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Produktdatenblatt | Version 1.1
BP 104 S
 

BP 104 S
DIL SMT
Silicon PIN Photodiode

Applications
—LIDAR, Pre-Crash, ACC —Rain Sensors

Features:
—Package: Epoxy, diffuse
—Corrosion Robustness Class: 3B
—Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C,
Stress Test Qualification for Automotive Grade Discrete Semiconductors.
—ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
—Suitable for reflow soldering
—Especially suitable for applications from 400 nm to 1100 nm
—Short switching time (typ. 20 ns)
—Suitable for SMT

Ordering Information
Type

Photocurrent 1) Photocurrent
typ.
Ordering Code

Ev = 1000 lx; Std. Light A; VR = 5 V Ev = 1000 lx; Std. Light A; VR = 5 V

IP IP

BP 104 S-Z ≥ 44 µA 55 µA Q65110A2626



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Maximum Ratings
TA = 25 °C
Parameter Symbol Values

Operating Temperature Top min. -40 °C

max. 100 °C
Storage temperature Tstg min. -40 °C
max. 100 °C
Reverse voltage VR max. 20 V
Total power dissipation Ptot max. 150 mW
ESD withstand voltage VESD max. 2 kV
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)




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Characteristics
TA = 25 °C
Parameter Symbol Values

Wavelength of max sensitivity λS max typ. 850 nm

Spectral range of sensitivity λ10% typ. 400 ... 1100
nm
Radiant sensitive area A typ. 4.84 mm²
Dimensions of active chip area LxW typ. 2.2 x 2.2
mm x mm
Half angle φ typ. 60 °
Dark current IR typ. 2 nA
VR = 10 V max. 30 nA
Spectral sensitivity of the chip Sλ typ. 0.62 A / W
λ = 850 nm
Quantum yield of the chip η typ. 0.90 Electrons
λ = 850 nm / Photon
Open-circuit voltage VO min. 280 mV
Ev = 1000 lx; Std. Light A; VR = 0 V typ. 360 mV
Short-circuit current ISC typ. 50 µA
Ev = 1000 lx; Std. Light A; VR = 0 V
Rise time tr typ. 0.02 µs
VR = 5 V; RL = 50 Ω; λ = 850 nm
Fall time tf typ. 0.02 µs
VR = 5 V; RL = 50 Ω; λ = 850 nm


Forward voltage VF typ. 1.3 V
IF = 100 mA; E = 0
Capacitance C0 typ. 48 pF
VR = 0 V; f = 1 MHz; E = 0
Temperature coefficient of voltage TCV typ. -2.6 mV / K
Temperature coefficient of short-circuit current TCI typ. 0.18 % / K
Std. Light A
Noise equivalent power NEP typ. 0.041 pW /
VR = 10 V; λ = 850 nm Hz1/2
Detection limit D* typ. 5.4e12 cm x
VR = 5 V; λ = 850 nm Hz1/2 / W


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Relative Spectral Sensitivity 2), 3)

Srel = f (λ)
OHF00078
100
S rel %

80

60

40

20

0
400 500 600 700 800 900 nm 1100
λ

Directional Characteristics 2), 3)

Srel = f (φ)

40 30 20 10 0 OHF01402
ϕ
1.0


50
0.8

60
0.6

70 0.4

80 0.2

0
90

100
1.0 0.8 0.6 0.4 0 20 40 60 80 100 120


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Photocurrent/Open-Circuit Voltage 2), 3) Dark Current 2), 3)

IP (VR = 5 V) / VO = f (Ev) IR = f (VR); E = 0

OHF02283
10 3 10 4 4000
OHF00080

µA mV
ΙP VO ΙR
pA

10 2 10 3 3000
VO

ΙP
10 1 10 2 2000

10 0 10 1 1000

10 -1 10 0 0
10 0 10 1
10 2
10 3
lx 10 4 0 5 10 15 V 20
EV VR

Dark Current 2), 3)

IR = f (VR); E = 0
OHF02284
10 2

nA


ΙR

10 1

10 0

10 -1
0 2 4 6 8 10 12 14 16 V 20
VR


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Capacitance 2), 3)

C = f (VR); f = 1MHz; E = 0; TA = 25°C

OHF01778
60

C pF
50

40

30

20

10

0 -2
10 10 -1 10 0 10 1 V 10 2
VR

Dark Current 2)

IR = f (TA); E = 0; VR = 10 V
OHF05717
104
nA
IR


103

102

101

100

10-1
0 20 40 60 80 ˚C 100
TA


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Power Consumption
Ptot = f (TA)
OHF00394
160
mW
Ptot
140

120

100

80

60

40

20

0
0 20 40 60 80 ˚C 100
TA




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Dimensional Drawing 4)

Chip position

0.3 (0.012)
1.2 (0.047)
1.1 (0.043)
1.1 (0.043)

(0...0.004)
0.9 (0.035)

0...0.1

0.2 (0.008)
0.1 (0.004)
˚
0...5
6.7 (0.264)
6.2 (0.244)
4.5 (0.177)
4.3 (0.169) 1.6 (0.063) ±0.2 (0.008)

4.0 (0.157)
3.7 (0.146)
1.7 (0.067)
1.5 (0.059)
0.9 (0.035)
0.7 (0.028)

Photosensitive area Cathode lead

2.20 (0.087) x 2.20 (0.087)
GEOY6861

Further Information:
Approximate Weight: 44.0 mg

Package marking: Cathode

Corrosion test: Class: 3B

Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC
60068-2-43)




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Recommended Solder Pad 4)




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Reflow Soldering Profile

Product complies to MSL Level 4 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T 250
240 ˚C Tp 245 ˚C
217 ˚C tP
200
tL

150
tS

100

50
25 ˚C
0
0 50 100 150 200 250 s 300
t

Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit

Minimum Recommendation Maximum
Ramp-up rate to preheat*) 2 3 K/s
25 °C to 150 °C
Time tS tS 60 100 120 s
TSmin to TSmax
Ramp-up rate to peak*) 2 3 K/s


TSmax to TP
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 260 °C
Time within 5 °C of the specified peak tP 10 20 30 s
temperature TP - 5 K
Ramp-down rate* 3 6 K/s
TP to 100 °C
Time 480 s
25 °C to TP

All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range


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Taping 4)




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Tape and Reel 5)

Reel Dimensions
A W Nmin W1 W2 max Pieces per PU

180 mm 12 + 0.3 / - 0.1 mm 60 mm 12.4 + 2 mm 18.4 mm 1500




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Barcode-Product-Label (BPL)

Dry Packing Process and Materials 4)

Moisture-sensitive label or print

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Humidity indicator
Barcode label
Do not eat.
Avoid metal contact.
Discard if circles overrun.
bag opening.
Please check the HIC immidiately after

check dot WET

Comparator

bake units
examine units, if necessary 15%
If wet,

bake units
examine units, if necessary 10%
If wet,

change desiccant
parts still adequately dry. 5%
If wet,

MIL-I-8835
Humidity Indicator

Desiccant
AM
OSR

OHA00539
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.


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Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this
data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding effect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver.
Metal filled materials can be affected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
For further application related information please visit www.osram-os.com/appnotes




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Disclaimer
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version on the OSRAM OS website.

Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of
transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we
shall have to invoice you for any costs incurred.

Product and functional safety devices/applications or medical devices/applications

OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
OSRAM OS products are not qualified at module and system level for such application.

In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-
nate the customer-specific request between OSRAM OS and buyer and/or customer.




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Glossary
1)
Photocurrent: The photocurrent values are measured (by irradiating the devices with a homogenous
light source and applying a voltage to the device) with a tolerance of ±11 %.
2)
Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reflect statistical figures.
These do not necessarily correspond to the actual parameters of each single product, which could dif-
fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
3)
Testing temperature: TA = 25°C (unless otherwise specified)
4)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.
5)
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.




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Revision History
Version Date Change

1.7 2021-05-25 Schematic Transportation Box

Dimensions of Transportation Box




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Published by OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.


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