BLT81 2-76125
BLT81 2-76125
BLT81 2-76125
DATA SHEET
BLT81
UHF power transistor
Product specification 1996 May 09
Supersedes data of November 1992
Philips Semiconductors Product specification
FEATURES
• SMD encapsulation
• Gold metallization ensures excellent reliability.
handbook, halfpage 4
APPLICATIONS
• Hand-held radio equipment in the 900 MHz c
communication band.
b
DESCRIPTION
e
NPN silicon planar epitaxial transistor encapsulated in a
plastic SOT223 SMD package.
1 2 3
MAM043 - 1
f VCE PL Gp ηC
MODE OF OPERATION
(MHz) (V) (W) (dB) (%)
7.5 1.2 ≥6 ≥60
CW, class-B narrow band 900
6 1.2 typ. 6.5 typ. 77
1996 May 09 2
Philips Semiconductors Product specification
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCBO collector-base voltage open emitter − 20 V
VCEO collector-emitter voltage open base − 9.5 V
VEBO emitter-base voltage open collector − 2.5 V
IC collector current (DC) − 500 mA
IC(AV) average collector current − 500 mA
Ptot total power dissipation Ts = 110 °C; note 1 − 2 W
Tstg storage temperature −65 +150 °C
Tj operating junction temperature − 175 °C
THERMAL CHARACTERISTICS
MRC094
1
handbook, halfpage
IC
(A)
10−1
1 10 102
VCE (V)
Ts = 110 °C.
Fig.2 DC SOAR.
1996 May 09 3
Philips Semiconductors Product specification
CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
Note
1. Measured under pulsed conditions: tp ≤ 200 µs; δ ≤ 0.02.
MRC090 MRC086
100 6
handbook, halfpage handbook, halfpage
hFE
Cc
80 (pF)
4
60
40
2
20
0 0
0 100 200 300 400 0 2 4 6 8 10
IC (mA) VCB (V)
1996 May 09 4
Philips Semiconductors Product specification
APPLICATION INFORMATION
RF performance at Ts ≤ 60 °C in a common emitter test circuit (see note 1 and Fig.7).
f VCE PL Gp ηC
MODE OF OPERATION
(MHz) (V) (W) (dB) (%)
≥6 ≥60
7.5 1.2
CW, class-B narrow band 900 typ. 8 typ. 77
6 1.2 typ. 6.5 typ. 77
Note
1. Ts is the temperature at the soldering point of the collector pin.
MRC088 MRC093
10 100 2.5
handbook, halfpage (1) handbook, halfpage
Gp Gp ηC PL
(dB) (2) (%) (W)
ηC
8 80 2.0
(4) (1)
(3)
6 60 1.5
(2)
4 40 1.0
2 20 0.5
0 0 0
0 0.4 0.8 1.2 1.6 2.0 0 100 200 300 400 500
PL (W) PIN (mW)
(1) VCE = 7.5 V. (3) VCE = 7.5 V. (1) VCE = 7.5 V. (2) VCE = 6 V.
(2) VCE = 6 V. (4) VCE = 6 V.
Fig.5 Power gain and collector efficiency as Fig.6 Load power as a function of input
functions of load power; typical values. power; typical values.
1996 May 09 5
Philips Semiconductors Product specification
C2 C4 C6 C8 C10
C1 L1 L4 L5 L6 L8 L10 C14
50 Ω 50 Ω
input output
DUT
C3 L2 C5 C7 C11 C13
L7
L9
R1 L3
VCC
R2
C9 C12
MEA899
Fig.7 Common emitter test circuit for class-B operation at 900 MHz.
1996 May 09 6
Philips Semiconductors Product specification
Notes
1. American Technical Ceramics type 100B or capacitor of same quality.
2. The striplines are on a double copper-clad printed-circuit board, with PTFE fibre-glass dielectric (εr = 2.2); thickness
1⁄ "; thickness of the copper sheet 35 µm.
16
1996 May 09 7
Philips Semiconductors Product specification
140
handbook, full pagewidth
strap strap
80
rivets
(14x)
VCC
L9
L3
C9 C12
L2 R2
R1
C2 C4 C6 L7 C10
C1 L1 L4 L5 L6 L8 L10 C14
C3 C5 C7 C8 C11 C13
MEA898
Dimensions in mm.
The components are situated on one side of the copper-clad PTFE fibre-glass board, the other side is unetched and serves as a ground plane.
Earth connections from the component side to the ground plane are made by means of fixing screws and copper foil straps under the emitter leads.
Fig.8 Printed-circuit board and component lay-out for 900 MHz class-B test circuit in Fig.7.
1996 May 09 8
Philips Semiconductors Product specification
MRC091 MRC092
10 20
handbook, halfpage handbook, halfpage
Zi ZL RL
(Ω) (Ω)
8 16
ri
6 12
4 xi 8
XL
2 4
0 0
800 840 880 920 960 1000 800 840 880 920 960 1000
f (MHz) f (MHz)
Class-B; VCE = 7.5 V; PL = 1.2 W; Ts ≤ 60 °C. Class-B; VCE = 7.5 V; PL = 1.2 W; Ts ≤ 60 °C.
Fig.9 Input impedance as a function of frequency Fig.10 Load impedance as a function of frequency
(series components); typical values. (series components); typical values.
MRC089
10
handbook, halfpage
Gp
(dB)
8
6
handbook, halfpage
4
Zi
ZL MBA451
2
0
800 840 880 920 960 1000
f (MHz)
1996 May 09 9
Philips Semiconductors Product specification
PACKAGE OUTLINE
0.10
0.01
3.7 7.3
3.3 6.7
16 o 16
o
max
1 2 3
o
10 0.80
1.80 max 2.3 0.1 M B
0.60
max (4x) MSA035 - 1
4.6
Dimensions in mm.
Fig.13 SOT223.
1996 May 09 10
Philips Semiconductors Product specification
DEFINITIONS
1996 May 09 11
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NXP:
BLT81 T/R BLT81,115