LM237, LM337

3-TERMINAL ADJUSTABLE REGULATORS

www.ti.com
SLVS047K – NOVEMBER 1981 – REVISED NOVEMBER 2007

1FEATURES
• Output Voltage Range Adjustable From
2 • Peak Output Current Constant Over
–1.2 V to –37 V Temperature Range of Regulator
• Output Current Capability of 1.5 A Max • Ripple Rejection Typically 77 dB
• Input Regulation Typically 0.01% Per • Direct Replacement for Industry-Standard
Input-Voltage Change LM237 and LM337
• Output Regulation Typically 0.3%
LM237, LM337...KC (TO-220) PACKAGE LM337...KCS (TO-220) PACKAGE
(TOP VIEW) (TOP VIEW)

INPUT
OUTPUT
INPUT

OUTPUT INPUT
INPUT ADJUSTMENT
ADJUSTMENT

LM337...KTE, KTP, OR KVU PACKAGE LM337...KTT (TO-263) PACKAGE

(TOP VIEW) (TOP VIEW)

OUTPUT OUTPUT
INPUT
INPUT

INPUT INPUT
ADJUSTMENT ADJUSTMENT

DESCRIPTION/ORDERING INFORMATION
The LM237 and LM337 are adjustable 3-terminal negative-voltage regulators capable of supplying in excess of
–1.5 A over an output voltage range of –1.2 V to –37 V. They are exceptionally easy to use, requiring only two
external resistors to set the output voltage and one output capacitor for frequency compensation. The current
design has been optimized for excellent regulation and low thermal transients. In addition, the LM237 and LM337
feature internal current limiting, thermal shutdown, and safe-area compensation, making them virtually immune to
failure by overloads.
The LM237 and LM337 serve a wide variety of applications, including local on-card regulation, programmable
output-voltage regulation, and precision current regulation.

ORDERING INFORMATION
TJ PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING
–25°C to 150°C TO-220 – KC Tube of 50 LM237KC LM237
PowerFLEX™ – KTE Reel of 2000 LM337KTER LM337
PowerFLEX – KTP Reel of 3000 LM337KTPR L337
TO-220 – KC Tube of 50 LM337KC LM337
0°C to 125°C
TO-220 – KCS Tube of 50 LM337KCSE3 LM337
TO-252 – KVU Reel of 2500 LM337KVURG3 LM337
TO-263 – KTT Reel of 500 LM337KTTR LM337

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 PowerFLEX is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas Copyright © 1981–2007, Texas Instruments Incorporated
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM237, LM337
3-TERMINAL ADJUSTABLE REGULATORS www.ti.com
SLVS047K – NOVEMBER 1981 – REVISED NOVEMBER 2007

SCHEMATIC DIAGRAM
ADJUSTMENT

OUTPUT

INPUT

Absolute Maximum Ratings (1)

over operating temperature ranges (unless otherwise noted)
MIN MAX UNIT
VI – VO Input-to-output differential voltage –40 V
TJ Operating virtual junction temperature 150 °C
Lead temperature 1,6 mm (1/16 in) from case for 10 s 260 °C
Tstg Storage temperature range –65 150 °C

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Package Thermal Data (1)

PACKAGE BOARD θJC θJA
PowerFLEX (KTE) High K, JESD 51-5 3°C/W 23°C/W
PowerFLEX (KTP) High K, JESD 51-5 19°C/W 28°C/W
TO-220 (KC) High K, JESD 51-5 3°C/W 24.8°C/W
TO-220 (KCS) High K, JESD 51-5 3°C/W 24.8°C/W
TO-252 (KVU) High K, JESD 51-5 30.3°C/W
TO-263 (KTT) High K, JESD 51-5 18°C/W 25.3°C/W

(1) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.

2 Submit Documentation Feedback Copyright © 1981–2007, Texas Instruments Incorporated

Product Folder Link(s): LM237 LM337

 LM237, LM337
www.ti.com
3-TERMINAL ADJUSTABLE REGULATORS
SLVS047K – NOVEMBER 1981 – REVISED NOVEMBER 2007

Recommended Operating Conditions

MIN MAX UNIT
|VI – VO| ≤ 40 V, P ≤ 15 W 10 1500
IO Output current mA
|VI – VO| ≤ 10 V, P ≤ 15 W 6 1500
LM237 –25 150
TJ Operating virtual junction temperature °C
LM337 0 125

Electrical Characteristics
over recommended ranges of operating virtual junction temperature (unless otherwise noted)
LM237 LM337
PARAMETER TEST CONDITIONS (1) UNIT
MIN TYP MAX MIN TYP MAX
TJ = 25°C 0.01 0.02 0.01 0.04
Input regulation (2) VI – VO = –3 V to –40 V %/V
TJ = MIN to MAX 0.02 0.05 0.02 0.07
VO = –10 V, f = 120 Hz 60 60
Ripple rejection dB
VO = –10 V, f = 120 Hz, CADJ = 10 µF 66 77 66 77
IO = 10 mA to 1.5 A, |VO| ≤ 5 V 25 50 mV
TJ = 25°C |VO| ≥ 5 V 0.3 0.5 0.3 1 %
Output regulation
|VO| ≤ 5 V 50 70 mV
IO = 10 mA to 1.5 A
|VO| ≥ 5 V 1 1.5 %
Output-voltage change with
TJ = MIN to MAX 0.6 0.6 %
temperature
Output-voltage
After 1000 h at TJ = MAX and VI – VO = –40 V 0.3 1 0.3 1 %
long-term drift
Output noise voltage f = 10 Hz to 10 kHz, TJ = 25°C 0.003 0.003 %
Minimum output current to |VI – VO| ≤ 40 V 2.5 5 2.5 10
mA
maintain regulation |VI – VO| ≤ 10 V 1.2 3 1.5 6
|VI – VO| ≤ 15 V 1.5 2.2 1.5 2.2
Peak output current A
|VI – VO| ≤ 40 V, TJ = 25°C 0.24 0.4 0.15 0.4
ADJUSTMENT current 65 100 65 100 µA
Change in ADJUSTMENT VI – VO = –2.5 V to –40 V, IO = 10 mA to MAX,
2 5 2 5 µA
current TJ = 25°C
Reference voltage VI – VO = –3 V to –40 V, TJ = 25°C –1.225 –1.25 –1.275 –1.213 –1.25 –1.287
(OUTPUT to IO = 10 mA to 1.5 A, V
ADJUSTMENT) P ≤ rated dissipation TJ = MIN to MAX –1.2 –1.25 –1.3 –1.2 –1.25 –1.3
Thermal regulation Initial TJ = 25°C, 10-ms pulse 0.002 0.02 0.003 0.04 %/W

(1) Unless otherwise noted, the following test conditions apply: |VI – VO| = 5 V and IO = 0.5 A. For conditions shown as MIN or MAX, use
the appropriate value specified under recommended operating conditions. All characteristics are measured with a 0.1-µF capacitor
across the input and a 1-µF capacitor across the output. Pulse-testing techniques are used to maintain the junction temperature as close
to the ambient temperature as possible. Thermal effects must be taken into account separately.
(2) Input regulation is expressed here as the percentage change in output voltage per 1-V change at the input.

Copyright © 1981–2007, Texas Instruments Incorporated Submit Documentation Feedback 3

Product Folder Link(s): LM237 LM337
LM237, LM337
3-TERMINAL ADJUSTABLE REGULATORS www.ti.com
SLVS047K – NOVEMBER 1981 – REVISED NOVEMBER 2007

Electrical Characteristics
TJ = 25°C
LM237, LM337
PARAMETER TEST CONDITIONS (1) UNIT
MIN TYP MAX
Input regulation (2) VI – VO = –3 V to –40 V 0.01 0.04 %/V
VO = –10 V, f = 120 Hz 60
Ripple rejection dB
VO = –10 V, f = 120 Hz, CADJ = 10 µF 66 77
|VO| ≤ 5 V 50 mV
Output regulation IO = 10 mA to 1.5 A
|VO| ≥ 5 V 0.3 1 %
Output noise voltage f = 10 Hz to 10 kHz 0.003 %
Minimum output current to maintain |VI – VO| ≤ 40 V 2.5 10
mA
regulation |VI – VO| ≤ 10 V 1.5 6
|VI – VO| ≤ 15 V 1.5 2.2
Peak output current A
|VI – VO| ≤ 40 V 0.15 0.4
ADJUSTMENT current 65 100 µA
Change in ADJUSTMENT current VI – VO = –2.5 V to –40 V, IO = 10 mA to MAX 2 5 µA
Reference voltage VI – VO = –3 V to –40 V, IO = 10 mA to 1.5 A,
–1.213 –1.25 –1.287 V
(OUTPUT to ADJUSTMENT) P ≤ rated dissipation

(1) Unless otherwise noted, the following test conditions apply: |VI – VO| = 5 V and IO = 0.5 A. All characteristics are measured with a
0.1-µF capacitor across the input and a 1-µF capacitor across the output. Pulse-testing techniques are used to maintain the junction
temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately.
(2) Input regulation is expressed here as the percentage change in output voltage per 1-V change at the input.

4 Submit Documentation Feedback Copyright © 1981–2007, Texas Instruments Incorporated

Product Folder Link(s): LM237 LM337

 LM237, LM337
www.ti.com
3-TERMINAL ADJUSTABLE REGULATORS
SLVS047K – NOVEMBER 1981 – REVISED NOVEMBER 2007

APPLICATION INFORMATION
LM237
or
LM337

VI INPUT OUTPUT VO

ADJUSTMENT
R1

C1 C2
+ +
R2

R1 typically is 120 Ω.

R2 + R1 ǒ –V
O *1
–1..25
Ǔ , where VO is the output in volts.

C1 is a 1-µF solid tantalum capacitor required only if the regulator is more than 10 cm (4 in) from the power-supply filter capacitor.
C2 is a 1-µF solid tantalum or 10-µF aluminum electrolytic capacitor required for stability.

Figure 1. Adjustable Negative-Voltage Regulator

LM237
or
LM337

RS
VI INPUT OUTPUT VO
ADJUSTMENT

1.25 V
RS =
ILIMIT

Figure 2. Current-Limiting Circuit

Copyright © 1981–2007, Texas Instruments Incorporated Submit Documentation Feedback 5

Product Folder Link(s): LM237 LM337
 PACKAGE OPTION ADDENDUM

www.ti.com 21-May-2013

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (3) (4/5)

LM237KC OBSOLETE TO-220 KC 3 TBD Call TI Call TI -25 to 150 LM237

LM237KCE3 OBSOLETE TO-220 KC 3 TBD Call TI Call TI -25 to 150 LM237
LM237KCSE3 ACTIVE TO-220 KCS 3 50 Pb-Free CU SN N / A for Pkg Type -25 to 150 LM237
(RoHS)
LM237KTER OBSOLETE PFM KTE 3 TBD Call TI Call TI -25 to 150
LM337KC OBSOLETE TO-220 KC 3 TBD Call TI Call TI 0 to 125 LM337
LM337KCE3 OBSOLETE TO-220 KC 3 TBD Call TI Call TI 0 to 125 LM337
LM337KCSE3 ACTIVE TO-220 KCS 3 50 Pb-Free CU SN N / A for Pkg Type 0 to 125 LM337
(RoHS)
LM337KTER OBSOLETE PFM KTE 3 TBD Call TI Call TI 0 to 125 LM337
LM337KTPR OBSOLETE PFM KTP 2 TBD Call TI Call TI 0 to 125 L337
LM337KTPRG3 OBSOLETE PFM KTP 2 TBD Call TI Call TI 0 to 125 L337
LM337KTTR ACTIVE DDPAK/ KTT 3 500 Green (RoHS CU SN Level-3-245C-168 HR 0 to 125 LM337
TO-263 & no Sb/Br)
LM337KTTRG3 ACTIVE DDPAK/ KTT 3 500 Green (RoHS CU SN Level-3-245C-168 HR 0 to 125 LM337
TO-263 & no Sb/Br)
LM337KVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS CU SN Level-3-260C-168 HR 0 to 125 LM337
& no Sb/Br)
LM337Y OBSOLETE DIESALE Y 0 TBD Call TI Call TI 0 to 125

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 21-May-2013

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 29-May-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM337KTTR DDPAK/ KTT 3 500 330.0 24.4 10.6 15.8 4.9 16.0 24.0 Q2
TO-263
LM337KVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 29-May-2013

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM337KTTR DDPAK/TO-263 KTT 3 500 340.0 340.0 38.0
LM337KVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0

Pack Materials-Page 2
 MECHANICAL DATA

MPFM001E – OCTOBER 1994 – REVISED JANUARY 2001

KTE (R-PSFM-G3) PowerFLEX PLASTIC FLANGE-MOUNT

0.375 (9,52) 0.080 (2,03)

0.365 (9,27) 0.070 (1,78)
0.360 (9,14) 0.050 (1,27)
0.350 (8,89) 0.040 (1,02)
0.220 (5,59) 0.010 (0,25) NOM
NOM

Thermal Tab
(See Note C)
0.360 (9,14)
0.295 (7,49)
0.350 (8,89)
NOM
0.320 (8,13)
0.420 (10,67)
0.310 (7,87)
0.410 (10,41)

1 3

0.025 (0,63)
Seating Plane
0.031 (0,79)
0.004 (0,10)
0.100 (2,54) 0.010 (0,25) M
0.005 (0,13)
0.200 (5,08)
0.001 (0,03)

0.041 (1,04)
0.010 (0,25) 0.031 (0,79)
NOM
Gage Plane

3°– 6°

0.010 (0,25)

4073375/F 12/00

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.
C. The center lead is in electrical contact with the thermal tab.
D. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15).
E. Falls within JEDEC MO-169

PowerFLEX is a trademark of Texas Instruments.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1

 MECHANICAL DATA

MPSF001F – JANUARY 1996 – REVISED JANUARY 2002

KTP (R-PSFM-G2) PowerFLEX PLASTIC FLANGE-MOUNT PACKAGE

0.080 (2,03)
0.243 (6,17)
0.070 (1,78)
0.233 (5,91)
0.228 (5,79) 0.050 (1,27)
0.218 (5,54) 0.040 (1,02)

0.130 (3,30) NOM 0.010 (0,25) NOM

Thermal Tab
0.215 (5,46) (See Note C)
0.287 (7,29)
NOM 0.247 (6,27) 0.277 (7,03)
0.237 (6,02)
0.381 (9,68)
0.371 (9,42)
0.100 (2,54)
0.090 (2,29)
0.032 (0,81) MAX
Seating Plane
0.090 (2,29) 0.004 (0,10)
0.031 (0,79) 0.005 (0,13)
0.025 (0,63) 0.001 (0,02)
0.180 (4,57)
0.010 (0,25) M

0.047 (1,19)
0.010 (0,25) NOM
0.037 (0,94)
Gage Plane

0.010 (0,25)
2°–ā6°

4073388/M 01/02

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.
C. The center lead is in electrical contact with the thermal tab.
D. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15).
E. Falls within JEDEC TO-252 variation AC.

PowerFLEX is a trademark of Texas Instruments.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1

 IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated