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PCB Design Engineer Questionnaire: General Instructions

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PCB Design Engineer Questionnaire

General Instructions

1. You are free to use any tool (for schematics and layout) of your choice and you can also
use the question sheet itself to add any other explanation if you want.
2. As an output you should give us the viewer files of the schematics and layout along with
question paper (if you have added any extra there) for our evaluation.
3. If the question is not clear to you, please write to us for required information.
4. Problems that require calculations, should have proper formulae and answer should have
its correct units.
5. It is highly recommended to draw the schematic and layout with your own effort and use
all the standard practices in the schematic.
6. Provide reasonable explanations for what you are doing, even if you are deviating from
standard practices.
7. You are allowed to use schematic symbols and footprints from online websites such as
snap EDA.
8. Attach the stack-up from the EDA tool with clear information.
9. Share the snapshot or report of impedance calculations from the tool.

Q1. Prepare a neat schematic for a buck (DC-DC converter) regulator based on the part number
LTC3895 (refer attached datasheet application schematic given in sheet 34), requirements are
given below,

 Input voltage : 120V


 Output voltage : 12V
 Output current : 10A

Design calculations are not expected. You may use passive component values mentioned in the
reference schematic except for RSENSE value, which should be 3mΩ.
Q2. Design a neat layout for the schematic prepared for Q1. You can use any package size for
the lower value passive components. For COUTB use 1210 package MLCC and CINA package same
as COUTA.

 PCB Dimension: 50x50 mm (You are allowed increase the size to 30% more if you need)

Q3. Calculate the power dissipation on the MBOT MOSFET (mentioned in the Q1 schematic,
MOSFET on the bottom side) for the given load current. Is the part number (BSC520N15NS3G)
mentioned in the reference schematic acceptable for this application? Why/why not? If not, what
is the improvement you are proposing?

[Hint. See the MOSFET datasheet for its important parameters like thermal resistance and
operating temperature etc.]

 Ambient temperature, Tamb = 25°C


 You can ignore switching losses.

Q4. An RF signal interface schematic is given below, you are asked to design a layout for the
following conditions:

Tool to be used for impedance calculation : Saturn PCB Design Toolkit

Transmission line type : Coplanar waveguide

Impedance : 50Ω

PCB layer count :4

J1 : Use any THT SMA Connector

J2 : RECE.20279.001E.01

PCB Thickness : 1.6 mm

PCB Size : 60 x60 mm


You need to route the signal for the following placement conditions:

Case 1: Connector J1 and J2 are placed 0° to each other on the PCB

Figure 1: Connector placement for case 1

Case 2: Connector J1 and J2 are placed 90° to each other on the PCB

Figure 2 : Connector placement for case 2

Q5. Suggest a stack-up for the transmission line given in the Q4. You can consider layer 3 as
your reference plane.

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