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BLT81 2-76125

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DISCRETE SEMICONDUCTORS

DATA SHEET

BLT81
UHF power transistor
Product specification 1996 May 09
Supersedes data of November 1992
Philips Semiconductors Product specification

UHF power transistor BLT81

FEATURES
• SMD encapsulation
• Gold metallization ensures excellent reliability.

handbook, halfpage 4
APPLICATIONS
• Hand-held radio equipment in the 900 MHz c
communication band.
b

DESCRIPTION
e
NPN silicon planar epitaxial transistor encapsulated in a
plastic SOT223 SMD package.
1 2 3
MAM043 - 1

PINNING - SOT223 Top view

PIN SYMBOL DESCRIPTION


1 e emitter
2 b base
3 e emitter
Fig.1 Simplified outline and symbol.
4 c collector

QUICK REFERENCE DATA


RF performance at Ts ≤ 60 °C in a common emitter test circuit (see Fig.7).

f VCE PL Gp ηC
MODE OF OPERATION
(MHz) (V) (W) (dB) (%)
7.5 1.2 ≥6 ≥60
CW, class-B narrow band 900
6 1.2 typ. 6.5 typ. 77

1996 May 09 2
Philips Semiconductors Product specification

UHF power transistor BLT81

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCBO collector-base voltage open emitter − 20 V
VCEO collector-emitter voltage open base − 9.5 V
VEBO emitter-base voltage open collector − 2.5 V
IC collector current (DC) − 500 mA
IC(AV) average collector current − 500 mA
Ptot total power dissipation Ts = 110 °C; note 1 − 2 W
Tstg storage temperature −65 +150 °C
Tj operating junction temperature − 175 °C

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT


Rth j-s thermal resistance from junction to soldering point Ptot = 2 W; Ts = 110 °C; note 1 32 K/W

Note to the “Limiting values” and “Thermal characteristics”


1. Ts is the temperature at the soldering point of the collector pin.

MRC094
1
handbook, halfpage

IC
(A)

10−1
1 10 102
VCE (V)

Ts = 110 °C.

Fig.2 DC SOAR.

1996 May 09 3
Philips Semiconductors Product specification

UHF power transistor BLT81

CHARACTERISTICS
Tj = 25 °C unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT


V(BR)CBO collector-base breakdown voltage open emitter; IC = 1 mA 20 − − V
V(BR)CEO collector-emitter breakdown voltage open base; IC = 10 mA 9.5 − − V
V(BR)EBO emitter-base breakdown voltage open collector; IE = 0.1 mA 2.5 − − V
ICES collector leakage current VCE = 10 V; VBE = 0 − − 0.1 mA
hFE DC current gain VCE = 5 V; IC = 300 mA; note 1; 25 − −
Cc collector capacitance VCB = 7.5 V; IE = ie = 0; f = 1 MHz; − 2.7 4 pF
Cre feedback capacitance VCE = 7.5 V; IC = 0; f = 1 MHz − 1.7 3 pF

Note
1. Measured under pulsed conditions: tp ≤ 200 µs; δ ≤ 0.02.

MRC090 MRC086
100 6
handbook, halfpage handbook, halfpage
hFE
Cc
80 (pF)

4
60

40
2

20

0 0
0 100 200 300 400 0 2 4 6 8 10
IC (mA) VCB (V)

VCE = 7.5 V; tp ≤ 200 µs; δ ≤ 0.02; Tj = 25 °C. IE = ie = 0; f = 1 MHz; Tj = 25 °C.

Fig.3 DC current gain as a function of collector Fig.4 Collector capacitance as a function of


current; typical values. collector-base voltage; typical values.

1996 May 09 4
Philips Semiconductors Product specification

UHF power transistor BLT81

APPLICATION INFORMATION
RF performance at Ts ≤ 60 °C in a common emitter test circuit (see note 1 and Fig.7).

f VCE PL Gp ηC
MODE OF OPERATION
(MHz) (V) (W) (dB) (%)
≥6 ≥60
7.5 1.2
CW, class-B narrow band 900 typ. 8 typ. 77
6 1.2 typ. 6.5 typ. 77

Note
1. Ts is the temperature at the soldering point of the collector pin.

Ruggedness in class-AB operation


The BLT81 is capable of withstanding a load mismatch corresponding to VSWR = 50 : 1 through all phases under the
following conditions: f = 900 MHz; VCE = 9 V; PL = 1.2 W; Ts ≤ 60 °C.

MRC088 MRC093
10 100 2.5
handbook, halfpage (1) handbook, halfpage
Gp Gp ηC PL
(dB) (2) (%) (W)
ηC
8 80 2.0
(4) (1)

(3)
6 60 1.5
(2)

4 40 1.0

2 20 0.5

0 0 0
0 0.4 0.8 1.2 1.6 2.0 0 100 200 300 400 500
PL (W) PIN (mW)

Class-B; f = 900 MHz; Ts ≤ 60 °C. Class-B; f = 900 MHz; Ts ≤ 60 °C.

(1) VCE = 7.5 V. (3) VCE = 7.5 V. (1) VCE = 7.5 V. (2) VCE = 6 V.
(2) VCE = 6 V. (4) VCE = 6 V.

Fig.5 Power gain and collector efficiency as Fig.6 Load power as a function of input
functions of load power; typical values. power; typical values.

1996 May 09 5
Philips Semiconductors Product specification

UHF power transistor BLT81

Test circuit information

handbook, full pagewidth

C2 C4 C6 C8 C10
C1 L1 L4 L5 L6 L8 L10 C14
50 Ω 50 Ω
input output
DUT
C3 L2 C5 C7 C11 C13

L7

L9
R1 L3
VCC

R2
C9 C12
MEA899

Fig.7 Common emitter test circuit for class-B operation at 900 MHz.

1996 May 09 6
Philips Semiconductors Product specification

UHF power transistor BLT81

List of components used in test circuit (see Figs 7 and 8)

COMPONENT DESCRIPTION VALUE DIMENSIONS CATALOGUE No.


C1, C14 multilayer ceramic chip capacitor; note 1 100 pF
C2 multilayer ceramic chip capacitor; note 1 3 pF
C3, C5, C11, C13 film dielectric trimmer 1.4 to 5.5 pF 2222 809 09004
C4 multilayer ceramic chip capacitor; note 1 5.6 pF
C6, C7, C10 multilayer ceramic chip capacitor; note 1 5.1 pF
C8 multilayer ceramic chip capacitor; note 1 3.6 pF
C9 multilayer ceramic chip capacitor; note 1 220 pF
C12 multilayer ceramic chip capacitor; 1 nF
L1 stripline; note 2 50 Ω length 26.6 mm
width 4.85 mm
L2 10 turns enamelled 0.6 mm copper wire 250 nH int. dia. 4.5 mm
leads 2 × 5 mm
L3, L9 grade 3B Ferroxcube wideband 4312 020 36640
HF choke
L4 stripline; note 2 50 Ω length 18 mm
width 4.85 mm
L5 stripline; note 2 75 Ω length 3.5 mm
width 2.5 mm
L6 stripline; note 2 50 Ω length 10 mm
width 4.85 mm
L7 4 turns enamelled 0.6 mm copper wire 65 nH int. dia. 4.5 mm
leads 2 × 5 mm
L8 stripline; note 2 50 Ω length 15 mm
width 4.85 mm
L10 stripline; note 2 50 Ω length 24.6 mm
width 4.85 mm
R1, R2 metal film resistor 10 Ω, 0.25 W

Notes
1. American Technical Ceramics type 100B or capacitor of same quality.
2. The striplines are on a double copper-clad printed-circuit board, with PTFE fibre-glass dielectric (εr = 2.2); thickness
1⁄ "; thickness of the copper sheet 35 µm.
16

1996 May 09 7
Philips Semiconductors Product specification

UHF power transistor BLT81

140
handbook, full pagewidth

strap strap

80

rivets
(14x)

strap mounting strap


screws
(8x)

VCC
L9
L3

C9 C12
L2 R2
R1
C2 C4 C6 L7 C10

C1 L1 L4 L5 L6 L8 L10 C14

C3 C5 C7 C8 C11 C13

MEA898

Dimensions in mm.
The components are situated on one side of the copper-clad PTFE fibre-glass board, the other side is unetched and serves as a ground plane.
Earth connections from the component side to the ground plane are made by means of fixing screws and copper foil straps under the emitter leads.

Fig.8 Printed-circuit board and component lay-out for 900 MHz class-B test circuit in Fig.7.

1996 May 09 8
Philips Semiconductors Product specification

UHF power transistor BLT81

MRC091 MRC092
10 20
handbook, halfpage handbook, halfpage
Zi ZL RL
(Ω) (Ω)
8 16

ri
6 12

4 xi 8

XL
2 4

0 0
800 840 880 920 960 1000 800 840 880 920 960 1000
f (MHz) f (MHz)

Class-B; VCE = 7.5 V; PL = 1.2 W; Ts ≤ 60 °C. Class-B; VCE = 7.5 V; PL = 1.2 W; Ts ≤ 60 °C.

Fig.9 Input impedance as a function of frequency Fig.10 Load impedance as a function of frequency
(series components); typical values. (series components); typical values.

MRC089
10
handbook, halfpage
Gp
(dB)
8

6
handbook, halfpage

4
Zi
ZL MBA451
2

0
800 840 880 920 960 1000
f (MHz)

Class-B; VCE = 7.5 V; PL = 1.2 W; Ts ≤ 60 °C.

Fig.11 Power gain as a function of


frequency; typical values. Fig.12 Definition of transistor impedance.

1996 May 09 9
Philips Semiconductors Product specification

UHF power transistor BLT81

PACKAGE OUTLINE

handbook, full pagewidth 0.95


0.85

S seating plane 0.1 S


0.32
0.24 6.7
6.3
3.1 B 0.2 M A
2.9
4
A

0.10
0.01
3.7 7.3
3.3 6.7

16 o 16
o
max

1 2 3
o
10 0.80
1.80 max 2.3 0.1 M B
0.60
max (4x) MSA035 - 1
4.6

Dimensions in mm.

Fig.13 SOT223.

1996 May 09 10
Philips Semiconductors Product specification

UHF power transistor BLT81

DEFINITIONS

Data Sheet Status


Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS


These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1996 May 09 11
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