Hiperrf Power Mosfets: Ixfh 12N50F Ixft 12N50F
Hiperrf Power Mosfets: Ixfh 12N50F Ixft 12N50F
Hiperrf Power Mosfets: Ixfh 12N50F Ixft 12N50F
TO-247 AD (IXFH)
PD TC = 25°C 180 W
Features
TJ -55 ... +150 °C l
RF capable MOSFETs
l
TJM 150 °C Double metal process for low gate
Tstg -55 ... +150 °C resistance
l
Low RDS (on) HDMOSTM process
TL 1.6 mm (0.063 in.) from case for 10 s 300 °C l
Rugged polysilicon gate cell structure
Md Mounting torque TO-264 0.4/6 Nm/lb.in. l
Unclamped Inductive Switching (UIS)
Weight TO-247 6 g rated
l
TO-264 4 g Low package inductance
- easy to drive and to protect
l
Fast intrinsic rectifier
Ciss 1870 pF
1 2 3 Terminals:
Coss VGS = 0 V, VDS = 25 V, f = 1 MHz 290 pF 1 - Gate
2 - Drain
Crss 90 pF 3 - Source
Tab - Drain
td(on) 11 ns
tr VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 • ID25 14 ns
td(off) RG = 4.7 W (External), 28 ns
tf 8 ns Dim. Millimeter Inches
Min. Max. Min. Max.
Qg(on) 54 nC A 4.7 5.3 .185 .209
A1 2.2 2.54 .087 .102
Qgs VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 • ID25 18 nC A2 2.2 2.6 .059 .098
Qgd 25 nC b 1.0 1.4 .040 .055
b1 1.65 2.13 .065 .084
b2 2.87 3.12 .113 .123
RthJC 0.65 K/W C .4 .8 .016 .031
RthCK (TO-247) 0.25 K/W D 20.80 21.46 .819 .845
E 15.75 16.26 .610 .640
e 5.20 5.72 0.205 0.225
L 19.81 20.32 .780 .800
L1 4.50 .177
Source-Drain Diode Characteristic Values ÆP 3.55 3.65 .140 .144
(TJ = 25°C, unless otherwise specified) Q 5.89 6.40 0.232 0.252
Symbol Test Conditions min. typ. max. R 4.32 5.49 .170 .216
S 6.15 BSC 242 BSC
IS VGS = 0 V 12 A
trr 250 ns
IRM 6.5 A
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025