What Is The Cause of Insufficient Solder

RAYMING PCB & ASSEMBLY
What is the cause of insufficient solder?

Soldering is a critical process used to mechanically and electrically join
components in electronic assemblies. Insufficient solder can lead to poor
quality solder joints that are unreliable both electrically and mechanically.
There are several potential causes that can result in insufficient solder
during the soldering process:
Table of Contents
Poor Solderability of Parts
The solderability refers to how well the parts to be soldered can wet and
adhere to solder. Following factors affect solderability:
Oxidation or Contamination
 Metal surfaces like component leads and PCB pads get oxidized
over time
 This makes solder wetting difficult resulting in poor joints
 Oil, grease or other residues also reduce solderability
Incompatible Materials
 Certain metals like stainless steel and aluminum do not solder well
 Lead-free solders have worse solderability than leaded solders
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 Mismatch between surfaces and solder alloy reduces wetting
Old Components
 Components stored for long periods have degraded solderability
 Moisture absorption also reduces solderability of parts
Lack of Solder Coating
 Components without pre-applied solder coating have poorer
solderability
 Coatings like hot solder dip, ENIG, immersion tin improve wetting
Thermal Damage
 Overheating parts during soldering destroys solderability
 Burnt or charred surfaces will not accept solder properly
Proper handling, storage and pretinning along with protective coatings is
needed to ensure good solderability of parts.
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Low Soldering Temperature

Sufficient temperature is essential for proper melting and wetting of
solder. Insufficient temperature causes:
 Solder joint is formed before flux can properly activate and remove
surface oxides
 Solder does not become fully molten and evenly flow over the joint
surfaces
 Partial wetting occurs resulting in weak joints with cold solder spots
Common reasons for low soldering temperature:
 Soldering iron tip is not properly tinned or maintained
 Low iron power rating or large tip being used
 Poor contact between iron tip and joint being soldered
 Excessive heat sinking in large ground planes and leads
 Fast motion of iron tip does not allow time for heating

Using adequate tip size, power rating, contact time/motion and re-tinning
maintenance helps avoid low temperatures.
Problems with Solder Paste Deposition
For reflow soldering, insufficient solder paste deposit will lead to poor
joints. Some contributing factors are:
 Excessive gap between component and PCB pad
 Misalignment of paste deposits with pads
 Too little paste dispensed due to volume setting issues
 Clogging or leaks in solder paste stencil
 Outgassing and drying of the paste deposit before reflow
 Slumping of paste due to high ambient temperatures
Good process controls, stencil cleaning, monitoring of paste deposits and
proper storage helps avoid these issues.
Defects in PCB and Component
PCB and component defects that absorb solder and restrict flow result in
insufficient solder:
PCB Defects
 Voids in ground or thermal planes acting as heat sinks
 Poor pad design with insufficient wetting area

 Contamination like oils and residues on pads
Component Defects
 Cross-talk barriers blocking flow between leads
 Tight lead spacing preventing access to solder
 Warped leads or gaps between lead and PCB pad
Inspecting PCBs and components and checking pad dimensions ensures
such issues are avoided.
Inadequate Flux
Flux removes surface oxides enabling solder flow and wetting. Following
flux related reasons reduce soldering effectiveness:
 Too little flux applied to joint
 Flux drying out before completing soldering
 Weak or water-soluble flux that is too mild
 Low activity of aged flux reducing cleaning capability
 Baked on or burnt flux residues interfering with wetting
Adequate amount of appropriate rosin-based flux should be applied to
maintain solderability.
Problems with Solder Wire

Issues with solder wire composition and condition also affect soldering:
 Impurities and voids in solder wire reducing fluidity -Insufficient
wire diameter to thermal mass of joint
 Oxidation or contamination of solder wire surface
 Mismatch between alloy melting point and process temperature
 Low tin-lead percentage of alloy increasing melting point
Proper solder wire handling and selection compatible with process
requirements avoids these problems.
Other Process Issues
 Excessive heat sinking due to large ground planes
 Jigging misalignment resulting in loss of contact between tipped
iron and joint

 Soldering for too short a duration to allow adequate heating
 Vibration or movement disturbing solder bead formation
 Poor fume extraction exposing joints to corrosive flux residues
Control and monitoring of process parameters is needed to counteract
these effects.
Troubleshooting Insufficient Solder
 Visually inspect joint closely under magnification to identify poor
wetting, cold spots etc.
 Use solderability testing chemicals like rosin that react when applied
to oxidized/contaminated areas
 Thermally profile temperatures at joint during soldering to check if
adequate temperature is reached
 Review process parameters like heat application duration, wire
gauge, tip size etc.
 Evaluate PCB design – thermal planes, pad dimensions, spacing etc.
 Test flux activity and assess paste condition
 Check for issues with solder bath contamination or dross buildup
if wave soldering
Preventing Insufficient Solder

 Use proper storage and handling of components to maintain
solderability
 Apply solderability preservatives like benzotriazole on surfaces
 Ensure PCB and component cleanliness before soldering
 Select the right solder alloy matched to process temperature
 Use adequate flux and apply uniformly to joints
 Clean and tin soldering iron tips regularly
 Optimize soldering temperature, duration and motion
 Inspect stencil condition and paste deposits
 Ensure adequate fillet wicking over joint
 Monitor the soldering process continuously and make adjustments
as needed
With proper analysis of root causes and preventive steps, issues due to
insufficient solder can be eliminated resulting in reliable, high quality
solder joints.
FAQs
Q1. How can I identify if insufficient solder is causing poor quality joints?
Look closely under magnification for joints with dull finish, grainy
structure, dark spots, non-wetting and dewetting of surfaces indicating
cold solder. Probe joints for continuity issues signalling poor bonding.

Q2. What is the ideal temperature for hand soldering with lead-tin alloy?
For Sn60Pb40 solder, ideal tip temperature is around 370℃ to 400℃.
Higher temperatures above 450℃ should be avoided to prevent damage
to components.
Q3. How does excess flux cause insufficient solder problems?
Too much flux can actually impede solder flow rather than helping it. It
also leads to charring which deposits residues that hinder wetting. A thin
uniform layer of flux should be applied.
Q4. Can inadequate solder volume be a reason for insufficient solder defects?
Yes, using too little solder wire compared to the thermal mass of the joint
can lead to insufficient solder. Larger wire diameter or longer application
time is required.
Q5. What is the effect of oxidation on solderability?
Metal oxide formation on surfaces interferes with solder wetting by
creating a barrier layer. Flux helps remove oxides but preventing oxidation
via protective coatings or oxidation inhibitors also improves solderability.
Related Posts:

1. What is the Significance of Solder Mask Defined Pads in Solder Pad
PCBs?
2. How to DIY a smd Stencil for Your PCB Solder
3. What is Solder Paste Stencil
4. What is Solder Paste ?
https://www.raypcb.com/analysis-of-the-causes-of-insufficient-solder-gloss-at-smt-patch/

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RAYMING PCB & ASSEMBLY

What is the cause of insufficient solder?

components in electronic assemblies. Insufficient solder can lead to poor

during the soldering process:

Poor Solderability of Parts

adhere to solder. Following factors affect solderability:

 This makes solder wetting difficult resulting in poor joints

 Oil, grease or other residues also reduce solderability

 Lead-free solders have worse solderability than leaded solders

PCB Manufacturing & Assembly Services https://www.raypcb.com/

 Mismatch between surfaces and solder alloy reduces wetting

 Components stored for long periods have degraded solderability

 Moisture absorption also reduces solderability of parts

Lack of Solder Coating

 Components without pre-applied solder coating have poorer

 Overheating parts during soldering destroys solderability

 Burnt or charred surfaces will not accept solder properly

Proper handling, storage and pretinning along with protective coatings is

needed to ensure good solderability of parts.

Request PCB Manufacturing & Assembly Quote Now

Low Soldering Temperature

PCB Manufacturing & Assembly Services https://www.raypcb.com/

Sufficient temperature is essential for proper melting and wetting of

solder. Insufficient temperature causes:

Common reasons for low soldering temperature:

 Soldering iron tip is not properly tinned or maintained

 Low iron power rating or large tip being used

 Poor contact between iron tip and joint being soldered

 Excessive heat sinking in large ground planes and leads

PCB Manufacturing & Assembly Services https://www.raypcb.com/

maintenance helps avoid low temperatures.

Problems with Solder Paste Deposition

joints. Some contributing factors are:

 Excessive gap between component and PCB pad

 Misalignment of paste deposits with pads

 Too little paste dispensed due to volume setting issues

 Clogging or leaks in solder paste stencil

 Outgassing and drying of the paste deposit before reflow

 Slumping of paste due to high ambient temperatures

Good process controls, stencil cleaning, monitoring of paste deposits and

proper storage helps avoid these issues.

Defects in PCB and Component

 Voids in ground or thermal planes acting as heat sinks

 Poor pad design with insufficient wetting area

 Contamination like oils and residues on pads

 Cross-talk barriers blocking flow between leads

 Tight lead spacing preventing access to solder

 Warped leads or gaps between lead and PCB pad

Inspecting PCBs and components and checking pad dimensions ensures

such issues are avoided.

flux related reasons reduce soldering effectiveness:

 Too little flux applied to joint

 Flux drying out before completing soldering

 Weak or water-soluble flux that is too mild

 Low activity of aged flux reducing cleaning capability

 Baked on or burnt flux residues interfering with wetting

Adequate amount of appropriate rosin-based flux should be applied to

Problems with Solder Wire