Winstar Display Co.

, LTD
華凌光電股份有限公司
住址: 407 台中市中清路 163 號 WEB: http://www.winstar.com.tw
No.163 Chung Ching RD., E-mail: winstar@winstar.com.tw
Taichune, Taiwan, R.O.C Tel:886-4-24262208 Fax：886-4-24262207

SPECIFICATION

CUSTOMER :

MODULE NO.: WG12864A-TMI-V#N

APPROVED BY:
( FOR CUSTOMER USE ONLY )
PCB VERSION: DATA:

SALES BY APPROVED BY CHECKED BY PREPARED BY

ISSUED DATE:

第 1 頁，共 24 頁
 Winstar Display Co., LTD MODLE NO：
華凌光電股份有限公司
DOC. FIRST ISSUE
RECORDS OF REVISION
REVISED
SUMMARY
PAGE NO.
VERSION DATE

0 2008/4/11 First issue

第 2 頁，共 24 頁
Contents
1.Module Classification Information

2.Precautions in use of LCD Modules

3.General Specification

4.Absolute Maximum Ratings

5.Electrical Characteristics

6.Optical Characteristics

7.Interface Description

8.Contour Drawing & Block Diagram

9. Timing Characteristics

10.Display Control Instruction

11.Detailed Explanation

12.Reliability

13.Backlight Information

14. Inspection specification

15. Material List of Components for RoHs

第 3 頁，共 24 頁
1.Module Classification Information

WG 12864 A－T M I－ V#N

    
 Brand：WINSTAR DISPLAY CORPORATION
 Display Type：H→Character Type, G→Graphic Type
 Display Font：128 x 64 dots
 Model serials no.
 Backlight Type： N→Without backlight T→LED, White
B→EL, Blue green A→LED, Amber
D→EL, Green R→LED, Red
W→EL, White O→LED, Orange
F→CCFL, White G→LED, Green
Y→LED, Yellow Green
 LCD Mode： B→TN Positive, Gray T→FSTN Negative
N→TN Negative,
G→STN Positive, Gray
Y→STN Positive, Yellow Green
M→STN Negative, Blue
F→FSTN Positive
 LCD Polarize A→Reflective, N.T, 6:00 H→Transflective, W.T,6:00
Type/ Temperature D→Reflective, N.T, 12:00 K→Transflective, W.T,12:00
range/ View G→Reflective, W. T, 6:00 C→Transmissive, N.T,6:00
direction J→Reflective, W. T, 12:00 F→Transmissive, N.T,12:00
B→Transflective, N.T,6:00 I→Transmissive, W. T, 6:00
E→Transflective, N.T.12:00 L→Transmissive, W.T,12:00
 Special Code V : Build in Negative Voltage ;
N : IC NT7107,NT7108;
#:Fit in with the ROHS Directions and regulations

第 4 頁，共 24 頁
2.Precautions in use of LCD Modules

(1)Avoid applying excessive shocks to the module or making any alterations or modifications to it.
(2)Don’t make extra holes on the printed circuit board, modify its shape or change the components of
LCD module.
(3)Don’t disassemble the LCM.
(4)Don’t operate it above the absolute maximum rating.
(5)Don’t drop, bend or twist LCM.
(6)Soldering: only to the I/O terminals.
(7)Storage: please storage in anti-static electricity container and clean environment.
(8). Winstar have the right to change the passive components
(9). Winstar have the right to change the PCB Rev.

3.General Specification

Item Dimension Unit

Number of Characters 128 x 64 dots －
Module dimension 93 x 70.0 x 13.6(MAX) mm
View area 72.0 x 40.0 mm
Active area 66.52 x 33.24 mm
Dot size 0.48 x 0.48 mm
Dot pitch 0.52 x 0.52 mm
LCD type STN Negative, Blue Transmissive,
(In LCD production, It will occur slightly color difference. We
can only guarantee the same color in the same batch.)

Duty 1/64
View direction 6 o’clock
Backlight Type LED White

第 5 頁，共 24 頁
4.Absolute Maximum Ratings

Item Symbol Min Typ Max Unit

Operating Temperature TOP -20 － +70 ℃
Storage Temperature TST -30 － +80 ℃

Input Voltage VI 0 － VDD V

Supply Voltage For Logic VDD 0 － 6.7 V

Supply Voltage For LCD VDD-VSS 0 － 16.7 V

Supply Voltage For LCD VDD-VOUT － － -10 V

5.Electrical Characteristics

Item Symbol Condition Min Typ Max Unit

Supply Voltage For Logic VDD-VSS － 4.5 5.0 5.5 V
Ta=-20℃ － － 10.6 V
Supply Voltage For LCD
*Note VDD-V0 Ta=25℃ － 9.1 － V
Ta=+70℃ 7.6 － － V

Input High Volt. VIH － 2.0 － VDD V

Input Low Volt. VIL － 0 － 0.8 V

Output High Volt. VOH － 2.4 － VDD V

Output Low Volt. VOL － － － 0.4 V

Supply Current IDD VDD=5V － 18 － mA

* Note: Please design the VOP adjustment circuit on customer's main board

第 6 頁，共 24 頁
6.Optical Characteristics

Item Symbol Condition Min Typ Max Unit

(V)θ CR≧2 20 － 40 deg
View Angle
(H)φ CR≧2 -30 － 30 deg

Contrast Ratio CR － － 3 － －

T rise － － 200 300 ms

Response Time
T fall － － 200 300 ms

Definition of Operation Voltage (Vop) Definition of Response Time ( Tr , Tf )

Non-selected Non-selected
Conition Selected Conition Conition
Intensity Selected Wave
100％ Non-selected Wave Intensity

10％
Cr Max
Cr = Lon / Loff 90％
100％

Vop
Driving Voltage(V) Tr Tf

[positive type] [positive type]

Conditions :
Operating Voltage : Vop Viewing Angle(θ，φ) : 0°， 0°
Frame Frequency : 64 HZ Driving Waveform : 1/N duty , 1/a bias

Definition of viewing angle(CR≧2)

θ b
θ f
φ = 180°
θ l
θ r

φ = 270° φ = 90°

φ = 0°

第 7 頁，共 24 頁
7.Interface Description

Pin No. Symbol Level Description

1 VSS 0V Ground
2 VDD 5.0V Supply voltage for logic
3 VO (Variable) Operating voltage for LCD
4 D/I H/L H: Data , L : Instruction
5 R/W H/L H: Read (MPU←Module) , L: Write (MPU→Module)

6 E H Enable signal
7 DB0 H/L Data bus line
8 DB1 H/L Data bus line
9 DB2 H/L Data bus line
10 DB3 H/L Data bus line
11 DB4 H/L Data bus line
12 DB5 H/L Data bus line
13 DB6 H/L Data bus line
14 DB7 H/L Data bus line
15 CS1 H Select Column 1~ Column 64
16 CS2 H Select Column 65~ Column 128
17 RES L Reset signal
18 Vout － Negative Voltage Output

19 A － Power Supply for LED backlight (+)

20 K － Power Supply for LED backlight (-)

第 8 頁，共 24 頁
8.Contour Drawing &Block Diagram

第 9 頁，共 24 頁
9.Function Description

The display data appears when D is 1 and disappears when D is 0. Though the data is not on the

screen with D=0, it remains in the display data RAM. Therefore, you can make it appear by
changing D=0 into D=1.

SET ADDRESS (Y ADDRESS)

Y address (AC0-AC5) of the display data RAM is set in the Y address counter. An address is set by
instruction and increased by 1 automatically by read or write operations of display data.

SET PAGE (X ADDRESS)

X address (AC0-AC2) of the display data RAM is set in the X address register. Writing or reading to
or from MPU is executed in this specified page until the next page is set.

DISPLAY START LINE (Z ADDRESS)

Z address (AC0-AC5) of the display data RAM is set in the display start line register and displayed
at the top of the screen. When the display duty cycle is 1/64 or others (1/32-1/64), the data of total
line number of LCD screen, from the line specified by display start line instruction, is displayed.

第 10 頁，共 24 頁
STATUS READ

‧BUSY
When BUSY is 1, the Chip is executing internal operation and no instructions are accepted.
When BUSY is 0, the Chip is ready to accept any instructions.
‧ON/OFF
When ON/OFF is 1, the display is OFF.
When ON/OFF is 0, the display is ON.
‧RESET
When RESET is 1, the system is being initialized.
In this condition, no instructions except status read can be accepted.
When RESET is 0, initializing has finished and the system is in usual operation condition.

WRITE DISPLAY DATA

Writes data (D0-D7) into the display data RAM. After writing instruction, Y address is increased by
1automatically.

READ DISPLAY DATA

Reads data (D0-D7) from the display data RAM. After reading instruction, Y address is increased by
1 automatically.

第 11 頁，共 24 頁
10.Display Control Instruction

The display control instructions control the internal state of the NT7108. Instruction is received from
MPU to NT7108 for the display control. The following table shows various instructions.

第 12 頁，共 24 頁
11.Timing Characteristics

MPU Interface
Characteristic Symbol Min Typ Max Unit
E cycle tcyc 1000 － － ns
E high level width twhE 450 － － ns
E low level width twlE 450 － － ns
E rise time tr － － 25 ns
E tall time tf － － 25 ns
Address set-up time tas 140 － － ns
Address hold time tah 10 － － ns
Data set-up time tdsw 200 － － ns
Data delay time tddr － － 320 ns
Data hold time (write) tdhw 10 － － ns
Data hold time (read) tdhr 20 － － ns

tcyc

twIE
2.0V
E 0.8V twhE
tr tf
tas tah
R/W

tas tah
2.0V
CS1,CS2,D/I 0.8V

tdsw tdhw
DB0 to DB7

MPU Write Timing

第 13 頁，共 24 頁
 tcyc
twIE
2.0V
E 0.8V
twhE
tr tf

2.0V
R/W 0.8V tas tah

tas tah
2.0V
CS1,CS2,D/I 0.8V

tddr tdhr
DB0 to DB7

MPU Read Timing

第 14 頁，共 24 頁
12.Reliability
Content of Reliability Test (wide temperature, -20℃~70℃)

Environmental Test
Test Item Content of Test Test Condition Note
High Temperature Endurance test applying the high storage 80℃
2
storage temperature for a long time. 200hrs
Low Temperature Endurance test applying the high storage -30℃
1,2
storage temperature for a long time. 200hrs
Endurance test applying the electric stress
High Temperature 70℃
(Voltage & Current) and the thermal stress to the ——
Operation 200hrs
element for a long time.
Low Temperature Endurance test applying the electric stress under -20℃
1
Operation low temperature for a long time. 200hrs
The module should be allowed to stand at 60
℃,90%RH max
High Temperature/ For 96hrs under no-load condition excluding the 60℃,90%RH
1,2
Humidity Operation polarizer, 96hrs
Then taking it out and drying it at normal
temperature.
The sample should be allowed stand the
following 10 cycles of
operation
Thermal shock -20℃ 25℃ 70℃ -20℃/70℃
——
resistance 10 cycles

30min 5min 30min

1 cycle
Total fixed
amplitude : 1.5mm
Vibration
Frequency :
Endurance test applying the vibration during 10~55Hz
Vibration test 3
transportation and using. One cycle 60
seconds to 3
directions of X,Y,Z
for Each
15 minutes
VS=800V,RS=1.5k
Endurance test applying the electric stress to the Ω
Static electricity test ——
terminal. CS=100pF
1 time
Note1: No dew condensation to be observed.
Note2: The function test shall be conducted after 4 hours storage at the normal
Temperature and humidity after remove from the test chamber.
Note3: Vibration test will be conducted to the product itself without putting it in a container.

第 15 頁，共 24 頁
 13.Backlight Information

Specification

PARAMETER SYMBOL MIN TYP MAX UNIT TEST CONDITION

Supply Current ILED 57.6 64 100 mA V=3.5V

Supply Voltage V 3.4 3.5 3.6 V －

Reverse Voltage VR － － 5 V －

Luminous
IV 200 250 － cd/m2 ILED=64mA
Intensity
Wave Length λp ─ nm ILED=64mA

Life Time － － 50000 － Hr. ILED=64mA

Color White

Note: The LED of B/L is drive by current only, drive voltage is for reference only.
drive voltage can make driving current under safety area (current between
minimum and maximum).

2.Drive from pin19,pin20

R
A
B/L
K

LCM

第 16 頁，共 24 頁
14. Inspection specification

NO Item Criterion AQ
L

1.1 Missing vertical, horizontal segment, segment contrast

defect.
1.2 Missing character , dot or icon.
1.3 Display malfunction.
Electrical
01 1.4 No function or no display. 0.65
Testing
1.5 Current consumption exceeds product specifications.
1.6 LCD viewing angle defect.
1.7 Mixed product types.
1.8 Contrast defect.

Black or
2.1 White and black spots on display ≦0.25mm, no more than
white spots on
02 three white or black spots present. 2.5
LCD (display
2.2 Densely spaced: No more than two spots or lines within 3mm
only)

3.1 Round type : As following drawing

Φ=( x + y ) / 2 SIZE Acceptable Q
TY
Φ≦0.10 Accept no dense
0.10＜ 2 2.5
Φ≦0.20
LCD black 0.20＜ 1
spots, white Φ≦0.25
03 spots,
0.25＜Φ 0
contamination
(non-display) 3.2 Line type : (As following drawing)
Length Width Acceptable Q TY
--- W≦0.02 Accept no dense
L≦3.0 0.02＜W≦0.03 2.5
2
L≦2.5 0.03＜W≦0.05
--- 0.05＜W As round type

If bubbles are visible, Size Φ Acceptable Q TY

judge using black spot
Φ≦0.20 Accept no dense
specifications, not easy
Polarizer to find, must check in 0.20＜Φ≦0.50 3
04 2.5
bubbles specify direction. 0.50＜Φ≦1.00 2
1.00＜Φ 0
Total Q TY 3

第 17 頁，共 24 頁
NO Item Criterion AQL
05 Scratches Follow NO.3 LCD black spots, white spots, contamination

Symbols Define:
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: LCD side length
L: Electrode pad length:

6.1 General glass chip :

6.1.1 Chip on panel surface and crack between panels:

z: Chip thickness y: Chip width x: Chip length

Z≦1/2t Not over viewing x≦1/8a
area
Chipped
06 1/2t＜z≦2t Not exceed 1/3k x≦1/8a 2.5
glass
☉If there are 2 or more chips, x is total length of each chip.

6.1.2 Corner crack:

z: Chip thickness y: Chip width x: Chip length

Z≦1/2t Not over viewing x≦1/8a
area
1/2t＜z≦2t Not exceed 1/3k x≦1/8a
☉If there are 2 or more chips, x is the total length of each chip.

第 18 頁，共 24 頁
NO Item Criterion
AQL

Symbols :
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: LCD side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :

y: Chip width x: Chip length z: Chip thickness

y≦0.5mm x≦1/8a 0 ＜ z≦t

6.2.2 Non-conductive portion:

Glass
06 2.5
crack

y: Chip width x: Chip length z: Chip thickness

y≦ L x≦1/8a 0 ＜ z≦t

☉If the chipped area touches the ITO terminal, over 2/3 of the ITO must
remain and be inspected according to electrode terminal specifications.
☉If the product will be heat sealed by the customer, the alignment mark
not be damaged.
6.2.3 Substrate protuberance and internal crack.
y: width x: length

y≦1/3L x≦a

第 19 頁，共 24 頁
NO Item Criterion
AQL

07 Cracked glass The LCD with extensive crack is not acceptable. 2.5

8.1 Illumination source flickers when lit. 0.65

Backlight 8.2 Spots or scratched that appear when lit must be judged. Using 2.5
08
elements LCD spot, lines and contamination standards.
8.3 Backlight doesn’t light or color wrong. 0.65

9.1 Bezel may not have rust, be deformed or have fingerprints, stains
2.5
09 Bezel or other contamination.
0.65
9.2 Bezel must comply with job specifications.

10.1 COB seal may not have pinholes larger than 0.2mm or 2.5
contamination.
10.2 COB seal surface may not have pinholes through to the IC. 2.5
0.65
10.3 The height of the COB should not exceed the height indicated
in the assembly diagram. 2.5
10.4 There may not be more than 2mm of sealant outside the seal
area on the PCB. And there should be no more than three
places. 2.5
10.5 No oxidation or contamination PCB terminals. 0.65
10 PCB、COB 10.6 Parts on PCB must be the same as on the production
characteristic chart. There should be no wrong parts, missing
parts or excess parts. 0.65
10.7 The jumper on the PCB should conform to the product
characteristic chart. 2.5
10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw
hold pad, make sure it is smoothed down. 2.5
10.9 The Scraping testing standard for Copper Coating of PCB

X
Y
X * Y<=2mm2

11.1 No un-melted solder paste may be present on the PCB. 2.5

11.2 No cold solder joints, missing solder connections, oxidation or 2.5
11 Soldering icicle.
2.5
11.3 No residue or solder balls on PCB. 0.65
11.4 No short circuits in components on PCB.

第 20 頁，共 24 頁
NO Item Criterion AQL

12.1 No oxidation, contamination, curves or, bends on interface Pin 2.5

(OLB) of TCP.
0.65
12.2 No cracks on interface pin (OLB) of TCP.
2.5
12.3 No contamination, solder residue or solder balls on product. 2.5
12.4 The IC on the TCP may not be damaged, circuits. 2.5
12.5 The uppermost edge of the protective strip on the interface pin
must be present or look as if it cause the interface pin to sever. 2.5
General 12.6 The residual rosin or tin oil of soldering (component or chip
12 2.5
appearance component) is not burned into brown or black color.
12.7 Sealant on top of the ITO circuit has not hardened. 0.65
0.65
12.8 Pin type must match type in specification sheet.
0.65
12.9 LCD pin loose or missing pins.
12.10 Product packaging must the same as specified on packaging 0.65
specification sheet.
12.11 Product dimension and structure must conform to product
specification sheet.

第 21 頁，共 24 頁
15. Material List of Components for RoHs
1. WINSTAR Display Co., Ltd hereby declares that all of or part of products (with the mark
“#”in code), including, but not limited to, the LCM, accessories or packages, manufactured
and/or delivered to your company (including your subsidiaries and affiliated company)
directly or indirectly by our company (including our subsidiaries or affiliated companies) do
not intentionally contain any of the substances listed in all applicable EU directives and
regulations, including the following substances.

Exhibit A：The Harmful Material List

.

Material (Cd) (Pb) (Hg) (Cr6+) PBBs PBDEs

Limited 100 1000 1000 1000 1000 1000

Value ppm ppm ppm ppm ppm ppm

Above limited value is set up according to RoHS.

2.Process for RoHS requirement：

(1) Use the Sn/Ag/Cu soldering surface；the surface of Pb-free solder is rougher than we used before.
(2) Heat-resistance temp.：
Reflow：250 ,30 seconds Max.；
Connector soldering wave or hand soldering：320 , 10 seconds max.
(3) Temp. curve of reflow, max. Temp.：235±5 ；
Recommended customer’s soldering temp. of connector：280 , 3 seconds.

第 22 頁，共 24 頁
 winstar LCM Sample Estimate Feedback Sheet
Module Number： Page: 1
1、Panel Specification：
1. Panel Type： □ Pass □ NG ,
2. View Direction： □ Pass □ NG ,
3. Numbers of Dots： □ Pass □ NG ,
4. View Area： □ Pass □ NG ,
5. Active Area： □ Pass □ NG ,
6. Operating Temperature： □ Pass □ NG ,
7. Storage Temperature： □ Pass □ NG ,
8. Others：
2、Mechanical Specification：
1. PCB Size： □ Pass □ NG ,
2. Frame Size： □ Pass □ NG ,
3. Materal of Frame： □ Pass □ NG ,
4. Connector Position： □ Pass □ NG ,
5. Fix Hole Position： □ Pass □ NG ,
6. Backlight Position： □ Pass □ NG ,
7. Thickness of PCB： □ Pass □ NG ,
8. Height of Frame to PCB： □ Pass □ NG ,
9. Height of Module： □ Pass □ NG ,
10. Others： □ Pass □ NG ,
3、Relative Hole Size：
1. Pitch of Connector： □ Pass □ NG ,
2. Hole size of Connector： □ Pass □ NG ,
3. Mounting Hole size： □ Pass □ NG ,
4. Mounting Hole Type： □ Pass □ NG ,
5. Others： □ Pass □ NG ,
4、Backlight Specification：
1. B/L Type： □ Pass □ NG ,
2. B/L Color： □ Pass □ NG ,
3. B/L Driving Voltage (Reference for LED Type)： □ Pass □ NG ,
4. B/L Driving Current： □ Pass □ NG ,
5. Brightness of B/L： □ Pass □ NG ,
6. B/L Solder Method： □ Pass □ NG ,
7. Others： □ Pass □ NG ,
＞＞ Go to page 2 ＜＜

第 23 頁，共 24 頁
 winstar
Module Number： Page: 2
5、Electronic Characteristics of Module：
1. Input Voltage： □ Pass □ NG ,
2. Supply Current： □ Pass □ NG ,
3. Driving Voltage for LCD： □ Pass □ NG ,
4. Contrast for LCD： □ Pass □ NG ,
5. B/L Driving Method： □ Pass □ NG ,
6. Negative Voltage Output： □ Pass □ NG ,
7. Interface Function： □ Pass □ NG ,
8. LCD Uniformity： □ Pass □ NG ,
9. ESD test： □ Pass □ NG ,
10. Others： □ Pass □ NG ,
6、Summary：

Sales signature：
Customer Signature： Date： / /

第 24 頁，共 24 頁