 2.5 ref.
    C 2.2 ref. 3.5 ref. 4.8 ref. 2.40ref. 3.7 ref. 4.2 ref. 4.3 ref. 6.8 ref.

    Y G

    Fig. 1

    Figure 2 Figure 3
    SOT-323 SOT-23 SC-59 SOT-363
    Dimensions Dimensions
    Z 2.8 3.4 4.0 Z 2.5
    G 1.0 0.7 1.2 G 1.3
    X 0.7 0.9 0.9 X 0.42
    Y 0.9ref. 1.4 ref. 1.4ref. Y 0.6ref.
    C 1.9ref. 2.0 ref. 2.6ref C 1.9ref.
    E 0.65ref. 0.9 ref. 0.95ref. E 0.65ref.

    E E

    Z G C
    G C
    Z

    Y
    X E
    X

    Fig. 2
    Fig. 3

    ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

    Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layout may vary depending on application.
    These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
    soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-SM-782, Surface
    Mount Design and Land Pattern Standard, and for International grid details, please see document IEC, Publication 97.

    AP02001 Rev. J 1 of 2 Suggested Pad Layout


    Figure 4 Figure 5
    MiniDIP DF-S D2PAK
    Dimensions Dimensions
    Z 8.1 11.5 Z 16.9
    G 4.4 6.9 X1 1.1
    X 0.9 1.3 X2 10.8
    Y 1.9 ref. 2.3 ref. Y1 3.5
    C 6.3 ref. 9.2 ref. Y2 11.4
    E 1.3 ref. 2.6 ref. C 9.5 ref.
    E1 2.5 ref.

    Y C

    Z G C E1
    X2

    X1

    Y1
    Y2
    X E

    Fig. 4 Fig. 5

    ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

    Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layout may vary depending on application.
    These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
    soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-SM-782, Surface
    Mount Design and Land Pattern Standard, and for International grid details, please see document IEC, Publication 97.

    AP02001 Rev. J 2 of 2 Suggested Pad Layout

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