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PGA970
SLDS257 – APRIL 2019

PGA970 LVDT Sensor Signal Conditioner

1 Features Further, the device contains a digital signal-
demodulation block that interfaces to an integrated
1• Analog features ARM-Cortex M0 MCU, allowing implementation of
– Programmable-gain analog front end for LVDT custom sensor-compensation algorithms stored in the
sensors device nonvolatile memory. External system
– Excitation waveform generator and amplifier communication is achieved by using any of the SPI,
OWI, GPIO, or PWM digital interfaces. Analog output
– Dual 24-bit ADC with amplitude and phase is supported through a 14-bit DAC and
demodulators programmable-gain amplifier offering reference or
– 24-bit auxilary ADC absolute-voltage output. Sensing-element excitation
– On-chip internal temperature sensor is achieved by the use of an integrated waveform
generator and waveform amplifier. The waveform
– 14-bit output DAC with programmable gain signal data is user-defined and stored in a designated
– Built-in diagnostics RAM memory area.
• Digital features Besides the primary functional components, the
– ARM® Cortex®-M0 microcontroller PGA970 is equipped with additional support circuitry.
– 16KB ferroelectric RAM (FRAM) program The device diagnostics, sensor diagnostics, and
memory integrated temperature sensor provide protection and
information about the integrity of the overall system
– 2KB general-pupose RAM and sensing element. The device also includes a
– 512B RAM waveform-generator look-up table gate-controller circuit which when used with an
– 8-MHz on-chip oscillator external depletion MOSFET can regulate the device
supply voltage in systems where the supply voltage
• Peripheral features exceeds 30 V.
– Serial peripheral interface (SPI)
– One-wire interface (OWI) Device Information(1)
– Ratiometric and absolute voltage output ORDER NUMBER PACKAGE BODY SIZE (NOM)
PGA970QPHPR
• General features HTQFP (48) 7.00 mm × 7.00 mm
PGA970QPHPT
– Operational supply range: 3.5 V to 30 V
(1) For all available packages, see the orderable addendum at
– Ambient temperature range: –40°C to +125°C the end of the data sheet.
– DMOS gate controller for extended supply
range >30 V Simplified Diagram
PI PGA970

2 Applications
Internal
Reference
PE Oscillator
Power Management
LVDT Waveform Software and
P2 Generator Data Memory
• Position sensor signal conditioning Sensor

P1
Wave
Gain
VDD
OWI (3.3 to 30 V)

• Linear variable differential transformer (LVDT) S1P 16KB FRAM

2KB RAM MISO/MOSI
Digital 512B RAM SPI
PGA ADC CSN/SCK
• Rotational variable differential transformer (RVDT) C
o
S1N
Demodulation

GPIO
GPIO1
GPIO2
r
• Resolver e
S2P

Digital
14-bit
ADC Control and DAC OUT
PGA Demodulation
• RLC measurement S2N Status
Registers
Gain

COMP
AIN1
M FBN
External
U ADC
3 Description Temperature
Sensor
X
PGA

The PGA970 is a highly integrated system-on-chip Internal

Temperature
Sensor
Diagnostics ARM Cortex M0
(User Debugger
SWDIO
SWDCLK
Programmable)
LVDT sensor-signal conditioner with advanced signal- Copyright © 2016, Texas Instruments Incorporated
processing capabilities. It contains a three-channel,
low-noise, programmable-gain, analog front end that
allows direct connection to the sense element,
followed by three independent 24-bit delta-sigma
ADCs.

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
PGA970
SLDS257 – APRIL 2019 www.ti.com

4 Device and Documentation Support

4.1 Documentation Support

4.1.1 Related Documentation
For related documentation see the following:
• Texas Instruments, PGA970 GUI user's guide
• Texas Instruments, PGA970 Software Quick Start Guide user's guide
• Texas Instruments, PGA970 Software user's guide
• Texas Instruments, PGA970EVM user's guide

4.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.

4.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

4.4 Trademarks
E2E is a trademark of Texas Instruments.
ARM, Cortex are registered trademarks of ARM Limited.
All other trademarks are the property of their respective owners.
4.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

4.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

5 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most-
current data available for the designated device. This data is subject to change without notice and without
revision of this document. For browser-based versions of this data sheet, see the left-hand navigation pane.

2 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated

Product Folder Links: PGA970

 PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

PGA970QPHPR ACTIVE HTQFP PHP 48 1000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 PGA970Q

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1
 GENERIC PACKAGE VIEW
PHP 48 TQFP - 1.2 mm max height
7 x 7, 0.5 mm pitch QUAD FLATPACK

This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.

4226443/A

www.ti.com
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