Potting & Encapsulation Materials

Catalog
 Design compromise
not an option?
At Parker LORD, we have been developing custom potting and
encapsulant solutions for more than 50 years. Whether utilizing epoxy,
silicone or urethane polymer systems, we continue to deliver results
for demanding applications in a wide variety of industries including
automotive, energy, medical, aerospace, telecommunications and
industrial electronics based on our customers’ design and specification
needs.

Our products offer diverse encapsulant application options including use

in ignition coils, engine control modules, transmission control modules,
sensors, power supplies, transformers and other critical electronic
equipment.

If you need help choosing one of our standard potting and encapsulant
products or if you need a custom material to meet your needs, let us
help you determine an appropriate solution for your application.

Parker LORD partners with customers to

leverage expertise in multiple chemistries SILICONES EPOXIES URETHANES

and diverse applications to develop Silicones are one of the most

versatile chemistries and offer
Epoxies provide strength, versatility,
durability, adhesion, chemical
Urethanes are considered to be a
great alternative to silicones when

customized solutions.
inherent flexibility spanning over resistance and high temperature high temperature resistance is not
a wide temperature range (-75°C tolerance in adhesive, potting required. For electronic packaging,
to +200°C). Silicone products are and encapsulant applications. urethanes are known to work best in
widely known to protect fragile These products can be formulated low-temperature applications. They
electronic components and modules to fit a variety of applications protect stress-sensitive electronic
where flame and high temperature and requirements thanks to the devices and act as a barrier against
resistance and permanent flexibility wide availability of raw materials. water. We offer low viscosity urethane
are top priorities. We offer addition- We offer a wide range of epoxy products ranging from soft gels to
cured and condensation-cured products from extremely flexible to semi-rigid casting materials that
silicones, either filled or unfilled. highly-rigid casting materials, either are designed to fit various potting
filled or unfilled, that are thermally application needs.
and/or electrically conductive and
flame retardant.

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 Components Can be used Dielectric Thermal
Thermally Viscosity, Mix Ratio by Cure
Chemistry with multiple UL Rating Appearance Hardness Strength, Conductivity, Description
Conductive 1K 2K cP @ 25°C Weight Schedule
hardeners kV/mm (V/mil) W/m·K
CoolTherm® Silicone x x UL 94 V-0 Red 30,000 1:1 16-24 hr 65 Shore A 17.1 (434) 0.7 High density, thermally conductive
SC-6702 @ 85°C primerless silicone for encapsulating
sensitive electronic modules
CoolTherm Silicone x x UL 94 V-0 Light Gray 8,000 1:1 4 hr @ 65°C 60 Shore A 19.7 (500) 0.8 Two-component, thermally conductive
SC- 6703 silicone for encapsulating densely packed
power units
CoolTherm Silicone x x x White 30,000 100:0.5 12-16 hr 60 Shore A 23.6 (600) 0.8 Thermally conductive silicone with good
SC-6708 WHT / 6731 @ 25°C; or electrical properties
4 hr @ 65°C
CoolTherm Silicone x x x White 32,000 100:0.5 12-16 hr 60 Shore A 21.6 (550) 1.0 Two-component, thermally conductive
SC-6709 / 6731 @ 25°C silicone with outstanding electrical
properties
CoolTherm Silicone x x x Red 20,000 100:0.5 12-16 hr 65 Shore A 19.7 (500) 1.0 Two-component, low viscosity, thermally
SC-6710 RED / 6731 @ 25°C conductive RTV silicone for applications
requiring low stress, rapid heat transfer, high
temperature and repairability
CoolTherm Silicone x x x White 30,000 100:0.5 12-16 hr 60 Shore A 19.7 (500) 1.0 Two-component, thermally conductive
SC-6711 WHT / 6731 @ 25°C silicone with outstanding electrical
properties
CoolTherm Silicone x x Red 15,000 1:1 4 hr @ 85°C 45 Shore A 1.16 High density, thermally conductive,
SC-6725 primerless silicone
CoolTherm Silicone x x Red 56,000 1:1 4 hr @ 85°C 70 Shore A 13.8 (350) 0.8 High density, thermally conductive,
SC-6726 primerless silicone
CoolTherm Silicone x x UL 94 V-0 Light Pink 30,000 1:1 24 hr @ 25°C; 50 Shore A 7.4 (188) 4.0 Two-component, high thermally
SC-324 or 60 min conductive silicone for electrical/electronic
@ 125°C encapsulating applications
CoolTherm Silicone x x Gray 18,000 1:1 24 hr @ 25°C; 60 Shore A 8.7 (220) 2.5 Two-component, medium thermally
SC-252 or 30 min conductive silicone which can be cured at
@ 120°C relatively low temperature
CoolTherm Silicone x x UL 94 V-0 Gray 7,000 1:1 24 hr @ 25°C; 65 Shore A 17.3 (440) 0.8 Two-component, thermally conductive
SC-104 or 10-15 min silicone
@ 100°C
CoolTherm Silicone x x UL 94 V-0, Gray 6,000 1:1 24 hr @ 25°C; 45 Shore A 17.3 (440) 0.9 Two-component, thermally conductive
SC-303 UL RTI 200°C or 10-15 min silicone for encapsulating applications
@ 100°C requiring high heat dissipation
CoolTherm Silicone x x UL 94 V-0, Gray 4,000 1:1 24 hr @ 25°C; 60 Shore A 19.7 (500) 0.7 Two-component, thermally conductive
SC-305 UL RTI 170°C or 10 min silicone for the protection of electrical/
@ 100°C electronic applications where heat
dissipation is critical
CoolTherm Silicone x x UL 94 V-0, Gray 3,600 1:1 24 hr @ 25°C; 45 Shore A 23.6 (600) 1.0 Two-component, thermally conductive
SC-309 UL RTI 180°C or 10 min silicone for the protection of electrical/
@ 120°C electronic applications where heat
dissipation is critical
CoolTherm Silicone x x UL 94 V-0, Light Pink 22,000 1:1 24 hr @ 25°C; 54 Shore A 7.9 (200) 3.0 Two-component, thermally conductive
SC-320 UL RTI 180°C or 60 min silicone for the protection of electrical/
@ 125°C electronic applications where heat
dissipation is critical
CoolTherm Silicone x x White 7,000 10:1 12 hr @ 25°C; 35 Shore A 19.7 (500) Two-component, solvent-free silicone for
SC-6712 WHT/ 6730 or 2 hr @ 65°C potting and encapsulating densely packed
components and making flexible molds
CoolTherm Silicone x x White 12,000 10:1 24 hr @ 25°C; 35 Shore A 19.7 (500) Two-component, solvent-free silicone for
SC-6715 / 6730 or 2-4 hr potting and encapsulating densely packed
@ 65°C components and making flexible molds
CircalokTM Silicone x Black 10,000 100:2.5 12-16 hr 45 Shore A 19.7 (500) Solvent-free silicone for potting and
6716 / 6733 @ 25°C encapsulating low- and high-voltage
electrical assemblies

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 Components Can be used Dielectric Thermal
Thermally Viscosity, Mix Ratio by Cure
Chemistry with multiple UL Rating Appearance Hardness Strength, Conductivity, Description
Conductive 1K 2K cP @ 25°C Weight Schedule
hardeners kV/mm (V/mil) W/m·K
CoolTherm Silicone x Red 15,100 100:5 8-12 hr @ 25°C 60 Shore A 19.7 (500) Two-component, condensation curing,
SC-6717 / 6731 solvent-free silicone RTV for potting,
encapsulating or coating applications
Circalok Silicone x Clear 3,500 10:1 4 hr @ 65°C 40 Shore A 17.7 (450) Clear, low viscosity, two-component silicone
6735 that produces a clear, flexible elastomer that
adheres to most substrates without a primer
Circalok Silicone x Black 2,700 1:1 2 hr @ 25°C; or 55 Shore A 17.7 (450) Low viscosity, flame retardant, room
6744 45 min @ 65°C temperature curing silicone
ThermosetTM Silicone x Clear 160 1:1 24 hr @ 25°C Gel 19.7 (500) Electronic-grade silicone gel encapsulant
SC-300M
Thermoset Silicone x White 200 1:1 1 hr @ 25°C Gel 19.7 (500) Electronic-grade silicone gel encapsulant
SC-316
Thermoset Silicone x Green 45,000 45-75 min 40 Shore OO One-component, rapid cure silicone
SC-318S @ 125°C; or designed for use as an encapsulant or
30-60 min coating to protect electronic devices
@ 150°C
Thermoset Silicone x Black 1,000 1:1 2 hr @ 25°C 70 Shore OO Two-component, room temperature curing
SC-319 silicone encapsulant
Circalok Adhesion x Clear or Red 1 60-90 min Primer for bonding RTV silicones to metal
6756 Promoter - @ 25°C and glass
Silicone
LORD® Adhesion x Clear or Red 5 30-60 min Electronic-grade primer for bonding tin-
P-1291 Promoter - @ 25°C catalyzed RTV silicone to most metals and
Silicone glass
LORD Adhesion x Blue 5 30-60 min Electronic-grade primer for bonding
P-1292 Promoter - @ 25°C platinum-catalyzed RTV silicone to most
Silicone metals and glass
CoolTherm Epoxy x x Dark Gray 8,000 @ 60°C 1:1 Staged Cure: 90 Shore D 15.4 (390) 3.3 Two-component, electrically insulating
EP-3500 2 hr each @ epoxy encapsulant with very high thermal
120°C, 150°C, conductivity, low thermal expansion and
180°C & 210°C high-temperature stability
CoolTherm Epoxy x x UL 94 V-0 Black 22,500 100:17.5 24 hr @ 25°C; 90 Shore D 19.7 (500) 1.1 Thermally conductive, low shrinkage, two-
EP-6006 HS /6011 or 2 hr @ 65°C component epoxy
CoolTherm Epoxy x x x UL 94 V-0 Black 14,200 100:5.5 12-16 hr 85 Shore D 19.3 (490) 0.6 Thermally conductive adhesive and potting
EP-6007 BLK/ 6010 @ 25°C compound
CoolTherm Epoxy x x UL 94 V-0 Black 12,000 1:1 24 hr @ 25°C; 75 Shore D 18.7 (475) 1.0 Low viscosity, flame retardant, room
EP-6035 or 2 hr @ 65°C temperature curing epoxy
CoolTherm Epoxy x x x Black or Green 25,000 100:7.1 24 hr @ 25°C; 92 Shore D >15.7 (>400) 1.1 Two-component epoxy for the
EP-6037/ 6252 or 2 hr @ 65°C semiconductor industry
CoolTherm Epoxy x x x UL 94 HB (only Black 10,000 100:7 24 hr @ 25°C 90 Shore D 16.9 (430) 1.5 Filled, thermally conductive epoxy for use
EP-340 / 70 with Thermoset with various hardeners
Hardener No. 70)
CoolTherm Epoxy x x Black or White 10,350 100:5.3 24 hr @ 25°C; 87 Shore D 19.7 (500) 1.3 Thermally conductive casting epoxy
EP-301 AD / 6010 or 2 hr @ 65°C
CoolTherm Epoxy x x Black 55 100:3.9 2 hr @ 65°C 90 Shore D 59 (1,500) 1.1 Two-component, thermally conductive,
EP-343 followed by dielectric epoxy coating
4 hr @ 135°C
CoolTherm Epoxy x x White 145,000 30 min 90 Shore D 17.7 (450) 0.6 One-component, thixotropic epoxy for
EP-6150 @ 121°C; or assembling electronic components and
10 min devices
@ 177°C
Thermoset Epoxy x Black 47,900 18-28 min 88-94 Shore D One-component, fast curing epoxy
EP-937 @ 120°C; or
6-12 min
@ 150°C

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 Components Can be used Dielectric Thermal
Thermally Viscosity, Mix Ratio by Cure
Chemistry with multiple UL Rating Appearance Hardness Strength, Conductivity, Description
Conductive 1K 2K cP @ 25°C Weight Schedule
hardeners kV/mm (V/mil) W/m·K
CoolTherm Epoxy x Black 35,000 60 min 88 Shore D One-component, fast curing epoxy
ES-21 @ 125°C containing a fluorescent dye for detection
under UV light
CoolTherm Epoxy x x x Black 6,800 100:7 12 hr @ 25°C; 85 Shore D 17.7 (450) 0.3 Filled, low viscosity, general purpose potting
EP-6008 BLK / 6010 or 2 hr @ 65°C and encapsulating epoxy
CoolTherm Epoxy x x UL 94 V-0 Black 2,600 10:1 2-4 hr @ 65°C 90 Shore D 19.7 (500) 0.7 Two-component epoxy
EP-6009
Circalok Epoxy x Gray 200,000 100:85 24 hr @ 25°C; 85 Shore D 15.7 (400) Two-component, room temperature curing
6021 or 2 hr @ 65°C epoxy with long working life, good peel
strength and adhesion to metals, plastics,
fiberglass and wood
Circalok Epoxy x Yellow 50,000 100:87 24 hr @ 25°C 67 Shore D 17.7 (450) Two-component, room temperature curing
6022 epoxy with good peel strength and adhesion
to metals, plastics, fiberglass and wood
CoolTherm Epoxy x x Blue 15,000 1:1 3-4 hr @ 100°C 90 Shore D 17.7 (450) 0.45 Filled, two-component epoxy for potting
EP-6028 / 6029 high voltage transformers, especially for
high temperature devices
Thermoset Epoxy x x Black 2,000 100:15 24 hr @ 25°C 88 Shore D 15 (380) Filled, thermal shock resistant epoxy for use
300 / 70 with various hardeners
LORD Epoxy x x Clear Amber 550 100:30 24 hr @ 25°C 82 Shore D Unfilled, moderate viscosity epoxy for use
600 / 70 with various hardeners
Thermoset Epoxy x Gray Thixotropic 1:1 24 hr @ 25°C; 82 Shore D Epoxy used in varying mix ratios to provide
DC-80 Paste 5 min @ 121°C optimum properties
Thermoset Epoxy x Black 12,000 1:1 2-3 hr @ 95°C 86 Shore D Two-component, heat curing epoxy with
DC-946 excellent thermal shock resistance
CoolTherm Epoxy x x Gray 50,000 100:1 16-24 hr @ 50- 95 Shore D 18.3 (464) 0.7 Ultra-high temperature resistant
EP-636 65°C followed encapsulating epoxy
by 2 hr each @
95°C, 150°C &
205°C
Thermoset Epoxy x x Black 550 100:30 24 hr @ 25°C 82 Shore D Black, unfilled, moderate viscosity epoxy for
EP-20 / 70 use with various hardeners
Thermoset Epoxy x x White 550 100:30 24 hr @ 25°C 82 Shore D Unfilled, moderate viscosity epoxy for use
ES-40 / 70 with various hardeners
Thermoset Epoxy x Black 1,200 1:1 3-4 hr @ 80°C 70 Shore OO 15.7 (400) Two-component epoxy for encapsulating
ES-100 intricate electronic components in
automotive, marine and heavy industrial
applications
Thermoset Epoxy x Tan 85,000 1:1 2.5 hr @ 85°C 90 Shore D >25 (>635) Two-component epoxy for high voltage,
ES-115 plus 1.5 hr automotive ignition coils
@ 125°C
Thermoset Epoxy x Black 6,000 100:29 2.5 hr @ 90°C >90 Shore D 30 (762) Two-component epoxy for high voltage,
ES-121 LV/ EP-809 followed by automotive ignition coils
2.5 hr @ 140°C
Thermoset Epoxy x Black 75,000 1:1 by Volume 2 hr @ 25°C 45 Shore A >15.7 (>400) Unfilled epoxy with good thermal shock
MP 110-10 plus 1 hr performance and excellent chemical
@ 80°C resistance
Thermoset Epoxy x Amber 50 100:14 24 hr @ 25°C 88 Shore D Room temperature hardener
Hardener No. 18 (with 600 Resin) (with 600 Resin) (with 600 Resin)
Thermoset Epoxy x Amber 5,000 1:1 24 hr @ 25°C 80 Shore D High surface gloss, fast setting, moisture
Hardener No. 25 (with 600 Resin) (with 600 Resin) (with 600 Resin) insensitive hardener
Thermoset Epoxy x Amber 40,000 1:1 24 hr @ 25°C; 84 Shore D Hardener that produces epoxies with
Hardener No. 37 (with 600 Resin) or 5 min (with 600 Resin) improved flexibility and impact strength
@ 93°C
(with 600 Resin)
Thermoset Epoxy x Tan 50 100:40 24 hr @ 25°C 85 Shore D High surface gloss, long working life,
Hardener No. 65 (with 600 Resin) (with 600 Resin) (with 600 Resin) moisture insensitive hardener

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 Components Can be used Dielectric Thermal
Thermally Viscosity, Mix Ratio by Cure
Chemistry with multiple UL Rating Appearance Hardness Strength, Conductivity, Description
Conductive 1K 2K cP @ 25°C Weight Schedule
hardeners kV/mm (V/mil) W/m·K
Thermoset Epoxy x Amber 12,000 100:50 24 hr @ 25°C 85 Shore D General purpose hardener well-suited for a
Hardener No. 66 (with 600 Resin) (with 600 Resin) (with 600 Resin) variety of applications
Thermoset Epoxy x Clear 30 100:24 2 hr @ 100°C 92 Shore D Long working life, heat curing hardener with
Hardener No. 67 (with 600 Resin) (with 600 Resin) (with 600 Resin) high Tg
Thermoset Epoxy x Tan 30 100:30 24 hr @ 25°C 82 Shore D High impact strength hardener
Hardener No. 70 (with 600 Resin) (with 600 Resin) (with 600 Resin)
Thermoset Epoxy x Light Amber 125 1:1 24 hr @ 25°C 60 Shore D Semi-rigid, low exotherm hardener
Hardener No. 71 (with 600 Resin) (with 600 Resin) (with 600 Resin)
Thermoset Epoxy x Black 7,000 1:1 24 hr @ 25°C 65 Shore D 14.6 (370) Filled, room temperature curing hardener
Hardener No. 72 (with 300 Resin) (with 300 Resin) (with 300 Resin) (with 300 Resin) with low exotherm and semi-rigid
encapsulation
LORD Adhesion x Clear, Straw Yellow 3.5 1-2 hr @ 25°C Moisture-cure primer for epoxy or
AP-134 Promoter polyurethane
- Epoxy or
Urethane
CoolTherm Urethane x x UL 94-HB Black 4,900 100:20 24 hr @ 25°C or 90 Shore A 0.4 Two-component, room temperature curing,
UR-288 6 hr @ 60°C flame retardant urethane potting compound
CoolTherm Urethane x x UL 94 V-0 Black 6,000 100:20 24 hr @ 25°C or 90 Shore A 15.0 (388) 0.7 Two-component, flame retardant, semi-
UR-388 6 hr @ 60°C flexible urethane for encapsulating and
casting applications
CoolTherm Urethane x x UL 94 V-0 Black 6,000 100:20 30 min @ 25°C 88 Shore A 15.0 (388) 0.7 Two-component, flame retardant, semi-
UR-388 FST flexible urethane for encapsulating and
casting applications
CoolTherm Urethane x x Black 14,000 100:23 24 hr @ 25°C; 45 Shore D 16 (406.4) 0.7 Two-component, flame retardant, semi-
UR-389 or 2 hr @ 70°C flexible urethane for encapsulating and
casting applications
Circalok Urethane x Amber or Black 900 22:10 30-45 min 80 Shore A 23.6 (600) General purpose, encapsulating urethane
6403 @ 25°C for applications requiring a fast cure,
mechanical shock resistant system
Thermoset Urethane x Black 1,500 100:9 24 hr @ 25°C; 25 Shore A 13.5 (344) Two-component, room temperature curing
UR-105 or 3 hr @ 75°C urethane encapsulating compound
Thermoset Urethane x Clear 1,500 100:55 24 hr @ 25°C; 50 Shore OO >11.8 (>300) Microelectronic grade, clear, low modulus
UR-312 2:1 by volume or 2 hr @ 85°C urethane encapsulating gel
Thermoset Urethane x Black 4,000 4:1 24 hr @ 25°C 60 Shore A 25.6 (650) Two-component, room temperature curing,
UR-325 urethane encapsulating compound

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Parker LORD
Engineered Materials Group
111 LORD Drive
Cary, NC 27511-7923
USA

phone +1 877 ASK LORD (275 5673)

www.lord.com

Values stated in this technical data sheet represent typical values as not all tests are run on each lot of material produced. For formalized product specifications for specific product end uses, contact the Customer Support Center.

Information provided herein is based upon tests believed to be reliable. In as much as Parker LORD has no control over the manner in which others may use this information, it does not guarantee the results to be obtained. In addition, Parker
LORD does not guarantee the performance of the product or the results obtained from the use of the product or this information where the product has been repackaged by any third party, including but not limited to any product end-user.
Nor does the company make any express or implied warranty of merchantability or fitness for a particular purpose concerning the effects or results of such use.

WARNING — USER RESPONSIBILITY. FAILURE OR IMPROPER SELECTION OR IMPROPER USE OF THE PRODUCTS DESCRIBED HEREIN OR RELATED ITEMS CAN CAUSE DEATH, PERSONAL INJURY AND PROPERTY DAMAGE.

This document and other information from Parker-Hannifin Corporation, its subsidiaries and authorized distributors provide product or system options for further investigation by users having technical expertise.

The user, through its own analysis and testing, is solely responsible for making the final selection of the system and components and assuring that all performance, endurance, maintenance, safety and warning requirements of the
application are met. The user must analyze all aspects of the application, follow applicable industry standards, and follow the information concerning the product in the current product catalog and in any other materials provided from Parker
or its subsidiaries or authorized distributors.

To the extent that Parker or its subsidiaries or authorized distributors provide component or system options based upon data or specifications provided by the user, the user is responsible for determining that such data and specifications
are suitable and sufficient for all applications and reasonably foreseeable uses of the components or systems.

©2022 Parker Hannifin Information and specifications subject to change without notice and without liability therefore. OD PC3002 02/22 Rev.11
Trademarks used herein are the property of their respective owners.