IPC-6012E

Qualification and
Performance Specification
for Rigid Printed Boards

Developed by the Rigid Printed Board Performance Specifications Task

Group (D-33a) of the Rigid Printed Board Committee (D-30) of IPC

Supersedes: Users of this publication are encouraged to participate in the

IPC-6012D - September 2015 development of future revisions.
IPC-6012C - April 2010
IPC-6012B with Contact:
Amendment 1 - July 2007
IPC-6012B - August 2004 IPC
IPC-6012A with
Amendment 1 - July 2000
IPC-6012A - October 1999
IPC-6012 - July 1996
IPC-RB-276 - March 1992
March 2020 IPC-6012E

Table of Contents
1 SCOPE ...................................................................... 1 3.2.8 Polymer Coating (Solder Mask) ...................... 13
1.1 Statement of Scope ............................................. 1 3.2.9 Fusing Fluids and Fluxes ................................. 13
1.2 Purpose ................................................................ 1 3.2.10 Marking Inks .................................................... 13
1.2.1 Supporting Documentation ................................. 1 3.2.11 Hole Fill Insulation Material ............................ 13
1.3 Performance Classification and Type ................. 1 3.2.12 Heatsink Planes, External ................................. 13
1.3.1 Classification ....................................................... 1 3.2.13 Via Protection ................................................... 14
1.3.2 Printed Board Type ............................................. 1 3.2.14 Embedded Passive Materials ............................ 14
1.3.3 Selection for Procurement .................................. 1 3.3 Visual Examination .......................................... 14
1.3.4 Material, Plating Process and Surface Finish .... 3 3.3.1 Edges ................................................................. 14
1.4 Terms and Definitions ........................................ 4 3.3.2 Laminate Imperfections .................................... 14
1.4.1 Back-Drilling ...................................................... 4 3.3.3 Plating and Coating Voids in the Hole ............ 15
1.4.2 Stub (Plated Hole) .............................................. 4 3.3.4 Lifted Lands ...................................................... 15
1.4.3 High Density Interconnects (HDI) ..................... 4 3.3.5 Marking ............................................................. 15
1.4.4 Microvia .............................................................. 5 3.3.6 Solderability ...................................................... 16
1.4.5 Design Data ........................................................ 5 3.3.7 Plating Adhesion ............................................... 16
1.5 Interpretation ....................................................... 5 3.3.8 Edge Printed Board Contact, Junction of
1.6 Presentation ......................................................... 5 Gold Plate to Solder Finish .............................. 16
1.7 Design Data Protection ...................................... 5 3.3.9 Back-Drilled Holes ........................................... 17
1.8 Revision Level Changes ..................................... 5 3.3.10 Workmanship .................................................... 17
3.4 Printed Board Dimensional Requirements ...... 17
2 APPLICABLE DOCUMENTS .................................... 6
3.4.1 Hole Size, Hole Pattern Accuracy and
2.1 IPC ...................................................................... 6 Pattern Feature Accuracy ................................. 17
2.2 Joint Industry Standards ..................................... 8 3.4.2 Annular Ring and Breakout (External) ............ 17
2.3 Federal ................................................................ 8 3.4.3 Bow and Twist .................................................. 19
2.4 Other Publications .............................................. 8 3.5 Conductor Definition ........................................ 19
2.4.1 American Society for Testing and Materials ..... 8 3.5.1 Conductor Width and Thickness ...................... 20
2.4.2 Underwriters Lab ................................................ 8 3.5.2 Conductor Spacing ........................................... 20
2.4.3 National Electrical Manufacturers 3.5.3 Conductor Imperfections .................................. 20
Association .......................................................... 8
3.5.4 Conductive Surfaces ......................................... 20
2.4.4 American Society for Quality ............................ 8
3.6 Structural Integrity ............................................ 22
2.4.5 AMS .................................................................... 8
3.6.1 Thermal Stress Testing ..................................... 23
2.4.6 American Society of Mechanical Engineers ..... 8
3.6.2 Requirements for Microsectioned
3 REQUIREMENTS ...................................................... 9 Coupons or Printed Boards .............................. 24
3.1 General ................................................................ 9 3.7 Solder Mask Requirements .............................. 39
3.2 Materials ............................................................. 9 3.7.1 Solder Mask Coverage ..................................... 39
3.2.1 Laminates and Bonding Material ....................... 9 3.7.2 Solder Mask Cure and Adhesion ..................... 39
3.2.2 External Bonding Materials ............................... 9 3.7.3 Solder Mask Thickness .................................... 40
3.2.3 Other Dielectric Materials .................................. 9 3.8 Electrical Requirements .................................... 40
3.2.4 Metal Foils .......................................................... 9 3.8.1 Dielectric Withstanding Voltage ....................... 40
3.2.5 Metal Planes/Cores ............................................. 9 3.8.2 Electrical Continuity and Isolation
3.2.6 Base Metallic Plating Depositions and Resistance ......................................................... 40
Conductive Coatings .......................................... 9 3.8.3 Circuit/Plated Hole Shorts to Metal
3.2.7 Surface Finish Depositions and Coatings – Substrate ............................................................ 40
Metallic and Non-Metallic ............................... 10 3.8.4 Moisture and Insulation Resistance (MIR) ...... 40

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IPC-6012E March 2020

3.9 Cleanliness ........................................................ 41 Figures

3.9.1 Cleanliness Prior to Solder Mask Figure 1-1 Example of a Back-Drilled Hole
Application ........................................................ 41 (Not To Scale) ................................................... 4
3.9.2 Cleanliness After Solder Mask, Solder, or Figure 1-2 Example of a Shallow Back-Drill ...................... 4
Alternative Surface Coating Application ......... 41 Figure 1-3 Microvia Definition ............................................ 5
3.9.3 Cleanliness of Inner Layers After Oxide Figure 3-1 Annular Ring Measurement (External) ........... 19
Treatment Prior to Lamination ......................... 41 Figure 3-2 Breakout of 90° and 180° ............................... 19
3.10 Special Requirements ....................................... 41 Figure 3-3 External Conductor Width Reduction ............. 19
3.10.1 Outgassing ........................................................ 41 Figure 3-4 Example of Intermediate Target Land in a
Microvia .......................................................... 19
3.10.2 Fungus Resistance ............................................ 41
Figure 3-5 Rectangular Surface Mount Lands ................. 20
3.10.3 Vibration ........................................................... 41 Figure 3-6 Round Surface Mount Lands ......................... 21
3.10.4 Mechanical Shock ............................................ 41 Figure 3-7 Printed Board Edge Connector Lands ........... 21
3.10.5 Impedance Testing ............................................ 41 Figure 3-8 Plated Hole Microsection (Grinding/
3.10.6 Coefficient of Thermal Expansion (CTE) ........ 42 Polishing) Tolerance ....................................... 23
Figure 3-9 An Example of Plating to Target Land
3.10.7 Thermal Shock .................................................. 42 Separation ...................................................... 23
3.10.8 Surface Insulation Resistance Figure 3-10 Copper Crack Definition ................................. 26
(As Received) ................................................... 42
Figure 3-11 Separations at External Foil ........................... 26
3.10.9 Metal Core (Horizontal Microsection) ............ 42 Figure 3-12 Plating Folds/Inclusions – Minimum
3.10.10 Rework Simulation ........................................... 42 Measurement Points ....................................... 26
3.10.11 Bond Strength, Unsupported Component Figure 3-13 Microsection Evaluation Laminate
Hole Land ......................................................... 42 Attributes ......................................................... 27
Figure 3-14 Measurement for Etchback ............................ 27
3.10.12 Destructive Physical Analysis .......................... 42
Figure 3-15 Measurement for Dielectric Removal ............. 28
3.10.13 Peel Strength Requirements (For Foil
Laminated Construction Only) ......................... 42 Figure 3-16 Measurement for Negative Etchback ............. 28
Figure 3-17 Annular Ring Measurement (Internal) ............ 29
3.10.14 Design Data Protection .................................... 42
Figure 3-18 Microsection Rotations for Breakout
3.10.15 Performance Based Testing for Microvia Detection ......................................................... 29
Structures – Structural Integrity During
Thermal Stress .................................................. 43 Figure 3-19 Comparison of Microsection Rotations .......... 29
Figure 3-20 Example of Non-Conforming Dielectric
3.11 Repair ................................................................ 43 Spacing Reduction Due to Breakout at
3.11.1 Circuit Repairs .................................................. 43 Microvia Target Land ...................................... 30
3.12 Rework .............................................................. 43 Figure 3-21 Surface Copper Wrap Measurement for
Filled Holes (Over Foil) .................................. 30
4 QUALITY ASSURANCE PROVISIONS .................. 43 Figure 3-22 Surface Copper Wrap Measurement for
Filled Holes (Over Laminate) ......................... 31
4.1 General .............................................................. 43
Figure 3-23 Surface Copper Wrap Measurement for
4.1.1 Qualification ...................................................... 43 Non-Filled Holes ............................................. 31
4.1.2 Sample Test Coupons ....................................... 43 Figure 3-24 Wrap Copper (Acceptable) ............................. 31
4.2 Acceptance Tests .............................................. 44 Figure 3-25 Wrap Copper Removed by Excessive
Processing, e.g., Sanding/Planarization/
4.2.1 C=0 Zero Acceptance Number Sampling Etching (Not Acceptable) ................................ 32
Plan ................................................................... 44
Figure 3-26 Copper Cap Thickness ................................... 33
4.2.2 Referee Tests ..................................................... 44
Figure 3-27 Copper Cap Filled Via Height (Bump) ............ 33
4.3 Quality Conformance Testing .......................... 44 Figure 3-28 Copper Cap Depression (Dimple) .................. 33
4.3.1 Coupon Selection .............................................. 45 Figure 3-29 Copper Cap Plating Voids .............................. 33
Figure 3-30 Nonconforming Via Fill Between Copper
5 NOTES ..................................................................... 50
Cap Plating Layers ......................................... 33
5.1 Ordering Data ................................................... 50 Figure 3-31 Acceptable Via Fill Between Copper Cap
5.2 Superseded Specifications ................................ 50 Plating Layers ................................................. 33
Figure 3-32 Example of Acceptable Voiding in a Cap
APPENDIX A .............................................................. 51 Plated, Copper Filled Via ................................ 34

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Figure 3-33 Example of Acceptable Voiding in a Copper Table 3-4 Surface and Hole Copper Plating Minimum
Filled Microvia without Cap Plating ................ 34 Requirements for Buried Vias > 2 Layers,
Figure 3-34 Example of Nonconforming Void in a Cap Through-Holes, and Blind Vias ......................... 13
Plated, Copper Filled Microvia ....................... 34 Table 3-5 Surface and Hole Copper Plating
Figure 3-35 Example of Nonconforming Void in a Minimum Requirements for Microvias
Copper Filled Microvia .................................... 34 (Blind and Buried) ............................................. 13

Figure 3-36 Microvia Contact Dimension ........................... 35 Table 3-6 Surface and Hole Copper Plating Minimum
Requirements for Buried Cores (2 layers) ........ 13
Figure 3-37 Exclusion of Separations in Microvia
Target Land Contact Dimension ..................... 35 Table 3-7 Plating and Coating Voids in the Hole .............. 15

Figure 3-38 Unintended Piercing of Microvia Target Table 3-8 Edge Printed Board Contact Gap ..................... 17
Land (Laser Drilled) ........................................ 35 Table 3-9 Minimum Annular Ring ...................................... 18
Figure 3-39 Intentional Piercing of Microvia Target Table 3-10 Plated Hole Integrity After Stress ...................... 25
Land (Mechanically Drilled2) ........................... 35
Table 3-11 Cap Plating Requirements for Filled Holes ...... 32
Figure 3-40 Overhang ........................................................ 37
Figure 3-41 Metal Core to PTH Spacing ........................... 37 Table 3-12 Microvia Contact Dimension (Laser Drilled) ..... 35

Figure 3-42 Measurement of Minimum Dielectric Table 3-13 Microvia Contact Dimension
Spacing ........................................................... 38 (Mechanically Drilled) ........................................ 35
Figure 3-43 Fill Material in Blind/Through Vias Table 3-14 Internal Layer Foil Thickness after
When Cap Plating Not Specified .................... 38 Processing ......................................................... 36
Figure 3-44 Void in Fill Material at Hole Wall Interface ..... 38 Table 3-15 External Conductor Thickness after
Plating ............................................................... 37
Tables Table 3-16 Solder Mask Adhesion ...................................... 40

Table 1-1 Technology Adders .............................................. 2 Table 3-17 Dielectric Withstanding Voltages ....................... 40
Table 1-2 Default Requirements ......................................... 3 Table 3-18 Insulation Resistance ........................................ 40
Table 3-1 Metal Planes/Cores ............................................. 9 Table 4-1 Qualification Test Coupons ............................... 44
Table 3-2 Maximum Limits of SnPb Solder Bath Table 4-2 C=0 Sampling Plan per Lot Size ...................... 45
Contaminant ...................................................... 10 Table 4-3 Acceptance Testing and Frequency .................. 46
Table 3-3 Surface Finish and Coating Requirements ....... 12 Table 4-4 Quality Conformance Testing ............................ 50

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Qualification and Performance

Specification for Rigid Printed Boards

1 SCOPE

1.1 Statement of Scope This specification establishes and defines the qualification and performance requirements for the
fabrication of rigid printed boards.

1.2 Purpose The purpose of this specification is to provide requirements for qualification and performance of rigid printed
boards based on the following constructions and/or technologies. These requirements apply to the finished product unless
otherwise specified:
• Single-sided, double-sided printed boards with or without plated-through holes (PTHs).
• Multilayer printed boards with PTHs with or without buried/blind vias/microvias.
• Active/passive embedded circuitry printed boards with distributive capacitive planes and/or capacitive or resistive
components.
• Metal core printed boards with or without an external metal heat frame, which may be active or non-active.

1.2.1 Supporting Documentation IPC-A-600, which contains figures, illustrations and photographs that can aid in the
visualization of externally and internally observable acceptable/nonconforming conditions, may be used in conjunction with
this specification for a more complete understanding of the recommendations and requirements.

1.3 Performance Classification and Type

1.3.1 Classification This specification establishes acceptance criteria for the performance classification of rigid printed
boards based on customer and/or end-use requirements. Printed boards are classified by one of three general Performance
Classes as defined in IPC-6011.

1.3.1.1 Requirement Deviations Requirements deviating from these heritage classifications shall be as agreed between
user and supplier (AABUS).

1.3.1.2 Space Requirement Deviations Space performance classification deviations are provided in the IPC-6012ES
Addendum and are applicable when the addendum is specified within the procurement documentation.

1.3.2 Printed Board Type Printed boards without PTHs (Type 1) and with PTHs (Types 2-6) are classified as follows and
may include technology adders as described in Table 1-1:
Type 1 — Single-Sided Printed Board
Type 2 — Double-Sided Printed Board
Type 3 — Multilayer Printed Board without blind or buried vias
Type 4 — Multilayer Printed Board with blind and/or buried vias (may include microvias)
Type 5 — Multilayer metal core Printed Board without blind or buried vias
Type 6 — Multilayer metal core Printed Board with blind and/or buried vias (may include microvias)

1.3.3 Selection for Procurement Performance Class shall be specified in the procurement documentation.
The procurement documentation shall provide sufficient information to fabricate the printed board and ensure that the user
receives the desired product. Information that should be included in the procurement documentation is to be in accordance
with IPC-2611 and IPC-2614.
The procurement documentation shall specify the thermal stress test method to be used to meet the requirement of 3.6.1.
Selection shall be from those depicted in 3.6.1.1, 3.6.1.2 and 3.6.1.3. If not specified (see 5.1), the default shall be per Table
1-2.