Module 1 CHDX04
Module 1 CHDX04
SDG: 11, 12 2 0 0 2
The Group IV elements can also be doped with Group III elements of
the periodic table like Boron (B), Aluminium (Al), Nitrogen (N), Gallium
(Ga) or Indium (In). In this case, the resultant material will have three
covalent bonds formed by the pairing-up of three electrons from each
atom. However, due to the trivalent (three valence electrons) nature of
Group III elements, there will be one insufficient electron to form the
fourth covalent bond. This deficiency in electron signifies nothing but
the hole.
The number of holes so formed is equal to the number of trivalent
impurity atoms added into the semiconductor. Each of these holes
signifies a vacant space which can readily accept an electron into it and is
present at the energy level EA. Further due to the nature of ‘acceptance’
exhibited by the holes induced due to the doping of Group III elements,
such elements are referred to as acceptors.
Moreover, it is to be noted that, as an electron moves into the hole to
recombine, it leaves a new hole in its previous place which in turn will be
filled by some other electron. This indicates that the movement of
electrons in one direction can be viewed as the movement of holes in
the opposite direction. Thus, such a semiconductor material becomes
conductive in nature. However, it is to be noted that, for this case, the
total number of holes will be equal to the sum of the holes induced due
to doping and the holes generated due to the thermal excitation
process, unlike the electrons which are produced only due to the
process of thermal excitation. This means that here the number of
holes exceeds the number of electrons for which the holes will be the
majority charge carriers while the electrons will be the minority charge
carriers. Due to these kinds of extrinsic semiconductor materials are
aptly called P type semiconductors.
Semiconductor materials play a crucial role in the construction of
various electrical and electronic gadgets, including computers and
instruments. Some of the commonly used semiconductor materials in
these devices include:
Silicon (Si): Silicon is the most widely used semiconductor material in
the electronics industry due to its abundance, stability, and well-
understood properties. It is used in the fabrication of transistors,
diodes, integrated circuits (ICs), and other electronic components.
Gallium Arsenide (GaAs): Gallium arsenide is another important
semiconductor material, particularly in high-frequency and high-speed
applications. It has superior electron mobility compared to silicon,
making it suitable for radio frequency (RF) devices, microwave
integrated circuits, and optoelectronic components like LEDs and laser
diodes.
Gallium Nitride (GaN): Gallium nitride is valued for its wide bandgap
and high electron mobility, making it suitable for power electronics,
high-frequency devices, LEDs, and even in some cases for radio
frequency (RF) applications.
Indium Phosphide (InP): Indium phosphide is used in optoelectronic and
photonic devices, including high-speed communication systems, optical
modulators, and photovoltaic cells.
Silicon Carbide (SiC): Silicon carbide is known for its high thermal
conductivity, high breakdown voltage, and ability to operate at high
temperatures. It is used in power electronics, particularly in
applications requiring high efficiency and high power density, such as
electric vehicles, renewable energy systems, and industrial motor
drives.
Silicon Germanium (SiGe): Silicon germanium alloys combine the properties of
both silicon and germanium. They are used in high-frequency integrated circuits,
particularly in wireless communication systems like cellular phones and radar
systems.
Quantum Confinement Effect
1. Kevlar
2. Biodegradable smart materials
3. Metal alloys
KEVLAR
Low-carbon steel
Low-carbon steel is the most widely used form of carbon steel.
These steels usually have a carbon content of less than 0.25 wt.%.
They cannot be hardened by heat treatment (to form martensite)
so this is usually achieved by cold work.
Carbon steels are usually relatively soft and have low strength,
however, have high ductility, making them excellent for machining
and welding.
High-strength, low-alloy steels (HSLA) are also often classified as
low-carbon steels, however, also contain other elements such as
copper, nickel, vanadium and molybdenum.
Applications
Low-carbon steel
Low carbon steels are often used in automobile body components,
structural shapes (I-beams, channel and angle iron), pipes, construction
and bridge components, and food cans.
Medium-carbon steel
Medium-carbon steel has a carbon content of 0.25 – 0.60 wt.% and a
manganese content of 0.60 – 1.65 wt.%. The mechanical properties of
this steel are improved via heat treatment involving autenitising followed
by quenching and tempering, giving them a martensitic microstructure.
Heat treatment can only be performed on very thin sections, however,
additional alloying elements, such as chromium, molybdenum and nickel,
can be added to improve the steels ability to be heat treated and, thus,
hardened.
Hardened medium-carbon steels have greater strength than low-carbon
steels, however, this comes at the expense of ductility and toughness.
Applications
Medium-carbon steel
As a result of their high strength, resistance to wear and toughness,
medium-carbon steels are often used for railway tracks, train wheels,
crankshafts, and gears and machinery parts requiring this combination
of properties.
High-carbon steel
High-carbon steel has a carbon content of 0.60– 1.25 wt.% and a
manganese content of 0.30 – 0.90 wt.%. It has the highest hardness and
toughness of the carbon steels and the lowest ductility. High-carbon
steels are very wear-resistant as a result of the fact that they are
almost always hardened and tempered.
Tool steels and die steels are types of high-carbon steels, which contain
additional alloying elements including chromium, vanadium, molybdenum
and tungsten. The addition of these elements results in the very hard
wear-resistant steel, which is a result of the formation of carbide
compounds such as tungsten carbide (WC).
Applications
It is used for making wire, bar, and rods for screw machine
products. It is used in places where good strength and good
machinability are required.
It is used in heavy-duty forgings, wheels, plates, extrusions,
aircraft fittings, space booster tankage and truck frame, and other
suspension components. It finds applications in places where high
strength is required, and services at elevated temperatures.
It is used for making Aircraft structures, truck wheels, screw
machine products, rivets, and other structural application products.
It is used as a sheet for the auto body panels.
It is also used in forgings, in aircraft engine pistons, impellers of the
jet engines, and compressor rings.
It is also used for making die and hand forgings.
Application in Robotic
Aluminum has a higher price point than steel, it’s easier to shape and
is lighter.
Aluminum is also a good material if you’re worried about a robot’s
exterior becoming rusty over time because aluminum does not rust.
However, because it can corrode in some wet environments, you
might consider treating the surface to give it more protection
against possible corrosion.
Another thing that makes aluminum a popular option for robot
exteriors is that it can be polished to a high shine. So, if you’re
building a commercial robot that your client will eventually want to
show off, aluminum makes the body look nice while offering ample
durability.
Data storage - magnetic hard disk drives
Data storage using magnetic hard disk drives (HDDs) relies on the
principles of ferromagnetism.
Composition:
Polycarbonate: Traditional polycarbonate used in CDs and DVDs is a
thermoplastic polymer composed of repeating carbonate groups in its
molecular structure. It's transparent, lightweight, and possesses
excellent optical properties.
Nanopolycarbonate: Nanopolycarbonate refers to polycarbonate that
has been modified or enhanced with nanoparticles at the nanoscale.
These nanoparticles can include materials like silica, titanium dioxide,
carbon nanotubes, or other nanomaterials.
Properties:
Polycarbonate: Traditional polycarbonate offers good optical clarity,
durability, and impact resistance, making it suitable for optical storage
media like CDs and DVDs.
Nanopolycarbonate: By incorporating nanoparticles into polycarbonate,
nanopolycarbonate can exhibit additional properties such as enhanced
scratch resistance, improved data storage capacity, faster read/write
speeds, and improved optical properties. Nanopolycarbonate may also
offer better resistance to environmental factors such as UV radiation.
Performance:
Polycarbonate: CDs and DVDs made from traditional polycarbonate have
been widely used for optical storage due to their reliability and cost-
effectiveness.
Nanopolycarbonate: Nanopolycarbonate can potentially enhance the
performance of CDs and DVDs by increasing data storage capacity,
improving durability, and providing other benefits related to
nanotechnology enhancements.
Applications:
Polycarbonate: Traditional polycarbonate discs are commonly used for
storing digital data, including music, videos, software, and other
multimedia content.
Nanopolycarbonate: Nanopolycarbonate may find applications in high-
performance optical storage media where superior durability, higher
data storage capacity, and other enhanced properties are desired.
These discs may be used in specialized applications where standard
polycarbonate discs may not meet the required performance criteria.
Lacquer