A 9GSps 1.125-GHz BW Oversampling Continuous-Time Pipeline ADC Achieving - 164dBFSpHz NSD
A 9GSps 1.125-GHz BW Oversampling Continuous-Time Pipeline ADC Achieving - 164dBFSpHz NSD
A 9GSps 1.125-GHz BW Oversampling Continuous-Time Pipeline ADC Achieving - 164dBFSpHz NSD
I. I NTRODUCTION
introduces artifacts such as signal aliasing and noise folding,
T HE advance of digital wireless and wired communica-
tion systems including fifth generation mobile networks
and data over cable service interface specification (DOCSIS)
and requires a high-peak ADC driving current to charge the
sampling capacitor. To mitigate these issues, the ADC is
now requires approximately 1 GHz of digitization bandwidth. typically driven by an anti-aliasing filter followed by a buffer
In such systems, maximizing the ADC’s dynamic range (sub- providing the peak driving current. These two blocks increase
ject to a power constraint) maximizes the receiver’s perfor- both system power consumption and system noise.
mance. Although ADCs are known to provide an efficient In high-dynamic-range and wide-bandwidth applications,
tradeoff between dynamic range and power consumption, an active anti-aliasing filter is especially costly in terms of
the need for oversampling ratios (OSRs) greater than 8 has, power consumption. Therefore off-chip LC or surface acoustic
until now, put them at a disadvantage compared to Nyquist wave passive filters are common in these applications, which
ADCs in terms of raw digitization bandwidth [1]–[5]. unfortunately prevent on-chip integration of the entire signal
In typical Nyquist ADCs, the input signal is sampled at processing chain.
the front end by a switched-capacitor circuit, and all internal The ADC driver often requires a significant fraction of the
signals are processed in discrete time (DT). The sampler ADC’s power consumption [6]–[9]. For example, the buffer
used in [8] requires 282 of 513 mW total power dissipation.
Manuscript received April 22, 2017; revised July 12, 2017; accepted Part of the reason is that the high-speed buffer is usually a
August 14, 2017. This paper was approved by Guest Editor Seung-Tak Ryu. Class-A or Class-AB amplifier, and thus the high-peak current
(Corresponding author: Hajime Shibata.)
H. Shibata, V. Kozlov, and S. Patil are with Analog Devices Canada, needed by a switched-capacitor sampler necessitates higher
Toronto, ON M5G2C8, Canada (e-mail: Hajime.Shibata@analog.com). power consumption.
Z. Ji was with Analog Devices Canada, Toronto, ON M5G2C8, Canada. In ADCs, both issues are alleviated by replacing the
He is now with the Massachusetts Institute of Technology, Cambridge,
MA 02139 USA. DT loop filter with a continuous-time (CT) implementation, as
A. Ganesan, H. Zhu, and D. Paterson are with Analog Devices Inc., shown in Fig. 1. In the CT implementation, sampling occurs
Wilmington, MA 01887 USA. at the end of the gain chain, thereby providing inherent anti-
J. Zhao is with Analog Devices Inc., San Jose, CA 95134 USA.
S. Pavan is with Analog Devices Canada, Toronto, ON M5G2C8, Canada, aliasing. Also, the resistive input structure reduces the peak
on leave from the Indian Institute of Technology, Madras, Chennai 600036, ADC driving current.
India. An ADC driving current comparison between CT and DT
Color versions of one or more of the figures in this paper are available
online at http://ieeexplore.ieee.org. structures is shown in Fig. 2. A DT system requires the
Digital Object Identifier 10.1109/JSSC.2017.2747128 charging current to almost decay to zero in a half clock cycle,
0018-9200 © 2017 IEEE. Personal use is permitted, but republication/redistribution requires IEEE permission.
See http://www.ieee.org/publications_standards/publications/rights/index.html for more information.
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Fig. 6. V -to-I , DAC output, and residue current signals in the primitive
CT pipeline ADC shown in Fig. 5.
Fig. 9. Input signal, DAC output signal, and residue signal in the frequency
domain.
Fig. 8. Input, DAC output, and residue current signals in the intermediate
CT pipeline ADC shown in Fig. 7.
Fig. 10. CT pipeline stage with delay alignment and low-pass filtering of
same value for an additional clock cycle. The net flash-DAC the DAC image.
transfer function is then represented as
IFS 1 − exp(−TCK s)
G FD (s) = exp(−TCK s) (7) envelope due to the non-return-to-zero time-domain DAC
VFS s
output waveform. In the residue waveform, the input signal
where IFS and VFS are DAC and flash full-scale ranges, component at 1 GHz is well suppressed. However, the DAC
respectively, and are designed such that VFS /IFS = R in order image signals remain without cancellation and dominate the
to cancel the input signal component in the residue. residue amplitude, as shown in Fig. 9.
This delay mismatch issue has already been discussed [11] In CT ADCs, the input signal can be reconstructed by
and resolved by attaching a prediction filter or a negative-delay digitizing the first Nyquist component alone; higher Nyquist
filter at the flash input. However, extending the bandwidth components are not necessary. Therefore, these DAC images
of negative-delay filters is difficult due to the requirement of can simply be removed by introducing low-pass filtering in the
causality. This limitation can be overcome by using a positive residue-amplifying transimpedance amplifier (TIA), as shown
delay in the V -to-I path, as shown in Fig. 7 [4], [14], [15]. in Fig. 10. The unity-gain frequency of the low-pass filter
This approach guarantees wide-bandwidth operation since a can be set at f S /2. With first-order low-pass filtering, the
positive delay can be implemented by passive components stage output voltage is bounded as shown in Fig. 11 and the
such as a transmission line or passive all-pass filters. By intro- saturation of the TIA can be avoided. A CT pipeline ADC
ducing the delay, the input signal and the DAC signal are now can then be made by cascading a sufficient number of these
well aligned and the residue remains small, especially in the stages.
middle of the clock cycle, as shown in Fig. 8. The input-referred quantization and the thermal noise con-
In a DT pipeline ADC, the residue amplitude is ideally tributions of the back-end stages increase with frequency due
bounded within 1/M of the full scale if an M-level flash and to the low-pass characteristics of the TIA. Therefore, a CT
DAC are used for the cancellation. However, the CT residue pipeline ADC behaves like a noise-shaped oversampled ADC.
amplitude at the clock edges is still higher than in the DT case Since each stage provides high gain up to about a quarter of
due to the saw-tooth residue waveform. the Nyquist frequency, an OSR of 4 is practical.
To understand the CT residue better, consider the frequency-
domain representations of the input signal, the DAC output
signal, and the residue signal shown in Fig. 9. The DAC C. Delay Line and Stage Transfer Function
generates a quantized version of the input signal in the first To realize the required 1.5 TCK delay with a transmission
Nyquist zone along with the image signals following a sinc line for a system clocked at f S = 1/TCK = 10 GHz, the trace
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Fig. 11. Time-domain waveform of the input current signal, DAC output
current signal, and the stage voltage output signal with and without the Fig. 13. Phase comparison of V -to-I paths, G DLY,RC and G DLY,LC , and
low-pass filtering. flash-DAC transconductance G FD .
Fig. 12. (a) RC lattice and (b) four-stage LC-lattice delay line structures
providing a differential impedance of R.
Fig. 14. Residue cancellation transfer functions G RES,LC and G RES,RC
normalized by a fixed conductance G 0 .
length on silicon is
1.5TCK c The quality of the cancellation can be evaluated by the
lTL = √ = 22 mm (8)
εr magnitude response of the residue signal provided into the
where c is the speed of light and εr is the relative dielectric TIA summing node. Such residue transfer function can be
constant of silicon. This length is not practical for integration represented as
even if the trace is folded. To make the implementation practi- G RES (s) = G DLY (s)−G FD (s) (11)
cal, a cascaded LC-lattice delay line or an RC-lattice delay line,
shown in Fig. 12, can be used. The transconductance transfer where G DLY (s) is either G DLY,LC(s) or G DLY,RC(s) depending
functions of the LC and RC delay structures in Fig. 12 are on the type of the delay element. The frequency responses
s 4
of (11) normalized by G 0 (s) are shown in Fig. 14. At the
1 1− √LC frequency f S /8, which is the band edge frequency for
G DLY,LC (s) = (9) OSR = 4, the LC and RC-lattice delay yield gains
R 1+ √s
LC
of −31 and −19 dB, respectively. These residue signal mag-
1 1 − 4sRC
G DLY,RC (s) = . (10) nitudes after cancellation are close to the quantization noise
R 1 + 4sRC level of a 4-bit quantizer (about −24 dB), so either the LC
The phase responses of (9), (10), and G FD (s) normalized by delay line or the RC delay line could be used, although the LC
G 0 (s) are shown in Fig. 13. It can be confirmed that both filter would be preferred for its better out-of-band cancellation
G DLY,RC(s) and G DLY,LC(s) match to G FD (s) for frequencies provided the increased silicon area is acceptable.
below f S /8. The LC lattice can be cascaded to extend the The cancellation error increases toward high frequencies
phase-matched bandwidth beyond that of the RC-lattice delay since the sinc roll off of G FD (s) is not matched by the
line. The RC lattice, however, can be implemented with less magnitude response of the V -to-I delay path. The low-pass
silicon area. filtering introduced in the TIA in Section II-B helps reduce
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Fig. 16. Input signal, DAC output signal, and residue signal in frequency
Fig. 15. Residue amplifier transfer function G 0 HTIA , and the overall stage domain with input signal at 0.9 f S .
transfer functions TSTG = G RES HTIA with the RC lattice, G RES,RC HTIA ,
and LC lattice, G RES,LC HTIA .
E. Signal Reconstruction in Digital Domain As shown in (19), the ADC output equals the input sig-
A CT pipeline ADC system diagram that includes the digital nal X 0 multiplied by a fixed coefficient G DLY /G DAC , which
reconstruction processing is shown in Fig. 18. The flash in is approximately unity in the signal band, plus-shaped quan-
each stage is modeled by a transfer function TF , and the tization noise as discussed in Section II-A. Equation (19)
aliasing and quantization noise at stage n + 1 is modeled by also shows that all quantization error and aliasing terms are
the additive term en where n = 0, 1, 2, …, N. The digital cancelled except for the term contributed by the last stage, e N .
output, Dn , of Stage n + 1 flash can then be expressed as Since |TF G DAC /G DLY | is approximately unity in the signal
band, (19) indicates that the in-band components of e N are
Dn = T F X n + e n (14) suppressed by a factor of (G DLY HTIA ) N .
The above observations of (19) still hold when the recon-
and the stage output X m+1 can be expressed as struction filters are implemented in DT if the DT filters
are derived by impulse-invariant transformation. The impulse-
X m+1 = HTIA (G DLY X m − G DAC Dm ) (15)
invariant transformation, A, from a CT function f CT (s) to a
where m = 0, 1, 2, …, N − 1. DT function f DT (z) can be defined as
Based on the discussion in Section II-A, assuming all the ∞
blocks in Fig. 18 can be effectively modeled in CT and all f DT (e j 2π f )= A[ f CT ( j 2π f )] = f CT ( j 2π( f + k f S )).
the optional filters TOPT0 to TOPT(N−1) are all unity with no k=−∞
delay, the transfer functions for the last reconstruction filter is (20)
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frequency ratio from the band edge frequency to the The other drawback of the CT pipeline is the digital
associated aliasing frequency in the second Nyquist zone signal reconstruction. Since the inter-stage gain has a low-
is 2 OSR−1 = 2. Thus, a ninth-order Chebyshev or sixth- pass response, reconstruction requires a multi-tap digital filter
order elliptic low-pass filter is needed in the DT system. for each stage, in contrast to the one-tap digital filter needed
In contrast in a system using a CT pipeline ADC with OSR by DT pipelines. This difference could increase the power
of 4, the transition frequency ratio is 7. Also, thanks to consumption needed for signal reconstruction in the CT case.
the inherent alias attenuation of 63 dB (see Section II-F) In [16], two 12-tap finite-impulse response (FIR) filters run-
offered by the CT pipeline ADC, the required alias attenuation ning at a quarter rate (2 GS/s) are used for a CT MASH
of the pre-filter is reduced to 80 dB − 63 dB = 17 dB. ADC with an OSR of eight. The 12-tap FIR filters consume
This requirement can easily be satisfied by a second-order approximately 2.2 mW/tap/GS/s in a 28-nm implementation.
Butterworth low-pass filter. If a similar FIR filter is used for the four back-end stages in
One might think that comparator metastability-induced error a five-stage CT pipeline ADC, the overall filter consisting of
can be higher in an oversampled CT pipeline ADC than a DT four 10-tap FIR filters running at a half rate (4.5 GS/s) will
pipeline for the same application BW since a higher clock require approximately 400 mW in a 28-nm implementation.
frequency is required. In CT ADCs, approximately 50% of The pros and cons of the CT and DT pipeline ADC discussed
the clock cycle can be allocated for the regeneration; on the in this section are summarized in Table I.
other hand, this is approximately 10% of the clock cycle in a
non-interleaved DT pipeline ADC as regeneration is typically III. C IRCUIT I MPLEMENTATION
expected to be completed in the clock’s non-overlap time [17].
Therefore, the absolute time period allocated for comparator A. ADC System
regeneration can be longer and metastability-induced error can A block diagram of the implemented CT pipeline ADC is
be smaller in CT ADCs for the same application BW. shown in Fig. 20. The ADC consists of seven CT residue-
The narrow clock frequency of a CT pipeline ADC can generation stages. The stage digital outputs are stored in an
be a potential drawback if wide clock frequency tunability is on-chip SRAM and read out through a serial interface. The
needed. If the clock frequency changes by more than 20% simplified schematics of Stages 1 and 2 are shown in Fig. 21.
(typical), component values have to be re-adjusted as in CT Each stage has a 17-level flash ADC, a 17-level unit-element
ADCs. When an LC lattice is used as a delay ele- current-steering DAC, a passive V -to-I delay structure, and a
ment, the clock frequency adjustability is limited since tuning TIA with low-pass filtering. The first stage has an additional
inductor values is generally difficult. This clock frequency voltage buffer driving the flash to minimize kickback noise.
flexibility is a benefit of DT ADCs. However, noise spectral Flashes and DACs are clocked at 9 GHz. Each stage generates
density (NSD) also changes depending on the clock frequen- a 17-level output with a 2-level dither signal. Stages 2 to 7 use
cies in DT ADCs, which are not desirable in communication identical circuit blocks. Supply voltages of 1.8, 1, and −1 V
applications. are provided to the ADC.
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Fig. 22. Simplified schematic of the operational amplifier used in the TIA. Common-mode feedback circuits are omitted for simplicity.
Fig. 28. Two-tone spectrum with signals applied at 980 and 1020 MHz. Fig. 30. SNR and SNDR versus amplitude with 200-MHz input signal.
Fig. 29. SNR versus amplitude plots with 200-MHz and 1-GHz input signals. Fig. 31. Measured SNR, SNDR, and SFDR over signal frequency along with
the simulated SNR using a behavioral model with 100-fs RMS clock jitter.
voltage mismatches in the DAC switches [18], which are not
calibrated, is the main source of the distortion.
SNR versus signal amplitude plots for single-tone inputs at
200 MHz and 1 GHz are shown in Fig. 29. The peak SNR for
200 MHz and 1 GHz cases are, respectively, 70 and 66 dB,
respectively, which correspond to −160- and −156-dBFS/Hz
large-signal average NSD over the 1125-MHz bandwidth. The
plot also confirms that the ADC achieves 73-dB dynamic
range or −164-dBFS/Hz small-signal average NSD. The 3-dB
difference between the dynamic range and the peak SNR in
the 200 MHz case is caused by DAC nonlinearity (spread out
by a dynamic element matching). The peak SNR difference
between the 200 MHz and 1 GHz cases is primarily due to
clock jitter.
Fig. 30 plots the SNR and signal-to-(noise + distortion)
ratio (SNDR) versus the amplitude of a single-tone input at Fig. 32. Measured inherent anti-aliasing with −4-dBm input signal.
200 MHz. The peak SNDR is 68 dB, which is 2 dB worse
than the peak SNR. Fig. 31 shows the measured SNR, SNDR,
and spurious-free dynamic range (SFDR) with different input at 1 GHz. As discussed in Section II-F, a CT pipeline provides
frequencies along with a simulated SNR using a behavioral inherent anti-aliasing, and that claim is supported by this
model assuming 100-fs RMS clock jitter. SNR and SNDR measurement result. As shown in Fig. 32, the ADC achieves
decrease when the input frequency increases due to the clock more than 68 dB alias rejection in the second- and third-
jitter. As Fig. 31 shows, the measurements are consistent with Nyquist zones. This result is 5 dB better than the behavioral
100 fs of clock jitter. The worst case SFDR is 73 dB. simulation results shown in Fig. 19 because the flash has its
Fig. 32 shows the measured anti-aliasing performance with own low-pass frequency response, which is not modeled in
a −4-dBm input signal, which corresponds to −10 dBFS the behavioral simulation. Also, the measurement parasitics
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Fig. 33. Maximum allowable signal generator amplitude and Stage 1 flash Fig. 35. Single-tone spectrum with 6-dBm signal applied at 8347.36 MHz
output D0 versus frequency. showing the aliasing behavior. The clock frequency is 8847.36 MHz.
Fig. 36. ADC (a) Stage 1 and (b) Stage 2 digital output signals with 6-dBm signal applied at 8347.36 MHz. The clock frequency is 8847.36 MHz.
TABLE II
ADC P ERFORMANCE C OMPARISONS . ∗ DRF P OWER C ONSUMPTION I S AN E STIMATED VALUE
R EFERENCES
[1] M. Bolatkale, L. J. Breems, R. Rutten, and K. A. A. Makinwa, Hajime Shibata (S’99–M’02) received the B.E. and
“A 4 GHz continuous-time ADC with 70 dB DR and M.E. degrees in electrical engineering from the Uni-
−74 dBFS THD in 125 MHz BW,” IEEE J. Solid-State Circuits, vol. 46, versity of Electro-Communications, Tokyo, Japan,
no. 12, pp. 2857–2868, Dec. 2011. in 1997 and 1999, respectively, and the Dr. Eng.
[2] H. Shibata et al., “A DC-to-1 GHz tunable RF ADC achieving degree from the Tokyo Institute of Technology,
DR = 74 dB and BW = 150 MHz at f0 = 450 MHz using 550 mW,” Tokyo, in 2002.
IEEE J. Solid-State Circuits, vol. 47, no. 12, pp. 2888–2897, Dec. 2012. Since 2002, he has been with Analog Devices,
[3] S.-H. Wu, T. -K. Kao, Z.-M. Lee, P. Chen, and J.-Y. Tsai, where he is currently focusing on continuous-time
“A 160 MHz-BW 72 dB-DR 40 mW continuous-time modulator and continuous-time pipeline analog-to-digital
in 16 nm CMOS with analog ISI-reduction technique,” in IEEE Int. converter designs.
Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2016, Dr. Shibata was a co-recipient of the Beatrice
pp. 280–281. Winner Award at ISSCC 2006.
This article has been accepted for inclusion in a future issue of this journal. Content is final as presented, with the exception of pagination.
Victor Kozlov (M’16) received the B.A.Sc. (Hons.) Jialin Zhao (M’09) received the M.S. and Ph.D.
and M.S. degrees in electrical engineering from degrees in electrical engineering from the University
the University of Toronto, Toronto, ON, Canada, of Notre Dame, Notre Dame, IN, USA, in 2004 and
in 2012 and 2015, respectively. 2007, respectively.
He is currently a Design Engineer with Analog From 2006 to 2008, he was a Device Modeling
Devices, Toronto, where he focused on high-speed Engineer with Analog Devices, Wilmington, MA,
continuous-time delta-sigma converters. USA, focused on PSP MOSFET model for next gen-
eration CMOS. In 2008, he joined Mediatek Wire-
less Inc., Woburn, MA, USA, where he focused on
wide-bandwidth continuous-time delta-sigma mod-
ulator for wireless communication chipsets. He is
currently a Design Engineer with Analog Devices, San Jose, CA, USA.
Zexi Ji (S’17) received the B.A.Sc. degree in engi-
neering science with a major in electrical and com-
puter engineering from the University of Toronto,
Toronto, ON, Canada, in 2016. He is currently pur-
suing the S.M. degree in electrical engineering and
computer science with the Massachusetts Institute of
Technology, Cambridge, MA, USA. Sharvil Patil (S’12–M’17) received the B.E. (Hons.)
He was an IC Design Intern at Analog Devices, degree from the Birla Institute of Technology and
Toronto Design Center, Toronto, from 2014 to 2015. Science, Pilani, India, in 2009, and the M.S. and
Ph.D. degrees from Columbia University, New York,
NY, USA, in 2012 and 2017, respectively.
Between 2010 and 2011, he was with ST Micro-
Asha Ganesan (S’08–M’12) received the B.E. electronics, India, where he designed high-speed
degree in electronics and communication engineer- digital-to-analog converters. He is currently with
ing from the College of Engineering, Guindy, Chen- Analog Devices, Inc., Toronto, ON, Canada, where
nai, India, in 2012, and the master’s degree in he designs high-speed data converters.
electrical and computer engineering from Cornell
University, Ithaca, NY, USA, in 2015.
She was an Applications Engineer with Cypress
Semiconductor Corporation, Bengaluru, India. She
joined Analog Devices, Inc., Wilmington, MA,
USA, in 2015, focused on designing signal process-
ing and calibration based digital blocks.
Shanthi Pavan (M’04–SM’12) received the B.Tech.
degree in electronics and communication engineer-
Haiyang Zhu (M’11) received the B.S. and M.S. ing from the Indian Institute of Technology, Madras,
degrees in electrical engineering from Shanghai Chennai, India, in 1995, and the M.S and Sc.D.
Jiao Tong University, Shanghai, China, in 2000 and degrees from Columbia University, New York, NY,
2003, respectively, the Ph.D. degree in electrical USA, in 1997 and 1999, respectively.
engineering from Northeastern University, Boston, From 1997 to 2000, he was with Texas Instru-
MA, USA, in 2016. ments, Warren, NJ, USA, where he focused on
He has been with Analog Devices, Inc., high-speed analog filters and data converters. From
Wilmington, MA, USA, since 2006, focusing on 2000 to 2002, he involved in microwave ICs for data
designing high-speed data converters. communication at Bigbear Networks, Sunnyvale,
Dr. Zhu was a co-recipient of the 2013 IEEE CA, USA. Since 2002, he has been with the Indian Institute of Technology-
Journal of Solid-State Circuits Best Paper Award. Madras, where he is currently a Professor of electrical engineering. His
current research interests include high-speed analog circuit design and signal
processing.
Donald Paterson (M’96) received the B.Sc. degree Dr. Pavan was a recipient of several awards, including the Shanti Swarup
in electronics and physics from the University of Bhatnagar Award in Engineering Sciences in 2012, the IEEE Circuits and Sys-
Edinburgh, Edinburgh, U.K., in 1987. tems Society Darlington Best Paper Award in 2009, and the Swarnajayanthi
He has been with Analog Devices Inc., Fellowship (from the Government of India in 2010). He has been the
Wilmington, MA, since 1996, where his focus Editor-in-Chief of the IEEE T RANSACTIONS ON C IRCUITS AND S YSTEMS :
in the High Speed Converter group has been on PART I—R EGULAR PAPERS in 2014 and 2015, and earlier served on the
highly integrated mixed-signal chips for imaging Editorial Board of the IEEE T RANSACTIONS ON C IRCUITS AND S YSTEMS
and communications applications. PART II—E XPRESS B RIEFS in 2006 and 2007. He served on the Technical
Program Committee of the ISSCC, and as a Distinguished Lecturer of the
IEEE Solid State Circuits Society. He is a fellow of the Indian National
Academy of Engineering.