Improved Insensitive Hytemp/DOA Bonded HMX and RDX Mixtures by Paste Process
Improved Insensitive Hytemp/DOA Bonded HMX and RDX Mixtures by Paste Process
Improved Insensitive Hytemp/DOA Bonded HMX and RDX Mixtures by Paste Process
Karl P. Rudolf
NDIA
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Setting of Effort
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HE Crystals
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Comparison
Slurry Process Paste Process
Hytemp
DOA
Solvent
Vacuum
HE-Crystals
Water
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Stoßwellenempfindlichkeit R 38,80 kbar (10 mm WS), kR 30,40 kbar (13 R 42,20 kbar (9 mm WS), kR 35,70 kbar (11
mm WS) mm WS)
Cook-Off-Verhalten Typ 5 (Abbrand) unempfindlich Typ 5 (Abbrand) unempfindlich
Beschuss mit 12,7 mm Munition Typ 5 (Abbrand) unempfindlich Typ 5 (Abbrand) unempfindlich
E-Modul (aus Druckversuchen) 41,53 MPa (20°C); 116,80 MPa (-40°C) 22,41 MPa (20°C); 83,13 MPa (-40°C)
long. Schallgeschwindigkeit 2165 m/s (20°C); 2512 m/s (-30°C) 2121 m/s (20°C); 2493 m/s (-30°C)
vs
spez. Wärmekapazität 0,90 0,90
cp [Joule/(g*K)]
thermische Längenausdehnung im Mittel 6*10"5 °C1 im Mittel 6,5*10- °C"
Wärmeleitfähigkeit 0,47 W/m*K (bei Raumtemperatur) 0,47 W/m*K (bei Raumtemperatur)
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Status: 11.2001
1)
Type DXP 1380/1 DXP 1380/2 DXP 1340 DXP 2380 DXP 2340
HMX 92 92 96 - -
Composition RDX - - - 92 96
% Al - - - - -
Bindersystem 8 8 4 8 4
Density ρ (g/cm3) 1,74 1,76 1,8 1,68 1,7
Det. Velocity. Vo (m/s) 8450 8400 8600 8200 8350
Sensitivity GAP (K bar) 39/31 42/36 22/20 33/28 28/24
go/no go
Status qualified 2)
qualified 2)
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Results:
Ø HMX and RDX mixtures with 8 % binder meet criteria of TL 1376-0800
Ø HMX mixtures show reduced SSGT shock sensitivity compared to RDX
Conclusion:
Additional reduction of porosities required to improve insensitivity
Ø HMX: remove crystals with high risk of increased internal porosities
Ø RDX: as above and use of improved HE crystals type A
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min 98%
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Paste Process
Advantages
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Shaped Charge
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Disadvantages
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Conclusions
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Acknowledgements
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