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Improved Insensitive Hytemp/DOA Bonded HMX and RDX Mixtures by Paste Process

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Technology Symposium

Improved Insensitive Hytemp/DOA Bonded


HMX and RDX Mixtures by Paste Process

Karl P. Rudolf

NDIA

2003 Insensitive Munitions and Energetic Materials


Technology Symposium
March 10 - 13, 2003

Orlando, FL, USA

A Company of
Diehl VA Systeme
Technology Symposium

Setting of Effort

German DoD on miniaturized electric detonator and insensitive boosters


required pressable insensitive high explosives
Ø at two initiation shock levels for NoGo (BICT-SSGT)
– 26 kbar (TL 1376-0800)
– 42,2 kbar (STANAG 4170)
Ø type V reaction at
– Bullet Impact Test 12,7 mm mild core
– Fast Cook Off Test
Intention: Use of an European made PBX W11 and PBX N9

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Technology Symposium

Setting of Effort (cont.)

Ø Inspection analyses show not sufficient shock insensitivity


Ø Additional treatment of this PBXN9 in our high shear mixer show
improvement of insensitivity close to the threshold of TL 1376-0800
Conclusion:
Ø Install own capabilities to develop and produce small batches of
insensitive pressable high explosives
Ø Develop process capable to use standard RDX and HMX crystals type B
– Reduce required specific pressure for pressing
– Use of the Hytemp 4454/DOA binder system
– Use of in-house DRAIS vertical finger and J+K high shear mixer
– Paste process using organic solvents only for additional treatment of the
HE crystals during mixing

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Technology Symposium

HE Crystals

HMX / RDX Type B

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Comparison
Slurry Process Paste Process

Hytemp
DOA
Solvent

Vacuum

HE-Crystals
Water

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Technology Symposium

Work Performed, First Step

Definition of a solvent (mixture) capable


Ø Smoothing HE type B crystal surfaces
Ø achieving a fully transparent lacquer of Hytemp/DOA
Ø having proper evacuation rates to separate HMX and RDX crystals
and keep them separated during coating of the crystals
Different solvents tested
Ø a proper candidate is a mix of Ethylacetate/Acetone

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Technology Symposium

Work Performed, First Step (cont.)


Reduction of specific pressing pressures
– Coarse grain: HMX or RDX class 3
– Fine grain: “45 µm” crystals allow additional
reduction of specific pressure
compared to “15 µm” crystals
to achieve t.m.d. of more than 98 %
Result:
Required specific pressures, fine grain “45 µm”, vacuum < 1 mbar; l/d ration up to 2
diameter kbar
22 mm 0,85
50 mm 0,70
105 mm 0,55
Note: Some values valid for harmonic trimodal mixtures, thus significant
weight reduction of pressing tools possible symposium report shows
values for non harmonic bimodal mixtures
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Technology Symposium

Work Performed, First Step (cont.)


Example of results from WIWEB/BWB STANAG 4170 Analyses
Versuch/Test DXP 1380, Charge 1 DXP 1380, Charge 2

Vakuumstabilität 0,05 ml/2,5 g 0,08m1/2,5 g

Schlagempfindlichkeit 7,5 Joule schlagempfindlich 7,5 Joule schlagempfindlich

Reibempfindlichkeit 160 N reibempfindlich 240 N reibempfindlich

thermische Empfindlichkeit # d=2 mm, D, wenig empfindlich

Stoßwellenempfindlichkeit R 38,80 kbar (10 mm WS), kR 30,40 kbar (13 R 42,20 kbar (9 mm WS), kR 35,70 kbar (11
mm WS) mm WS)
Cook-Off-Verhalten Typ 5 (Abbrand) unempfindlich Typ 5 (Abbrand) unempfindlich

Beschuss mit 12,7 mm Munition Typ 5 (Abbrand) unempfindlich Typ 5 (Abbrand) unempfindlich

Verpuffungstemperatur 279°C 278°C

Entzündlichkeit leicht entzündlich leicht entzündlich

elektrostat. Empfindlichkeit unempfindlich unempfindlich

Detonationsgeschwindigkeit - 8453 m/s - 8402 m/s

Gurneykonstante 2,38 mm/ps 2,34 mm/ps

E-Modul (aus Druckversuchen) 41,53 MPa (20°C); 116,80 MPa (-40°C) 22,41 MPa (20°C); 83,13 MPa (-40°C)

long. Schallgeschwindigkeit 2165 m/s (20°C); 2512 m/s (-30°C) 2121 m/s (20°C); 2493 m/s (-30°C)
vs
spez. Wärmekapazität 0,90 0,90
cp [Joule/(g*K)]
thermische Längenausdehnung im Mittel 6*10"5 °C1 im Mittel 6,5*10- °C"
Wärmeleitfähigkeit 0,47 W/m*K (bei Raumtemperatur) 0,47 W/m*K (bei Raumtemperatur)
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Technology Symposium

Qualified Pressable Insensitive High Explosives of Diehl;


Qualification in accordance with STANAG 4170 and TL 1376-0800

Status: 11.2001
1)
Type DXP 1380/1 DXP 1380/2 DXP 1340 DXP 2380 DXP 2340
HMX 92 92 96 - -
Composition RDX - - - 92 96
% Al - - - - -
Bindersystem 8 8 4 8 4
Density ρ (g/cm3) 1,74 1,76 1,8 1,68 1,7
Det. Velocity. Vo (m/s) 8450 8400 8600 8200 8350
Sensitivity GAP (K bar) 39/31 42/36 22/20 33/28 28/24
go/no go
Status qualified 2)
qualified 2)

WIWEB Doc.-No. 410/25830/01 410/25860/01 410/25861/0 410/25818/01


1
1)
differs from DXP 1380/1 by grain size distribution
2)
fulfills at present only TL 1376-0800 standard requirements

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Diehl VA Systeme
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Technology Symposium

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Diehl VA Systeme
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Technology Symposium

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Diehl VA Systeme
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Work Performed , First Step

Results:
Ø HMX and RDX mixtures with 8 % binder meet criteria of TL 1376-0800
Ø HMX mixtures show reduced SSGT shock sensitivity compared to RDX
Conclusion:
Additional reduction of porosities required to improve insensitivity
Ø HMX: remove crystals with high risk of increased internal porosities
Ø RDX: as above and use of improved HE crystals type A

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Technology Symposium

Work Performed , Second Step

Ø Remove high risk crystals


1.) maximum grain sizes 630 µm
2.) maximum grain sizes 500 µm
Results:
Ø no additional improvements of RDX / 8 % binder
Ø HMX 4 % binder meet all criteria of TL 1376-0800 at densities 1,81 - 1,82
g/cm3 (WIWEB-BWB results)
Ø HMX / 8 % binder meets “less sensitive” status of STANAG 4170
(WIWEB-BWB results)

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Work Performed , Second Step (cont.)

Improved RDX Crystals Type A


– iRDX / 8 % binder failed Fast Cook Off, no significant improvement of shock
insensitivity
– Fast Cook Off passed after addition of 5 % (+) HMX
– Coarse grain iRDX with milled fine grain iRDX show no improvement
– No different of SSGT results at 8 % or 6 % binder system
Insensitive RDX analyses are planned
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Technology Symposium

Work Performed , Second Step -- Results:


Ø Further improvements on Hytemp / DOA bonded RDX and HMX by solvents
process led to following results:
HMX / HMX / RDX / iRDX /
4% binder 8% binder 4% binder 4% binder

GAPtest 32,9 / 26 45,2 / 42,2 32,9 / 28 32,9 / 30,4


(kbar)
FCO Type V Type V Type V Failed

t.m.d * Slurry process

min 98%

Failure of iRDX / 8% binder was not expected due to improve crystallization.


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Technology Symposium

Paste Process
Advantages

Ø Use of type B crystals sufficient


Ø Significantly reduced sensitivities
Ø Significantly reduced specific pressures
Ø Complete recycling of solvents possible
Ø Quick improvement rework of mixtures possible
Ø Use of existing high shear or other composite propellant mixers
possible thus avoiding additional buildings and equipment

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Shaped Charge

Ø Shaped Charge 80mm


Ø DXP 1340/2, 0,9 kbar, 1,81 g/cm3
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Disadvantages

Ø Agglomeration of coated crystals more difficult to control


Ø Agglomerates tend to stick together during transportation and
storage
possible cure: dusting with Aerosil
Ø Standard primers e.g. K1, binder 14 to achieve sufficient wall
adhesion fail
cure: use WENKO Antirutschbeschichtung, qualification planned at
WIWEB-BWB

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Diehl VA Systeme
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Bomblet M77 Impact into 155 mm IHE

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Conclusions

Ø Today's HMX crystals Type B are sufficient for acceptable


insensitive HE mixtures
Improvement of HMX crystals will result in additional insensitivity
against shock stimuli
Ø Shock insensitivity improvement is expected to be achieved by use
of Insensitive RDX crystals only
Ø In both cases an additional reduction of binder system seems to be
possible to achieve sufficient insensitive pressable mixtures by
Paste Process using organic solvents

A Company of
Diehl VA Systeme
Technology-symposium-10-03-03 20

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Technology Symposium

Acknowledgements

Many thanks to my coworkers Mr. H. Hofmann and J. Licha for


the cooperation of Mr. Roland Wild, WIWEB-BWB and the
contribution of Mr. Richard Wild, Diehl

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Diehl VA Systeme
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