Multilayer Ceramic Capacitors Soft Termination High Voltage Series (SH) X7R Dielectric 0805 To 1812 Sizes, 500V To 3Kv Rohs Compliance
Multilayer Ceramic Capacitors Soft Termination High Voltage Series (SH) X7R Dielectric 0805 To 1812 Sizes, 500V To 3Kv Rohs Compliance
Multilayer Ceramic Capacitors Soft Termination High Voltage Series (SH) X7R Dielectric 0805 To 1812 Sizes, 500V To 3Kv Rohs Compliance
1. INTRODUCTION
WTC Multilayer Ceramic Chip Capacitors supplied in tape & reel package are ideally suitable for thick-film hybrid
circuits and automatic surface mounting on any printed circuit boards. All of WTC’s MLCC products meet RoHS directive.
SH series use a special material between nickel-barrier and ceramic body. It provides excellent performance to
against bending stress occurred during process and provide more security for PCB process.
The nickel-barrier terminations are consisted of a nickel barrier layer over the silver metallization and then finished by
electroplated solder layer to ensure the terminations have good solderability. The nickel barrier layer in terminations
prevents the dissolution of termination when extended immersion in molten solder at elevated solder temperature.
2. FEATURES 3. APPLICATIONS
a. Withstanding 5mm of substrate bending. a. DC to DC converter.
b. High Voltage in a given case size. b. High voltage coupling/DC blocking.
c. High reliability and stability. c. Back-lighting inverters.
d. Snubbers in high frequency power convertors.
4. HOW TO ORDER
SH 21 B 102 K 102 C T
Series Size Dielectric Capacitance Tolerance Rated voltage Termination Packaging
SH=Soft 21=0805 (2012) B=X7R Two significant digits J=±5% Two significant C=Cu/Polymer T=7” reeled
termination 31=1206 (3216) followed by no. of zeros. K=±10% digits followed by Ag/Ni/Sn G=13” reeled
High Voltage 32=1210 (3225) And R is in place of M=±20% no. of zeros. And
42=1808 (4520) decimal point. R is in place of
43=1812 (4532) Eg. decimal point.
102=10x102
=1000pF 501=500 VDC
631=630 VDC
102=1000 VDC
202=2000 VDC
302=3000 VDC
Note 1: Please see below product range to find right termination code.
5. EXTERNAL DIMENSIONS
Size
L (mm) W (mm) T (mm) Symbol MB min(mm) L
Inch (mm)
0.80±0.10 B
0805 (2012) 2.00±0.20 1.25±0.10 0.30 T
1.25±0.10 D
1.25±0.10 D
1206 (3216) 3.20+0.4/-0.1 1.60±0.20 0.30
1.60±0.20 G W
1.25±0.10 D
1808 (4520) 4.50+0.60/-0.4 2.03±0.25 0.25 Fig. 1 The outline of MLCC
2.00±0.20 K
1.25±0.10 D
1812 (4532) 4.50+0.60/-0.4 3.20±0.30 0.25
2.00±0.20 K
Dielectric X7R
Size 0805, 1206, 1210, 1808, 1812
Capacitance* 100pF to 0.12uF
Capacitance tolerance** J (±5%), K (±10%), M (±20%)
Rated voltage (WVDC) 500V, 630V, 1000V, 2000V, 3000V
Tan δ* ≤2.5%
Insulation resistance at Ur*** ≥10GΩ or RxC≥500Ω-F whichever is smaller
Operating temperature -55 to +125°C
Capacitance characteristic ±15%
Termination Ni/Sn (lead-free termination)
* Measured at 25°C ambient temperature and 30~70% r elated humidity. Apply 1.0±0.2Vrms, 1.0kHz±10%.
** Preconditioning for Class II MLCC: Perform a heat treatment at 150±10°C for 1 hour, then leave in a mbient condition for 24±2 hours
before measurement.
***Measured at 500VDC for 60 sec, for UR>500VDC
7. PRODUCT RANGE
DIELECTRIC X7R
SIZE 0805 1206 1210 1808 1812
RATED VOLTAGE 500, 500, 500, 500,
1000 2000 1000 1000 2000 3000 1000 2000 3000
(VDC) 630 630 630 630
100pF (101) B
120pF (121) B
150pF (151) B D D D D D D
180pF (181) B D D D D D D
220pF (221) B D D D D D D
270pF (271) B D D D D D D
330pF (331) B D D D D D K
390pF (391) B D D D D D K
470pF (471) B D D D D D K D D D K
560pF (561) B D D D D D K D D D K
680pF (681) B D D D D D K D D D K
820pF (821) B D D G D D K D D D K
1,000pF (102) B D D G G G D K K D D D K
1,200pF (122) B D D G G D K D D D
1,500pF (152) B D D G G D K D D D
1,800pF (182) B D D G G D K D D K
2,200pF (222) B D D G G D D D K
Capacitance
2,700pF (272) B D D G G D D D K
3,300pF (332) B D D G G D D D K
3,900pF (392) B D D G G D D D K
4,700pF (472) D D D G G D D D K
5,600pF (562) D D D G G K D D
6,800pF (682) D D D G G K D D
8,200pF (822) D D D G G K D D
0.010µF (103) D D D G G K D D
0.012µF (123) D G D K
0.015µF (153) D G D K
0.018µF (183) D G D
0.022µF (223) G G D
0.027µF (273) G G D
0.033µF (333) G G D
0.039µF (393) G D
0.047µF (473) G D
0.056µF (563) G D
0.068µF (683) G K
0.082µF (823) K
0.10µF (104) K
0.12µF (124) K
5. Insulation To apply voltage at 500VDC for 60 sec. ≥10GΩ or RxC≥500Ω-F whichever is smaller.
Resistance
5 & 3 mm
11. Temperature * Conduct the five cycles according to the * No remarkable damage.
Cycle temperatures and time. * Cap change:X7R: within ±15%
Step Temp. (°C) Time (min.) * D.F. : ≤ 1.5 x initial requirement
1 Min. operating temp. +0/-3 30±3 * I.R. : ≥ 0.25 x initial requirement
2 Room temp. 2~3
3 Max. operating temp. +3/-0 30±3
4 Room temp. 2~3
* Before initial measurement (Class II only): Perform
150+0/-10°C for 1 hr and then set for 48±4 h rs at room
temp.
* Measurement to be made after keeping at room
temp. for 48±4 hrs.
12. Humidity * Test temp.: 40±2°C * No remarkable damage.
(Damp Heat) * Humidity: 90~95% RH * Cap change: X7R: within ±15%
Steady State * Test time: 500+24/-0hrs. * D.F. value: ≤7.0%
* Measurement to be made after keeping at room * I.R.: ≥1GΩ or RxC≥50Ω-F whichever is smaller.
temp. for 48±4 hrs.
13. High * Test temp.: X7R: 125±3°C * No remarkable damage.
Temperature * To apply voltage: * Cap change: X7R: within ±20%
Load 120% of rated voltage. * D.F. value: ≤7.0%
(Endurance) * Test time: 1000+24/-0 hrs. * I.R.: ≥1GΩ or RxC≥50Ω-F whichever is smaller.
* Measurement to be made after keeping at room
temp. for 48±4 hrs.
APPENDIXES
a. Customer name
b. WTC order series and item number
c. Customer P/O
d. Customer P/N
e. Description of product
f. Quantity
g. Bar code including quantity & WTC P/N or customer
h. WTC P/N
i. Shipping date
j. Order bar code including series and item numbers
k. Serial number of label
℃/ sec max
4℃
Fig. 5 Recommended reflow soldering profile for SMT process Fig. 6 Recommended wave soldering profile for SMT process
with SnAgCu series solder paste. with SnAgCu series solder.
Use middy activated rosin RA and RMA fluxes do not use activated flux. The amount of solder in each solder joint
should be controlled to prevent the damage of chip capacitors caused by the stress between solder, chips, and substrate.
Hand soldering with temperature-controlled iron not exceeding 30 watts and diameter of tip less than 1.2 mm is
recommended, tip of iron should not contact the ceramic body directly, and the temperature of iron should be set to not
more than 260℃.
For bigger chips such as 1210, 1808, 1812, 2220 and 2225, etc. wave soldering and hand soldering are no
recommended.