ADS Chap4 Resonators

Resonant Circuits and Filters 49
As Figure 4-44 shows the attenuation of -60 dBc at 146 MHz has been
achieved with a good margin.
4.8.4 Physical Model of the High Pass Filter in ADS
Using the same techniques as described for the Low Pass Filter design we can
proceed with the High Pass Filter realization. The Filter DesignGuide
application calculated series capacitance values of 6.416 pF and 3.614 pF.
Looking through the available ATC 700B series chip capacitors, the nearest
values are 6.8 pF and 3.9 pF capacitors. The shunt inductors are realized using
the Air Wound inductor models. Figure 4-45 shows the completed assembly
of the High Pass Filter on a printed circuit board with coaxial SMA
connectors.
Figure 4-45 Physical prototype of the 420 MHz highpass filter (courtesy of BT
Microwave LLC)
4.9 Distributed Filter Design
4.9.1 Microstrip Stepped Impedance Low Pass Filter

Design
In the microwave frequency region filters can be designed using distributed

transmission lines. Series inductors and shunt capacitors can be realized with
microstrip transmission lines. In the next section we will explore the
conversion of a lumped element low pass filter to a design that is realized
entirely in microstrip.
50 RF and Microwave Circuit Design
Example 4.9-1: Design a lumped element 2.2 GHz Chebyshev-response

lowpass filter having 0.1 dB passband ripple and -40 dB rejection at 6 GHz.
Convert all the lumped elements to microstrip transmission lines. The
r= 10.2) with a 0.025 inch
dielectric thickness.
Solution: Following the procedure discussed in Example 4.8-1, the

SmartComponent design of the lowpass filter is show in Figure 4-46.
Figure 4-46 Lumped element design of the 2.2 GHz low pass filter
The lumped element sub-network of the filter is shown in Figure 4-47.

.
Figure 4-47 Lumped element 2.2 GHz low pass filter
The simulated response of the filter is shown in Figure 4-48.

Figure 4-48 Response of the lumped element 2.2 GHz lowpass filter
The marker m1 in Figure 4-48 shows that the 3 dB bandwidth of the lowpass
filter is 2495 MHz.
4.9.2 Lumped Element to Distributed Element

Conversion
After a Filter DesignGuide SmartComponent has been designed, the lumped
inductors and capacitors can be transformed into equivalent distributed
element counterparts using the ADS Transformation Assistant. The Filter
Transformation Assistant helps us to quickly and easily transform an ideal
filter topology to a form that is realizable for RF and microwave systems.
The Transformation Assistant is opened from the Filter DesignGuide Control
window, by selecting Tools > Distributed Element Transformations. When the
Transformation Assistant is opened, the SmartComponent subnetwork appears
in the schematic window and a dialog box is opened. The transformations are
then accomplished using the controls on the dialog box.
After the Transformation Assistant has been selected, the graphical area
displays the components that can be transformed. Black components represent
elements included in the original circuit available for transformation, while
gray components represent elements not included in the original circuit.
Check the LC, TLine to Microstrip transformations and select the series
inductors L1 and L2 to be transformed to microstrip transmission lines.
Set the characteristic impedance of the microstrip line to Z0 = 80 Ohm and

enter the microstrip substrate parameters, as shown in Figure 4-49.
Figure 4-49 Transformation Assistance window
Click Transform and then click OK. As Figure 4-50 shows the series inductors
L1 and L2 have been
microstrip substrate.
Figure 4-50 Series inductors transformed to microstrip lines

From the graphical area, use the left red arrow to select the shunt capacitors
for transformation. The graphical area changes to reveal the other distributed
element equivalents available for substitution. Repeat the same process for the
capacitors but select Z0 = 20 Ohm, as shown in Figure 4-51.
Figure 4-51 Transformation of line
Click Transform and then click OK. Now the capacitors have also been
transformed to microstrip lines.
Figure 4-52 Initial schematic of the distributed low pass filter

Now the lumped element filter in Figure 4-47 has been converted to
microstrip stepped impedance low pass filter of Figure 4-52. Simulate the
schematic in Figure 4-46 and display the response from 0 to 10 GHz.
Figure 4-53 Initial response of the low pass filter
Note that the marker m1 in Figure 4-53 shows that the 3 dB bandwidth of the
lowpass filter has slightly decreased to 2421 MHz.
The printed circuit board layout of the initial lowpass filter is shown in Figure
4-54.
Figure 4-54 Initial PCB layout of the lowpass filter
Examine the printed circuit board, PCB, layout of the lowpass filter of Figure
4-54. Note the change in geometry as the impedance transitions from 50 at
the input to 20 representing the shunt capacitor, and then from 20 to 80
representing the series inductor. These abrupt changes in geometry are
known as discontinuities. Discontinuities in geometry result in fringing
capacitance and parasitic inductance that will modify the frequency response
of the circuit. At RF and lower microwave frequencies (up to about 2 GHz)
the effects of discontinuities are minimal and sometimes neglected [4]. As the
operation frequency increases, the effects of discontinuities can significantly
alter the performance of a microstrip circuit. ADS software has several model
elements that can help to account for the effects of discontinuities. These
include: T-junctions, cross junctions, open circuit end effects, coupling gaps,
and bends.
A Microstrip Step element can be placed between series lines of abruptly

changing geometry to account for the step discontinuity. Place the Microstrip
Step element at each impedance transition in the filter. Make sure that the
narrow side and wide side are directed appropriately. The Microstrip Step
element, MSTEP, will automatically use the adjacent width in its calculation.
Figure 4-55 shows the lowpass stepped impedance filter with the step
elements added between each transmission line section.
Figure 4-55
The simulated response of the modified filter is shown in Figure 4-56.
Figure 4-56 Filter frequency shift due to step discontinuities

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Resonant Circuits and Filters 49

4.8.4 Physical Model of the High Pass Filter in ADS

4.9 Distributed Filter Design

4.9.1 Microstrip Stepped Impedance Low Pass Filter

In the microwave frequency region filters can be designed using distributed

Example 4.9-1: Design a lumped element 2.2 GHz Chebyshev-response

Solution: Following the procedure discussed in Example 4.8-1, the

The lumped element sub-network of the filter is shown in Figure 4-47.

Figure 4-47 Lumped element 2.2 GHz low pass filter

The simulated response of the filter is shown in Figure 4-48.

4.9.2 Lumped Element to Distributed Element

Set the characteristic impedance of the microstrip line to Z0 = 80 Ohm and

Figure 4-49 Transformation Assistance window

Figure 4-50 Series inductors transformed to microstrip lines

Figure 4-51 Transformation of line

Figure 4-52 Initial schematic of the distributed low pass filter

Figure 4-53 Initial response of the low pass filter

Figure 4-54 Initial PCB layout of the lowpass filter

A Microstrip Step element can be placed between series lines of abruptly

The simulated response of the modified filter is shown in Figure 4-56.

Figure 4-56 Filter frequency shift due to step discontinuities

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