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  • Material Datasheet Cu-OF

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    Cu-OF is a high purity oxygen-free copper with a minimum of 99.99% copper content. It has excellent electrical conductivity of 100% IACS due to its high purity and lack of deoxidizers. Cu-OF has very good formability and can be soldered and welded better than copper with deoxidizers. Its main applications are in critical electrical, electronic, and communication components.

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    Copper

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    cu-of-c10200_en

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    Cu-OF is a high purity oxygen-free copper with a minimum of 99.99% copper content. It has excellent electrical conductivity of 100% IACS due to its high purity and lack of deoxidizers. Cu-OF has very good formability and can be soldered and welded better than copper with deoxidizers. Its main applications are in critical electrical, electronic, and communication components.

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    © All Rights Reserved
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    58 views2 pages

    Material Datasheet Cu-OF

    Uploaded by

    mohsen_267
    Cu-OF is a high purity oxygen-free copper with a minimum of 99.99% copper content. It has excellent electrical conductivity of 100% IACS due to its high purity and lack of deoxidizers. Cu-OF has very good formability and can be soldered and welded better than copper with deoxidizers. Its main applications are in critical electrical, electronic, and communication components.

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    © All Rights Reserved
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    Material Datasheet‎ Cu-OF

    Cu-OF 20 03

    Comparable standards: UNS‎C10200‎•‎EN‎CW008A‎•‎JIS‎1020


    Aurubis designations: C102‎•‎OF-OK

    Description Cu-OF is an oxygen-free, high conductivity copper with 99.99% minimum Cu. It offers the
    advantages of both electrolytic tough pitch copper (ETP) and phosphor deoxidized copper. The
    high purity and absence of deoxidizers accounts for 100% IACS electrical conductivity as well as
    no susceptibility to hydrogen embrittlement. Cu-OF has a very good formability and can be
    soldered and welded, which makes it superior to Cu-ETP in these aspects.
    The main field of application are very critical electrical, electronic and communication
    components.

    Composition
    Cu Bi Pb O

    [%] [%] [%] [%]


    min 99.95 0.0005 max 0.005 max max 0.001
    Composition of this alloy is in accordance with RoHS for electric & electronic components and ELV for the automotive
    industry.

    Physical Melting Density cp Young's Thermal Electrical α


    properties point @ 20°C modulus cond. cond. @20-300°C

    [°C] [g/cm³] [kJ/kgK] [GPa] [W/mK] [MS/m] [%IACS] [10-6/K]

    1083 8.94 0.394 127 394 ≥‎58 ≥100 17.7


    Note: The specified conductivity applies to the cp specific heat capacity
    soft condition only. α‎coefficient‎of‎thermal‎expansion

    Mechanical Tensile Yield Elongation Hardness Bend ratio


    properties Strength Strength A50 HV 90° [r]

    [MPa] [MPa] [%] [-] GW BW


    R220 220-260 ≤‎140 ≥‎33 40-65 0 0
    R240 240-300 ≥‎180 ≥‎8 65-95 0 0
    R290 290-360 ≥‎250 ≥‎4 90-110 0 0
    R360 ≥‎360 ≥‎320 ≥‎2 ≥‎110 0 0
    r‎=‎x‎*‎t‎‎(thickness‎t‎≤‎0.5mm)
    GW bend axis transverse to rolling
    direction. BW bend axis parallel to rolling
    direction.

    Fabrication Cold formability excellent


    properties Hot formability excellent
    Soldering excellent
    Brazing excellent
    Oxyacetylene welding fair
    Gas shielded arc welding good
    Resistance welding not recommended
    Machinability not recommended

    Electrical The electrical conductivity depends on chemical composition, the level of cold deformation and
    conductivity the grain size. A high level of deformation as well as a small grain size decrease the conductivity.

    Aurubis.com 1-2
    Material Datasheet‎ Cu-OF

    Corrosion Copper is resistant to: Natural and industrial atmospheres as well as maritime air, drinking and
    Resistance service water, non oxidizing acids, alkaline solutions and neutral saline solutions.
    Copper is not resistant to: Ammonia, halogenide, cyanide and hydrogen sulfide solutions and
    atmospheres, oxidizing acids and sea water (especially at high flow rates).

    Typical uses Radar components, components of electrical engineering, conductors, contacts and terminals,
    printed circuits, carrier tapes, flat-type cables, flexible circuits, terminal lugs, copper ceramic
    substrates

    This leaflet is for general information only and is not subject to revision. No claims can be derived from it unless there is
    evidence of intent or gross negligence. The data given are no warranty that the product is of a specified quality and they
    cannot‎replace‎expert‎advice‎or‎the‎customer’s‎own‎test.

    Aurubis.com 2-2

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