TB2926HQ

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TOSHIBA Bi-CMOS Linear Integrated Circuit Silicon Monolithic

TB2926HQ
45 W × 4-ch BTL Audio Power IC

The TB2926HQ is a four-channel BTL power amplifier for car

audio applications.
This IC has a pure complementary P-ch and N-ch DMOS output
stage, offering maximum output power (POUT MAX) of 45 W.
It includes a standby switch, mute function and various
protection features.

Features
• High output power Weight: 7.7 g (typ.)
• POUT MAX (1) = 45 W (typ.)
(VCC = 15.2 V, f = 1 kHz, JEITA max, RL = 4 Ω)
• POUT MAX (2) = 43 W (typ.)
(VCC = 14.4 V, f = 1 kHz, JEITA max, RL = 4 Ω)
• POUT (1) = 26 W (typ.)
(VCC = 14.4 V, f = 1 kHz, THD = 10%, RL = 4 Ω)
• POUT (2) = 23 W (typ.)
(VCC = 13.2 V, f = 1 kHz, THD = 10%, RL = 4 Ω)
• Low THD: 0.007% (typ.) (VCC = 13.2 V, f = 1 kHz, POUT = 5 W, RL = 4 Ω)
• Low noise: VNO = 60 µVrms (typ.)
(VCC = 13.2 V, Rg = 0 Ω, BW = 20 Hz to 20 kHz, RL = 4 Ω)
• Standby switch (pin 4)
• Mute function (pin 22)
• Output DC offset detection (pin 25)
• Various protection features
Thermal overload; overvoltage; output short-circuits to GND, VCC and across the load; speaker current limiting
• Operating supply voltage: VCC (opr) = 8.0 to 18 V (RL = 4 Ω)

Note 1: Install the device correctly. Otherwise, the device or system may be degraded, damaged or even destroyed.

Note 2: The protection features are intended to avoid output short-circuits or other abnormal conditions temporarily. It
is not guaranteed that they will prevent the IC from being damaged.
Exposure to conditions beyond the guaranteed operating ranges may not activate the protection features,
resulting in an IC damage due to output short-circuits.

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Block Diagram

+B

C5

C3
C2
10 1 6 20
Ripple TAB VCC2 VCC1

C1 IN1
11 Out1 (+)
9

PW-GND1
8 RL
Out1 (−)
7

C1 IN2
12 Out2 (+)
5

PW-GND2
2 RL

13 Pre-GND Out2 (−)

3

C1 IN3
15 Out3 (+)
17
PW-GND3
18 RL
C6
16 AC-GND Out3 (−)
19

C1 IN4
14 Out4 (+)
21

PW-GND4
5V 24 RL
4 Stby Out4 (−)
Play 23
R1
Mute 22 Mute
C4

Offset/short 25

Some of the functional blocks, circuits or constants may be omitted from the block diagram or simplified for
explanatory purposes.

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Detailed Description
1. Standby Switch (pin 4)
The power supply can be turned on or off via
pin 4 (Stby). The threshold voltage of pin 4 is VCC
set at about 3 VBE (typ.). The power supply ON
current is about 0.01 µA (typ.) in the standby Power 10 kΩ
4 ≈ 2 VBE
state. OFF
to Bias
filter network
Standby Control Voltage (VSB): Pin 4

Standby Power VSB (V)

ON OFF 0 to 0.9
OFF ON 2.9 to VCC Figure 1 Setting Pin 4 High Turns on
Power
Check the pop levels when the time constant of
pin 4 is changed.

Benefits of the Standby Switch

(1) VCC can be directly turned on or off by a microcontroller, eliminating the need for a switching relay.

(2) Since the control current is minuscule, a low-current-rated switching relay can be used.

Relay
High-current-rated switch
Battery Battery

VCC VCC From

microcontroller

– Conventional Method –

Low-current-rated switch From microcontroller

Battery Battery

Standby VCC Standby VCC

– Using the Standby Switch –

Figure 2 Standby Switch

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2. Mute Function (pin 22)
The audio mute function is enabled by setting pin 22 Low. R1 and C4 determine the time constant of the
mute function. The time constant affects pop noise generated when power or the mute function is turned on
or off; thus, it must be determined on a per-application basis. (Refer to Figures 4 and 5.)
The value of the external pull-up resistor is determined, based on pop noise value.

For example, when the control voltage is changed from 5 V to 3.3 V, the pull-up resistor should be:
3.3 V/5 V × 47 kΩ = 31 kΩ

ATT – VMUTE
20
VCC = 13.2 V
f = 1 kHz
0
RL = 4 Ω

(dB)
VO = 20dBm
−20 BW = 400 Hz to 30 kHz

Mute attenuation ATT

−40
5V
−60

1 kΩ
22 −80
R1
C4 Mute On/Off
control −100

−120
0 0.5 1 1.5 2 2.5 3

Pin 22 control voltage: VMUTE (V)

Figure 3 Mute Function Figure 4 Mute Attenuation − VMUTE (V)

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3. DC Offset Detection
The purpose of the integrated DC offset detector is to avoid an anomalous DC offset on the outputs,
produced by the input capacitor due to leakage current or short-circuit.

V Positive DC offset (+)

(caused by RS1)

VCC/2 (normal DC voltage)

Leakage current
Vref or short-circuit Negative DC offset (−)
(caused by RS2)
+
RS1
Elec. vol
5V
RS2

−
Vref/2 Vbias
25 LPF To a microcontroller
A B The microcontroller shuts down the
system if the output is lower than
the specified voltage.

Figure 5 DC Offset Detection Mechanism

OUT(-)

Amp output VCC/2

Offset detection
threshold voltage
OUT(+)
GND
Time

Voltage at (A)
(pin 25)

GND
Time

Voltage at (B)
(LPF output)

GND
RS2 Time

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4. Layer Short Detection
The TB2926HQ may be properly connected to a load such as a 4-Ω speaker, but one of the speaker lines may
be shorted to ground through a low-impedance path. The TB2926HQ can detect such a condition.

VCC

IC out

SP = 4 Ω
out

GND

The negative (−) speaker connection is shorted to ground

through a low-impedance path due to some irregularities.

Figure 6 Layer Short

As is the case with output DC offset detection, pin 25 is also activated when there is a short on one of the
speaker lines as shown above. The detection impedance is 4.5 Ω (typ.).
This feature allows detection of a short-circuit through a low-impedance path other than the speaker
impedance. It helps to avoid speaker damage in case of anomalous system conditions and improve system
reliability.

Detection impedance vs junction temperature

12 Test conditions
Vcc = 13.2 V
10 Internal resistor
Detection impedance (Ω)

= 200 Ω
8 5 V-10 kΩ
Pull-up
6

0
-50 0 50 100 150 200
Tj (℃)

Figure 7 Typical Detection Impedance vs Junction Temperature (Intended as a Guide)

Note 3: The detection impedance varies with temperature, as shown above. Experiment with actual hardware.

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5. Prevention of speaker damage (in case of a layer short-circuit of the speaker)
When the DC resistance between the OUT+ and OUT− pins falls below 1 Ω, the output current exceeds 4 A.
At this time, the protection circuit is activated to limit the current draw into the speaker.
This feature prevents the speaker from being damaged, as follows:

< Speaker damaging scenario >

A DC current of over 4 V is applied to the speaker due to an external circuit failure (Note 4).
(Abnormal DC output offset)
↓
The speaker impedance becomes 1 Ω or less due to a layer short.
↓
A current of over 4 A flows into the speaker, damaging the speaker.

Current into the speaker

The short-circuit protection is activated

Less than 4 A

Speaker Impedance
About 1 Ω 4Ω

Figure 8

Note 4: An abnormal DC offset voltage is incurred when the input bias to the power IC is lost due to a leakage
current from a coupling capacitor at the input or a short-circuit between the IN and adjacent lines.

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6. Pop Noise Suppression
Since the TB2926HQ uses the AC-GND pin (pin 16) as the common input reference voltage pin for all
amplifiers, the ratio of the input capacitance (C1) to the AC-to-GND capacitance (C6) should be 1:4.
Also, if power is removed before C1 and C6 are completely charged, pop noise will be generated because of
unbalanced DC currents.
To avoid this problem, it is recommended to use a larger capacitor as C2 to increase the charging times of C1
and C6. Note, however, that C2 also affects the time required from power-on to audio output.
The pop noise generated by the muting and unmuting of the audio output varies with the time constant of
C4. A larger capacitance reduces the pop noise, but increases the time from when the mute control signal is
applied to C4 to when the mute function is enabled.

7. External Component Constants

Effects
Recommended
Component Purpose When lower than When higher than Notes
Value
recommended value recommended value
Pop noise is
Cut-off frequency is generated
C1 0.22 µF To eliminate DC Cut-off frequency is reduced.
increased. when VCC is
turned on.
C2 47 µF To reduce ripple Powering on/off is faster. Powering on/off is slower.
To provide
C3 0.1 µF sufficient Reduces noise and provides sufficient oscillation margin
oscillation margin
High pop noise. Duration until Low pop noise. Duration until
To reduce pop
C4 1 µF mute function is turned on/off mute function is turned on/off
noise
is short. is long.
C5 3900 µF Ripple filter Power supply humming and ripple filtering.
Pop noise is
Common
generated
C6 1 µF reference voltage Pop noise is suppressed when C1: C6 = 1:4.
when VCC is
for all input
turned on.

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Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Peak supply voltage (0.2 s) VCC (surge) 50 V

DC supply voltage VCC (DC) 25 V
Operating supply voltage VCC (opr) 18 V
Output current (peak) IO (peak) 9 A
Power dissipation PD (Note 7) 125 W
Operating temperature Topr −40 to 85 °C
Storage temperature Tstg −55 to 150 °C

Note 5: Package thermal resistance θj-T = 1°C/W (typ.) (Ta = 25°C, with infinite heat sink)
The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must
not be exceeded during operation, even for an instant.
If any of these ratings are exceeded during operation, the electrical characteristics of the device may be
irreparably altered and the reliability and lifetime of the device can no longer be guaranteed.
Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation
in other equipment. Applications using the device should be designed so that no absolute maximum rating
will ever be exceeded under any operating conditions.
Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set
forth in this document.

Electrical Characteristics
(VCC = 13.2 V, f = 1 kHz, RL = 4 Ω, Ta = 25°C unless otherwise specified)
Test
Characteristics Symbol Test Condition Min Typ. Max Unit
Circuit
Quiescent supply current ICCQ  VIN = 0  160 320 mA
POUT MAX (1)  VCC = 15.2 V, max POWER  45 
POUT MAX (2)  VCC = 14.4 V, max POWER  43 
Output power POUT MAX (3)  VCC = 13.7 V, max POWER  39  W

POUT (1)  VCC = 14.4 V, THD = 10%  26 

POUT (2)  THD = 10% 21 23 
Total harmonic distortion THD  POUT = 5 W  0.007 0.07 %
Voltage gain GV  VOUT = 0.775 Vrms 25 26 27 dB
Channel-to-channel voltage gain ∆GV  VOUT = 0.775 Vrms −1.0 0 1.0 dB
VNO (1)  Rg = 0 Ω, DIN45405  60 
Output noise voltage Rg = 0 Ω, µVrms
VNO (2)   60 70
BW = 20 Hz to 20 kHz
frip = 100 Hz, Rg = 620 Ω
Ripple rejection ratio R.R.  50 65  dB
Vrip = 0.775 Vrms
Rg = 620 Ω
Crosstalk C.T.   80  dB
POUT = 4 W
Output offset voltage VOFFSET   −90 0 90 mV
Input resistance RIN    90  kΩ
Standby current ISB  Standby condition, V4=0,V22=0  0.01 1 µA
VSB H  POWER: ON 2.9  VCC
Standby control voltage V
VSB L  POWER: OFF 0  0.9
VM H  MUTE: OFF 2.9  6.0
Mute control voltage V
VM L  MUTE: ON, R1 = 47 kΩ 0  0.9

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Test
Characteristics Symbol Test Condition Min Typ. Max Unit
Circuit
MUTE: ON、DIN_AUDIO
Mute attenuation ATT M  85 100  dB
VOUT = 7.75 Vrms → Mute: OFF
Upper cut-off frequency Fth  GV = 26dB, −3dB  250  kHz
Rpull-up = 10 kΩ, +V = 5.0 V
DC offset threshold voltage Voff-set  ±1.0 ±1.5 ±2.0 V
Out(+)-Out(-)
Rpull-up = 10 kΩ, +V = 5.0 V
channel (+) or (−) shorted to
Layer short detection impedance R half-short  2.0 4.5  Ω
GND, when between Rs
impedance output to GND.
Pin 25 saturation voltage Rpull-up = 10 kΩ, +V = 5.0 V
P25-Sat   100 500 V
(at each detector ON condition) (pin 25 = low)

Test Circuit

+B
C2: 47 µF

C3: 0.1 µF
3900 µF
10 1 6 20

C5:
Ripple TAB VCC2 VCC1

C1: 0.22 µF IN1

11 Out1 (+)
9

PW-GND1
8 RL = 4 ohm
Out1 (−)
7

C1: 0.22 µF IN2

12 Out2 (+)
5

PW-GND2
2 RL = 4 ohm
13 Pre-GND Out2 (−)
3

C1: 0.22 µF IN3

15 Out3 (+)
17
PW-GND3
18 RL = 4 ohm
C6: 1 µF
16 AC-GND Out3 (−)
19

C1: 0.22 µF IN4

14 Out4 (+)
21

PW-GND4
5V 24 RL = 4 ohm
4 Stby Out4 (−)
Play 23
R1: 47 kΩ
Mute 22 Mute
C4: 1 µF

Offset/short 25

Components in the test circuit are only used to determine the device characteristics.
It is not guaranteed that the system will work properly with these components.

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THD – POUT (ch1) THD – POUT (ch2)

100 100
VCC = 13.2 V VCC = 13.2 V
50 RL = 4 Ω 50 RL = 4 Ω
30 Filter 30 Filter
100 Hz : to 30 kHz 100 Hz : to 30 kHz
1kHz : 400 Hz to 30 kHz 1kHz : 400 Hz to 30 kHz
10 10
10 kHz : 400 Hz to 10 kHz : 400 Hz to
5 20 kHz : 400 Hz to 5 20 kHz : 400 Hz to
Total harmonic distortion THD (%)

Total harmonic distortion THD (%)

3 3

20 kHz 20 kHz
1 1

0.5 0.5
0.3 10 kHz 0.3 10 kHz

0.1 0.1

0.05 0.05
0.03 0.03

1 kHz 1 kHz
0.01 0.01

0.005 f = 100 Hz 0.005 f = 100 Hz

0.003 0.003

0.001 0.001
0.1 0.3 0.5 1 3 5 10 30 50 100 0.1 0.3 0.5 1 3 5 10 30 50 100

Output power POUT (W) Output power POUT (W)

THD – POUT (ch3) THD – POUT (ch4)

100 100
VCC = 13.2 V VCC = 13.2 V
50 RL = 4 Ω 50 RL = 4 Ω
30 Filter 30 Filter
100 Hz : to 30 kHz 100 Hz : to 30 kHz
1kHz : 400 Hz to 30 kHz 1kHz : 400 Hz to 30 kHz
10 10
10 kHz : 400 Hz to 10 kHz : 400 Hz to
5 20 kHz : 400 Hz to 5 20 kHz : 400 Hz to
Total harmonic distortion THD (%)

Total harmonic distortion THD (%)

3 3

20 kHz 20 kHz
1 1

0.5 0.5
0.3 10 kHz 0.3 10 kHz

0.1 0.1

0.05 0.05
0.03 0.03

1 kHz 1 kHz
0.01 0.01

0.005 f = 100 Hz 0.005 f = 100 Hz

0.003 0.003

0.001 0.001
0.1 0.3 0.5 1 3 5 10 30 50 100 0.1 0.3 0.5 1 3 5 10 30 50 100

Output power POUT (W) Output power POUT (W)

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THD – POUT (ch1) THD – POUT (ch2)

100 100
VCC = 13.2 V VCC = 13.2 V
50 RL = 4 Ω 50 RL = 4 Ω
30 f = 1 kHz 13.2 V 30 f = 1 kHz 13.2 V
Filter Filter
400 Hz to 30 kHz 400 Hz to 30 kHz
10 10

5 5
Total harmonic distortion THD (%)

Total harmonic distortion THD (%)

3 3

VCC = 9 V 16 V VCC = 9 V 16 V
1 1

0.5 0.5
0.3 0.3

0.1 0.1

0.05 0.05
0.03 0.03

0.01 0.01

0.005 0.005
0.003 0.003

0.001 0.001
0.1 0.3 0.5 1 3 5 10 30 50 100 0.1 0.3 0.5 1 3 5 10 30 50 100

Output power POUT (W) Output power POUT (W)

THD – POUT (ch3) THD – POUT (ch4)

100 100
VCC = 13.2 V VCC = 13.2 V
50 RL = 4 Ω 50 RL = 4 Ω
30 f = 1 kHz 13.2 V 30 f = 1 kHz 13.2 V
Filter Filter
400 Hz to 30 kHz 400 Hz to 30 kHz
10 10

5 5
Total harmonic distortion THD (%)

Total harmonic distortion THD (%)

3 3

VCC = 9 V 16 V VCC = 9 V 16 V
1 1

0.5 0.5
0.3 0.3

0.1 0.1

0.05 0.05
0.03 0.03

0.01 0.01

0.005 0.005
0.003 0.003

0.001 0.001
0.1 0.3 0.5 1 3 5 10 30 50 100 0.1 0.3 0.5 1 3 5 10 30 50 100

Output power POUT (W) Output power POUT (W)

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muteATT – f THD – f
0 3
VCC = 13.2 V VCC = 13.2 V
RL = 4 Ω RL = 4 Ω

Total harmonic distortion THD (%)

1
Mute attenuation muteATT (dB)

−20
VOUT = 7.75 Vrms (20dBm) POUT = 5 W

0.3 No filter
−40

0.1
−60
4 ch
0.03 1 ch
3 ch
−80
1 ch to 4 ch 0.01

−100
0.003 2 ch

−120 0.001
10 100 1k 10 k 100 k 0.01 0.1 1 10 100

frequency f (Hz) frequency f (Hz)

GV – f R.R. – f
40 0
VCC = 13.2 V
RL = 4 Ω
(dB)

Vrip = 0.775 Vrms (0dBm)

30 −20
Voltage gain GV (dB)

1 ch to 4 ch
R.R.
Ripple rejection ratio

20 −40

10 −60 3ch 2ch

VCC = 13.2 V 4ch
RL = 4 Ω
VOUT = 0.775 Vrms (0dBm) 1ch
0 −80
0.01 0.1 1 10 100 0.01 0.1 1 10 100

frequency f (Hz) frequency f (Hz)

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VIN – POUT (ch1) VIN – POUT (ch2)

40 40
20 kHz 10 kHz 10 kHz

100 Hz 100 Hz
1 kHz 1 kHz 20 kHz
(W)

(W)
30 30
POUT

POUT
20 20
Output power

Output power
10 10
VCC = 13.2 V VCC = 13.2 V
RL = 4 Ω RL = 4 Ω
No filter No filter
0 0
0 2 4 6 8 10 0 2 4 6 8 10

Input voltage VIN (Vrms) Input voltage VIN (Vrms)

VIN – POUT (ch3) VIN – POUT (ch4)

40 40
20 kHz 10 kHz 20 kHz

100 Hz 100 Hz
10 kHz 1 kHz
(W)

(W)

30 1 kHz 30
POUT

POUT

20 20
Output power

Output power

10 10
VCC = 13.2 V VCC = 13.2 V
RL = 4 Ω RL = 4 Ω
No filter No filter
0 0
0 2 4 6 8 10 0 2 4 6 8 10

Input voltage VIN (Vrms) Input voltage VIN (Vrms)

ICCQ – VCC PDMAX – Ta

2000 120
Allowable power dissipation PDMAX (W)

RL = ∞ (1) INFINITE HEAT SINK

RθJC = 1°C/W
VIN = 0 V
100
(mA)

(2) HEAT SINK (RθHS = 3.5°C/W

160
RθJC + RθHS = 4.5°C/W
(3) NO HEAT SINK
ICCQ

80 RθJA = 39°C/W
120 (1)
Quiescent Current

60

80
40

40
20 (2)
(3)
0 0
0 5 10 15 20 25 0 25 50 75 100 125 150

Supply voltage VCC (V) Ambient temperature Ta (°C)

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C.T. – f (ch1) C.T. – f (ch2)

0 0
VCC = 13.2 V VCC = 13.2 V
RL = 4 Ω RL = 4 Ω
VOUT = 0.775 Vrms (0dBm) VOUT = 0.775 Vrms (0dBm)
RG = 620 Ω RG = 620 Ω
−20 −20

(dB)
(dB)

Cross talk C.T.

Cross talk C.T.

−40 −40

CT (1-2)

CT (2-1)
−60 CT (1-3) −60 CT (2-3)

CT (1-4) CT (2-4)
−80 −80
10 100 1k 10 k 100 k 10 100 1k 10 k 100 k

frequency f (Hz) frequency f (Hz)

C.T. – f (ch3) C.T. – f (ch4)

0 0
VCC = 13.2 V VCC = 13.2 V
RL = 4 Ω RL = 4 Ω
VOUT = 0.775 Vrms (0dBm) VOUT = 0.775 Vrms (0dBm)
RG = 620 Ω RG = 620 Ω
−20 −20
(dB)

(dB)
Cross talk C.T.

Cross talk C.T.

−40 −40

−60 −60 CT (4-1)

CT (3-1)
CT (3-1)
CT (4-2)
CT (3-2) CT (4-3)
−80 −80
10 100 1k 10 k 100 k 10 100 1k 10 k 100 k

frequency f (Hz) frequency f (Hz)

VNO – Rg PD – POUT
300 80
VCC = 13.2 V f = 1 kHz
(µVrms)

RL = 4 Ω RL = 4 Ω
Filter: 4ch drive
(W)

20 Hz~20 kHz 60
200
Output noise voltage VNO

Power dissipation PD

18 V
40
16 V

100 13.2 V
1ch to 4ch
20

VCC = 9.0 V

0 0
10 100 1k 10 k 100 k 0 5 10 15 20 25 30

Signal source resistance Rg (Ω) Output power POUT (W)

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Package Dimensions

Weight: 7.7 g (typ.)

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• Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over
current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute
maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or
load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the
effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time
and insertion circuit location, are required.
• If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to
prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or
the negative current resulting from the back electromotive force at power OFF. For details on how to connect a
protection circuit such as a current limiting resistor or back electromotive force adsorption diode, refer to individual
IC datasheets or the IC databook. IC breakdown may cause injury, smoke or ignition.
• Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection
function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
• Carefully select external components (such as inputs and negative feedback capacitors) and load components
(such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as
input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to
a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current
can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load
(BTL) connection type IC that inputs output DC voltage to a speaker directly.
• Over current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the Over current protection circuits operate against the over current, clear the over current status
immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition,
depending on the method of use and usage conditions, if over current continues to flow for a long time after
operation, the IC may generate heat resulting in breakdown.
• Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the Thermal shutdown circuits
operate against the over temperature, clear the heat generation status immediately. Depending on the method of
use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to
not operate properly or IC breakdown before operation.
• Heat Radiation Design
When using an IC with large current flow such as power amp, regulator or driver, please design the device so that
heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition.
These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in
IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into
considerate the effect of IC heat radiation with peripheral components.
• Installation to Heat Sink
Please install the power IC to the heat sink not to apply excessive mechanical stress to the IC. Excessive
mechanical stress can lead to package cracks, resulting in a reduction in reliability or breakdown of internal IC chip.
In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the use of silicon
rubber is prohibited for the IC you intend to use, or not. For details of power IC heat radiation design and heat sink
installation, refer to individual technical datasheets or IC databooks.

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 TB2926HQ
www.DataSheet4U.com

RESTRICTIONS ON PRODUCT USE 060116EBA

• The information contained herein is subject to change without notice. 021023_D

• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety
in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such
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In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No responsibility
is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
021023_C

• The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E

About solderability, following conditions were confirmed

• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux

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