Data Sheet: 860 MHZ, 34 DB Gain Push-Pull Amplifier
Data Sheet: 860 MHZ, 34 DB Gain Push-Pull Amplifier
Data Sheet: 860 MHZ, 34 DB Gain Push-Pull Amplifier
DATA SHEET
dbook, halfpage
M3D252
BGY888
860 MHz, 34 dB gain push-pull
amplifier
Product specification 2001 Oct 25
Supersedes data of 1999 Mar 30
NXP Semiconductors Product specification
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER MIN. MAX. UNIT
Vi RF input voltage 55 dBmV
Tstg storage temperature 40 +100 C
Tmb operating mounting base temperature 20 +100 C
2001 Oct 25 2
NXP Semiconductors Product specification
CHARACTERISTICS
Table 1 Bandwidth 40 to 860 MHz; VB = 24 V; Tcase = 30 C; ZS = ZL = 75
Notes
1. fp = 55.25 MHz; Vp = 44 dBmV;
fq = 805.25 MHz; Vq = 44 dBmV;
measured at fp + fq = 860.5 MHz.
2. Measured according to DIN45004B:
fp = 851.25 MHz; Vp = Vo;
fq = 858.25 MHz; Vq = Vo6 dB;
fr = 860.25 MHz; Vr = Vo 6 dB;
measured at fp + fq fr = 849.25 MHz.
3. The module normally operates at VB = 24 V, but is able to withstand supply transients up to 30 V.
2001 Oct 25 3
NXP Semiconductors Product specification
Notes
1. fp = 55.25 MHz; Vp = 44 dBmV;
fq = 805.25 MHz; Vq = 44 dBmV;
measured at fp + fq = 860.5 MHz.
2. Measured according to DIN45004B:
fp = 851.25 MHz; Vp = Vo;
fq = 858.25 MHz; Vq = Vo 6 dB;
fr = 860.25 MHz; Vr = Vo 6 dB;
measured at fp + fq fr = 849.25 MHz.
3. The module normally operates at VB = 24 V, but is able to withstand supply transients up to 30 V.
2001 Oct 25 4
NXP Semiconductors Product specification
Notes
1. fp = 55.25 MHz; Vp = 44 dBmV;
fq = 691.25 MHz; Vq = 44 dBmV;
measured at fp + fq = 746.5 MHz.
2. Measured according to DIN45004B:
fp = 740.25 MHz; Vp = Vo;
fq = 747.25 MHz; Vq = Vo6 dB;
fr = 749.25 MHz; Vr = Vo 6 dB;
measured at fp + fq fr = 738.25 MHz.
3. The module normally operates at VB = 24 V, but is able to withstand supply transients up to 30 V.
2001 Oct 25 5
NXP Semiconductors Product specification
Notes
1. fp = 55.25 MHz; Vp = 44 dBmV;
fq = 541.25 MHz; Vq = 44 dBmV;
measured at fp + fq = 596.5 MHz.
2. Measured according to DIN45004B:
fp = 590.25 MHz; Vp = Vo;
fq = 597.25 MHz; Vq = Vo 6 dB;
fr = 599.25 MHz; Vr = Vo 6 dB;
measured at fp + fq fr = 588.25 MHz.
3. The module normally operates at VB = 24 V, but is able to withstand supply transients up to 30 V.
2001 Oct 25 6
NXP Semiconductors Product specification
PACKAGE OUTLINE
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads SOT115J
D
E Z p
A2
1 2 3 5 7 8 9
A
L
F
W e b w M
c
e1
d
U2 Q q2 y M B
B q1 x M B
y M B
p
U1 q
0 5 10 mm
scale
04-02-04
SOT115J
10-06-18
2001 Oct 25 7
NXP Semiconductors Product specification
DOCUMENT PRODUCT
DEFINITION
STATUS(1) STATUS(2)
Objective data sheet Development This document contains data from the objective specification for product
development.
Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
2001 Oct 25 8
NXP Semiconductors Product specification
NXP Semiconductors does not accept any liability related Export control This document as well as the item(s)
to any default, damage, costs or problem which is based described herein may be subject to export control
on any weakness or default in the customer’s applications regulations. Export might require a prior authorization from
or products, or the application or use by customer’s third national authorities.
party customer(s). Customer is responsible for doing all
Quick reference data The Quick reference data is an
necessary testing for the customer’s applications and
extract of the product data given in the Limiting values and
products using NXP Semiconductors products in order to
Characteristics sections of this document, and as such is
avoid a default of the applications and the products or of
not complete, exhaustive or legally binding.
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this Non-automotive qualified products Unless this data
respect. sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
Limiting values Stress above one or more limiting
product is not suitable for automotive use. It is neither
values (as defined in the Absolute Maximum Ratings
qualified nor tested in accordance with automotive testing
System of IEC 60134) will cause permanent damage to
or application requirements. NXP Semiconductors accepts
the device. Limiting values are stress ratings only and
no liability for inclusion and/or use of non-automotive
(proper) operation of the device at these or any other
qualified products in automotive equipment or
conditions above those given in the Recommended
applications.
operating conditions section (if present) or the
Characteristics sections of this document is not warranted. In the event that customer uses the product for design-in
Constant or repeated exposure to limiting values will and use in automotive applications to automotive
permanently and irreversibly affect the quality and specifications and standards, customer (a) shall use the
reliability of the device. product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and
Terms and conditions of commercial sale NXP
specifications, and (b) whenever customer uses the
Semiconductors products are sold subject to the general
product for automotive applications beyond NXP
terms and conditions of commercial sale, as published at
Semiconductors’ specifications such use shall be solely at
http://www.nxp.com/profile/terms, unless otherwise
customer’s own risk, and (c) customer fully indemnifies
agreed in a valid written individual agreement. In case an
NXP Semiconductors for any liability, damages or failed
individual agreement is concluded only the terms and
product claims resulting from customer design and use of
conditions of the respective agreement shall apply. NXP
the product for automotive applications beyond NXP
Semiconductors hereby expressly objects to applying the
Semiconductors’ standard warranty and NXP
customer’s general terms and conditions with regard to the
Semiconductors’ product specifications.
purchase of NXP Semiconductors products by customer.
No offer to sell or license Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
2001 Oct 25 9
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Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
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Printed in The Netherlands R77/05/pp10 Date of release: 2001 Oct 25