AON7530

30V N-Channel AlphaMOS

General Description Product Summary

• Trench Power AlphaMOS (αMOS LV) technology VDS 30V

• Low RDS(ON) ID (at VGS=10V) 30A
• Low Gate Charge RDS(ON) (at VGS=10V) < 4.7mΩ
• High Current Capability
RDS(ON) (at VGS=4.5V) < 7.2mΩ
• RoHS and Halogen-Free Compliant

Applications 100% UIS Tested

100% Rg Tested
• DC/DC Converters in Computing, Servers, and POL
• Isolated DC/DC Converters in Telecom and Industrial

DFN 3x3 EP D
Top View
Top View Bottom View

1 8

2 7

3 6
Pin 1
4 5 G
Pin 1
S

Orderable Part Number Package Type Form Minimum Order Quantity

AON7530 DFN 3x3 EP Tape & Reel 5000

Absolute Maximum Ratings TA=25°C unless otherwise noted

Parameter Symbol Maximum Units
Drain-Source Voltage VDS 30 V
Gate-Source Voltage VGS ±20 V
Continuous Drain TC=25°C 30
ID
Current G TC=100°C 23 A
C
Pulsed Drain Current IDM 120
Continuous Drain TA=25°C 24
IDSM A
Current TA=70°C 19
Avalanche Current C IAS 33 A
C
Avalanche energy L=0.05mH EAS 27 mJ
VDS Spike 10µs VSPIKE 36 V
TC=25°C 24
PD W
Power Dissipation B TC=100°C 9.6
TA=25°C 4.1
PDSM W
Power Dissipation A TA=70°C 2.6
Junction and Storage Temperature Range TJ, TSTG -55 to 150 °C

Thermal Characteristics
Parameter Symbol Typ Max Units
Maximum Junction-to-Ambient A t ≤ 10s 24 30 °C/W
RθJA
Maximum Junction-to-Ambient A D Steady-State 45 55 °C/W
Maximum Junction-to-Case Steady-State RθJC 4.2 5.2 °C/W

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Electrical Characteristics (TJ=25°C unless otherwise noted)

Symbol Parameter Conditions Min Typ Max Units

STATIC PARAMETERS
BVDSS Drain-Source Breakdown Voltage ID=250µA, VGS=0V 30 V
VDS=30V, VGS=0V 1
IDSS Zero Gate Voltage Drain Current µA
TJ=55°C 5
IGSS Gate-Body leakage current VDS=0V, VGS=±20V ±100 nA
VGS(th) Gate Threshold Voltage VDS=VGS, ID=250µA 1.4 1.8 2.2 V
VGS=10V, ID=20A 3.9 4.7
mΩ
RDS(ON) Static Drain-Source On-Resistance TJ=125°C 5.5 6.7
VGS=4.5V, ID=20A 5.7 7.2 mΩ
gFS Forward Transconductance VDS=5V, ID=20A 83 S
VSD Diode Forward Voltage IS=1A,VGS=0V 0.7 1 V
IS Maximum Body-Diode Continuous Current 30 A
DYNAMIC PARAMETERS
Ciss Input Capacitance 1320 pF
Coss Output Capacitance VGS=0V, VDS=15V, f=1MHz 530 pF
Crss Reverse Transfer Capacitance 70 pF
Rg Gate resistance f=1MHz 0.7 1.4 2.1 Ω
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge 18.8 27 nC
Qg(4.5V) Total Gate Charge 8.8 15 nC
VGS=10V, VDS=15V, ID=20A
Qgs Gate Source Charge 3.7 nC
Qgd Gate Drain Charge 4 nC
tD(on) Turn-On DelayTime 7 ns
tr Turn-On Rise Time VGS=10V, VDS=15V, RL=0.75Ω, 3 ns
tD(off) Turn-Off DelayTime RGEN=3Ω 21 ns
tf Turn-Off Fall Time 4 ns
trr Body Diode Reverse Recovery Time IF=20A, dI/dt=500A/µs 13.5 ns
Qrr Body Diode Reverse Recovery Charge IF=20A, dI/dt=500A/µs 20.6 nC

A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The Power
dissipation PDSM is based on R θJA t≤ 10s and the maximum allowed junction temperature of 150°C. The value in any given application depends on
the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Single pulse width limited by junction temperature TJ(MAX)=150°C.
D. The RθJA is the sum of the thermal impedance from junction to case RθJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
G. The maximum current rating is package limited.
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.

THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.

Rev.1.0: January 2014 www.aosmd.com Page 2 of 6

TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS

100 100
10V 4.5V
VDS=5V
4V
80 80

60 3.5V 60
ID (A)

ID(A)
125°C

40 40

25°C
20 20
VGS=3V

0 0
0 1 2 3 4 5 0 1 2 3 4 5 6

VDS (Volts) VGS(Volts)

Figure 1: On-Region Characteristics (Note E) Figure 2: Transfer Characteristics (Note E)

8 1.6

VGS=4.5V Normalized On-Resistance

VGS=10V
6 1.4 ID=20A
Ω)
RDS(ON) (mΩ

4 1.2

VGS=10V VGS=4.5V
2 1 ID=20A

0 0.8
0 5 10 15 20 25 30 0 25 50 75 100 125 150 175

ID (A) Temperature (°C)

Figure 3: On-Resistance vs. Drain Current and Gate Figure 4: On-Resistance vs. Junction Temperature
Voltage (Note E) (Note E)

14 1.0E+02
ID=20A
12 1.0E+01

10 1.0E+00 125°C
Ω)
RDS(ON) (mΩ

IS (A)

8 1.0E-01
125°C

6 1.0E-02
25°C

4 1.0E-03
25°C
2 1.0E-04

0 1.0E-05
2 4 6 8 10 0.0 0.2 0.4 0.6 0.8 1.0

VGS (Volts) VSD (Volts)

Figure 5: On-Resistance vs. Gate-Source Voltage Figure 6: Body-Diode Characteristics (Note E)
(Note E)

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TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS

10 2000
VDS=15V
ID=20A
8 1600
Ciss

Capacitance (pF)
VGS (Volts)

6 1200

4 800
Coss

2 400
Crss

0 0
0 5 10 15 20 0 5 10 15 20 25 30

Qg (nC) VDS (Volts)

Figure 7: Gate-Charge Characteristics Figure 8: Capacitance Characteristics

1000.0 500
TJ(Max)=150°C
10µs TC=25°C
100.0 10µs 400
RDS(ON)
limited
100µs
Power (W)

300
ID (Amps)

10.0
1ms
1.0 10ms 200
DC

0.1 TJ(Max)=150°C 100

TC=25°C

0.0 0
0.01 0.1 1 10 100 1E-05 0.0001 0.001 0.01 0.1 1 10
VDS (Volts)
Pulse Width (s)
VGS> or equal to 4.5V Figure 10: Single Pulse Power Rating Junction-to-
Figure 9: Maximum Forward Biased Safe Case (Note F)
Operating Area (Note F)

10
D=Ton/T In descending order
Zθ JC Normalized Transient

TJ,PK=TC+PDM.ZθJC.RθJC D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse

Thermal Resistance

RθJC=5.2°C/W
1

0.1 Single Pulse PD

Ton
T
0.01
1E-05 0.0001 0.001 0.01 0.1 1 10

Pulse Width (s)

Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)

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TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS

30 40

30
Power Dissipation (W)

20

Current rating ID(A)

20

10
10

0 0
0 25 50 75 100 125 150 0 25 50 75 100 125 150

°C)
TCASE (° °C)
TCASE (°
Figure 12: Power De-rating (Note F) Figure 13: Current De-rating (Note F)

10000
TA=25°C

1000
Power (W)

100

10

1
1E-05 0.001 0.1 10 1000

Pulse Width (s)

Figure 14: Single Pulse Power Rating Junction-to-Ambient (Note H)

10
Zθ JA Normalized Transient

D=Ton/T In descending order

Thermal Resistance

TJ,PK=TA+PDM.ZθJA.RθJA D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse

1 RθJA=55°C/W

0.1

PD
0.01 Single Pulse

Ton
T
0.001
0.0001 0.001 0.01 0.1 1 10 100 1000
Pulse Width (s)
Figure 15: Normalized Maximum Transient Thermal Impedance (Note H)

Rev.1.0: January 2014 www.aosmd.com Page 5 of 6

 Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
VDC
+ Vds Qgs Qgd
- VDC

DUT -
Vgs

Ig

Charge
Resistive Switching Test Circuit & Waveforms
RL
Vds
Vds

90%
DUT
+ Vdd
Vgs VDC

Rg - 10%

Vgs Vgs td(on) tr td(off) tf

ton toff

Unclamped Inductive Switching (UIS) Test Circuit & Waveforms

L 2
Vds EAR= 1/2 LIAR BVDSS

Id Vds

Vgs + Vdd I AR
Vgs VDC

Rg - Id

DUT
Vgs Vgs

Diode Recovery Test Circuit & Waveforms

Vds + Q rr = - Idt
DUT
Vgs

t rr
Vds - L Isd IF
Isd dI/dt
+ Vdd I RM
Vgs VDC
Vdd
Ig
- Vds

Rev.1.0: January 2014 www.aosmd.com Page 6 of 6