LDC0851EVM: User's Guide
LDC0851EVM: User's Guide
LDC0851EVM: User's Guide
LDC0851EVM
The Texas Instruments LDC0851 evaluation module (EVM) helps designers evaluate the operation and
performance of the LDC0851 Inductive Switch. The EVM contains one LDC0851 soldered onto the EVM
PCB and options to operate with battery or USB power. A 50-kΩ trim pot is also included to change the
switching distance threshold making it easy to evaluate for a wide variety of use cases.
Figure 1. LDC0851EVM
Contents
1 EVM Features and Connections ........................................................................................... 3
2 Theory of Operation ......................................................................................................... 6
3 Quick Start Guide .......................................................................................................... 10
4 EVM Design – Board Layout ............................................................................................. 14
5 EVM Design - Schematic .................................................................................................. 16
6 EVM Bill of Materials ....................................................................................................... 18
List of Figures
1 LDC0851EVM ................................................................................................................ 1
2 EVM Block Diagram ......................................................................................................... 3
3 Connector and Feature Locations (Top) .................................................................................. 4
4 Connector and Feature Locations (Bottom) .............................................................................. 4
5 EVM Break-Away Sections ................................................................................................. 5
6 Break-Away Sensor (Top) .................................................................................................. 5
7 Break-Away Sensor (Bottom) .............................................................................................. 5
8 Simplified Block Diagram for Stacked Coils .............................................................................. 6
9 Switch Distance with Offset ................................................................................................ 7
List of Tables
1 Device and Package Configurations ...................................................................................... 1
2 EVM Connections............................................................................................................ 3
3 LED Indicator Behavior with GUI .......................................................................................... 4
4 LDC0851EVM Sensor Parameters ........................................................................................ 6
5 Resistor Values for ADJ Code ............................................................................................. 8
6 Battery Requirements...................................................................................................... 11
7 Layer Usage ................................................................................................................ 14
8 Bill of Materials ............................................................................................................. 18
Trademarks
All trademarks are the property of their respective owners.
VDD
VDD LSENSE Sensor
5V µUSB 5V LP5951 Coin Cell Battery J1 20 mm O.D.
(J3) 3.0-V Out LDO CR2032 - 3.0 V LR LR 7 turns/layer
1.8V ADJ LDC0851 LREF
(BT1) LS LS 6 mil trace
LSENSE
(WSON8) LC LC 6 mil space
3.0 V 3.0 V 2 Layer
LCOM 6.2 µH
J4 50-kO Trim Pot EN OUT LREF Sensor
USB BAT (R5)
Output
Supply Switch, SPDT LED
(S2) VDD (D3)
VDD
VDD
Enable Toggle Switch, SPDT
(S2)
The LDC0851 EVM can be broken into 3 discrete sections: a 5-V to 3-V section which includes the USB
interface section, an LDC0851 section, and a sensor section which contains the LREF and LSENSE
sensors.
Break-Away Sensor Section: The Sensor section of the LDC0851EVM can be broken along the
indicated line to separate the sensor from the LDC0851 IC. A three pin header is available on the
LDC0851 section to connect to different sensors or for remote location. If the cable connection between
the sensor and the LDC0851EVM is longer than 2 cm, use twisted pair or coaxial to connect back to the
LDC0851 section.
The EVM sensor is a 4 layer stacked coil design, with the top 2 layers used for the sensing coil, and the
bottom 2 layers used for the reference coil.
2 Theory of Operation
The LDC0851 is an inductance based switch for contactless and robust applications such as presence
detection, event counting, and coarse position detection. The device is connected to a reference coil
(LREF) and a sensing coil (LSENSE). The output of the LDC0851 switches when the inductance of
LSENSE drops below LREF which is caused by an approaching metal target. The LDC0851 EVM
employs a stacked coil arrangement, in which the LSENSE sensor coil is closer to the metal target than
the LREF reference coil when approached from the top side (LSENSE side). The user can take advantage
of the Offset Adjust feature to change the switching distance (dswitch). The offset is added to LREF so
that increasing the ADJ code causes the LDC0851 to switch at a closer distance. The ADJ code is
determined by the voltage level on the ADJ pin at device power on and by toggling the Enable pin low
then high.
LDC0851
LSENSE
Switching distance set
by ADJ Value
LCOM
ADJ =1 ADJ =15
Sensor
Cap Mode Select
VDD 0: Reference switch
1 ± 15: Threshold Adjust
R3
53.6 k
ADJ
4-bit ADC
R5
50 k
R4
3.56 k
Coil
Inductance
LSENSE
Adjusted LREF
(ADJ = 1)
Y Adjusted LREF
(ADJ = 15)
Target
dswitch dswitch Distance
C 0.3x(dcoil)
(ADJ = 15) (ADJ = 1)
Figure 9. Switch Distance with Offset
A potentiometer (R5) has been included to make adjusting the threshold easier for prototyping. Note that
rotating the potentiometer clockwise towards the MIN direction decreases the ADJ value and results in a
longer switching threshold. Similarly, rotating R5 counter clockwise towards the MAX position increases
the ADJ value and decreases the switching distance. The Enable pin should be toggled low then high to
set a new switching threshold.
The ADJ value can be achieved by setting the combination of R4 + R5 to the values in Table 5.
The switching distance for stacked coils can be approximated with Equation 1.
§ ADJCode ·
dswitch dcoil u 0.3x ¨ 1 ¸
© 16 ¹
where
• dswitch is the approximated switching distance for a stacked coil sensor with good separation between
LSENSE coil layers and LREF coil layers. Note that for side-by-side coils, the switching distance uses
a factor of 0.4.
• dcoil is the coil diameter
• ADJCode is the desired value from Table 5 (1)
For example, consider a coil with a diameter of 20 mm. An ADJ code of 1 yields a switching distance of
5.6 mm, and an ADJ code of 15 yields a switching distance of 0.375 mm. This method helps approximate
the switching distance, but the actual response of the coils may vary slightly which is why it is important to
prototype the coil as can be seen in Figure 11 below.
8
Switch ON
7 Switch OFF
0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
ADJ Code D001
It should be noted that the sensing distance is determined by the diameter of the coils, inductance
matching, and the spacing or PCB thickness between the LSENSE coil and LREF coil layers. To achieve
the maximum sensing range for stacked coils, the spacing (h) between the LSENSE and LREF coils
should be as thick as possible. Refer to Figure 12 below.
Layers 1, 2
Sense Coil
Layers 3, 4
Reference Coil
Figure 12. Stacked Coil Separation
It is also recommended to use a target of equal or larger size to the coil diameter to get the longest
sensing range.
When the EVM is powered by the battery, it is not necessary to have a micro-USB cable connected to J3.
Insert CR2032 battery in the slot (BT1) on the back of the board. A voltage of 3.0 V can be measured at
the BAT test point shown below.
To set a new threshold, toggle the EN RESET switch (S1) to re-sample the ADJ pin. This must be done
every time a new threshold is set.
Bring a conductive target close to the LSENSE coil. The OUT LED (D3) should turn on when the target is
1 to 8 mm above the EVM sensing coil depending on the ADJ value.
To change the switching threshold simply adjust the value of R5, toggle EN with S1 and retest. Note that
during active operation the ADJ pin draws ~10 µA of current will alter the resistance reading if using a
multi meter to check the value. In order to properly set or check the ADJ resistance when using a multi
meter, turn off the device, remove the battery, and set S2 to BAT. The resistance measured across R4 +
R5 should be set according to Table 5 for a desired ADJ setting.
This process can be repeated and fine-tuned for a variety of applications including open/close proximity
switches, white goods, home security and tamper detection, e-meters, and printers.
ATTENTION
STATIC SENSITIVE DEVICES
HANDLE ONLY AT
STATIC SAFE WORK STATIONS
CAUTION
The EVM contains components that can potentially be damaged by electrostatic
discharge. Always transport and store the EVM in the supplied ESD bag when
not in use. Handle using an antistatic wristband. Operate on an antistatic work
surface. For more information on proper handling, refer to Electrostatic
Discharge (ESD)[SSYA010].
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your non-
compliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated