Swra 462
Swra 462
Swra 462
1 Introduction
Power management and extended battery life are primary focus areas for embedded low-power Wi-Fi
devices such as the SimpleLink Wi-Fi Internet-on-a-chip solution. Handling power regimes effectively is
fundamental for any battery-operated device. This problem is especially challenging for standards-based
wireless devices that need to comply with certain requirements for Transmit power, Beacon interval, and
data rates, as is the case with embedded Wi-Fi devices. This application note covers CC3100/CC3200
Wi-Fi Internet-on-a-chip Networking sub-system power management (PM) capabilities, describes the
basics of system behavior, and provides the basic toolbox for developers to design an optimal system.
The CC3100 contains the Networking sub-system only and is driven by an external MCU host. The
CC3200 contains the same Networking sub-system along with an internal MCU application processor.
This document describes the Wi-Fi sub-system power management aspects, making it applicable for both
devices.
1.1 Terminology
This document refers to several power related measurement units:
• Current [ampere] – Refers to average current at 3.3 V, unless otherwise specified.
• Charge [coulomb] – [1C = 1 ampere × 1 second], refers to 3.3 V unless otherwise specified. Charge is
used when discussing finite processes (such as connection). Battery capacity is referred as mA × hour.
• Energy [joule] – [1 joule = 1 coulomb × 1 volt]
CC3200
Networking Subsystem - CC3100
NWP WiFi
SF
HOST
HOST IF Processor MAC PHY RADIO
MCU
peripherals
• Active – Device is fully active, voltage levels are at their operational value, and all clocks are ticking.
At least one block (NWP / Wi-Fi) is running. This mode may represent a wide variety of intermediate
power states which are of transient nature and not explicitly controlled by the system.
• Sleep mode – The MCU clocks are gated off in sleep mode and the entire state is retained. Device
mode is active. The MCU application exercises this mode using CM4 instructions, such as WFI or
WFE.
• Active mode – MCU is running and the device mode is active.
The following table describes the device power mode according to the MCU power mode and the
networking sub-system power mode.
The following diagram presents the possible transitions between states, and the trigger for the transition.
7 Power Policies
From the host application perspective, there are only two modes of operation explicitly selected by the
host: NWP disabled (OFF) or NWP enabled (ON). Selection between Active or LPDS states is managed
internally by the NWP, using power management algorithms.
The networking sub-system is equipped with a policy management entity which allows a developer (host
application programmer) to guide the behavior of the power management algorithm through pre-defined
power policies. The sl_PolicySet API configures the device power management policy. The available
policies are:
• Normal (Default) – Best tradeoff between traffic delivery time and power performance. When
connected to an AP, the Wi-Fi module wakes up for every beacon reception. Wi-Fi and NWP modules
enter their low power mode after considering current activities and predict future activities.
• Low power – The NWP power management algorithm is more opportunistic, exploiting opportunities to
lower the power mode. Tradeoff tends toward power conservation performance (for example, tag
application). The networking sub-system enters LPDS immediately once the activity is over, without
predicting future activities. Almost every communication between the host and NWP takes the
overhead of waking up the subsystem, without any time in idle mode predicting future events. Low
Power policy is suitable primarily for unconnected applications (such as applications that use
transceiver mode, and not connecting to AP). When used in a connected scenario, behavior and
service is not guaranteed.
• Long Sleep Interval (LSI) – When an 802.11 station is connected to the access point, it must receive
the beacons transmitted by the AP. APs generally transmit a beacon every 102.4 ms. 802.11
standards define the DTIM (Delivery Traffic Indication Map) as a specific beacon that contains
information regarding incoming packets for the STA. The AP may choose its DTIM interval (such as 1-
every beacon, 2-every other beacon, and so forth). This special low-power policy instructs the
networking sub-system to skip beacons and DTIM packets, and comes with a desired max sleep time
parameter. The parameter reflects the desired sleep interval between two consecutive wakeups for
beacon reception. The Wi-Fi module computes the desired time and wakes up to the next DTIM that
does not exceed the specified time (see Table 3 for examples). The maximum-allowed desired max
sleep time parameter is 2 seconds. It is strongly recommended to set the LSI parameter below 1
second to ensure reliable service while current consumption is lowered significantly. Note that this
policy only works in client mode and external connection (internet connection via gateway). It
automatically terminates mDNS and internal HTTP server running on the device. TCP/UDP servers
initiated by the user application lead to unpredictable system behavior and performance.
Idle connected current consumption is specified in the Idle Connection Current section.
• Always On – Both Wi-Fi and NWP modules remain active and do enter their low power modes. WiFi
does not enter 802.11 power save mode.
The current numbers indicate that system peak current is dictated by calibration. Calibration may happen
occasionally (only during NWP initialization, and in case the temperature significantly changed, or 24
hours elapsed from the last calibration). Calibration adds around 200 ms to initialization. For a system that
enables the NWP once a minute, for example, the current consumption due to calibration occuring once a
day is negligible.
Comparing the CC3200 current consumption in different modes produces these conclusions:
• When the MCU is active and the networking sub-system is in sleep mode (or idle connected), the MCU
consumes ~15 mA. This reflects the consumption by the MCU while the device would otherwise have
been in LPDS mode.
• When the MCU is sleep and the networking sub-system is in LPDS mode (or idle connected), the MCU
consumes ~12 mA. This reflects the consumption by the MCU while the device would otherwise have
been in LPDS mode.
• When the MCU is active and the networking sub-system is in active mode (TX or RX), the MCU adds 6
mA. This reflects the consumption by the MCU while the device would have been in active mode due
to the networking sub-system activity.
• When the MCU is in sleep and the networking sub-system is in active mode (TX or RX), the MCU adds
3 mA. This reflects the consumption by the MCU while the device would have been in active mode due
to the networking sub-system activity.
Notes:
• While working with DHCP, an additional 20 to 35 uA is consumed by the NWP.
• Serial flash current in standby mode is not included.
• 2 sec is the maximum allowed LSI.
• Tested in a clean environment
• Tested with Cisco 1250
• Measured at 3.3 V VBAT
• Measurements are based on an R1 SP1 device.
Referring to the default TBTT (102.4 ms), the CC3100 average current during idle connected period is
0.69 mA. This performance is a result of over of ten years of Wi-Fi experience. Note that this parameter
may vary between different access points. Some access points and networks send many broadcast
packets that force the networking sub-system to stay active longer. Some access points do not send their
beacons with exact timing, missing beacons and other phenomena. Networking sub-system algorithms try
to overcome many of the above phenomena, but the average current consumption may still vary.
Notes:
• A PC server was used for the measurement.
• Zero roundtrip delay time assumed. Larger roundtrip delay time increases the connection time
significantly. However, the charge per connection may remain closer to the specified result here since
most of the time increase is spent in power save mode.
• Measurements are taken on a R1 SP1 device.
Note:
• 1460B packet length
• Excellent link quality assumed
• Cisco 1250 AP
• Clean environment
The trend is expected to continue down to an average current of 1 mA and below. The usable capacity for
an average current below 1 mA reaches 2200 mAh for this specific battery.
Lithium batteries have better internal resistance (analysis based on the Energizer L91) and their voltage
and service hours curve is more flat. This gives an advantage to lithium batteries, as almost the entire
capacity can be used. With the analyzed battery, more than 3000 mAh can be used.
In this test case, the application enables the CC3100 device, the device automatically re-connects to the
AP, the application opens and binds a socket, initiates traffic and disables the device. While the CC3100
device is enabled, it manages its power state according to a defined policy. For example, it may be in
LPDS state while waiting for a server response, or if the host delays between commands.
The total energy spent and system life span are given by:
E = £5n=1 En (1)
T = V × B/E × C × 1/400 (2)
Where:
• E – Total energy per cycle [joule]
• B – Battery capacity [mAh]
• C – Cycle time [min]
• V – Voltage [volts]
• T – Device life span [days]
10.1.1 Example
Energy
• C – (Activity period) = 2 min
• Typical average current draw over a single activity period:
– E1 – 1700 uC @ 3.3 V = 5.6 mJ
– E2 – 2000 uC @ 3.3 V = 6.6 mJ
– E3 – 4000 uC @ 3.3 V = 13.2 mJ
– E4 – 5000 uC @ 3.3 V = 16.5 mJ
– E5 – 600 uC @ 3.3 V = 2 mJ
– ETotal – 44 mJ
– Average Current – 111 uA
Battery – 2AA alkaline battery rated at 1.5 V, each connected in series with capacity of 2000 mAh:
• B = 2000 mAh
• V = 3.0 V
T (device lifespan) = 3 x 2000 x 2 / 0.044 / 400 = 681 days
The total energy spent and the system life span is given by:
T = B × V / W1 + E2 / P2 (1 / 1000 × 24) days (3)
Where:
• B – Battery capacity [mAh]
• V – Voltage [volts]
• P2 – Period cycle for application traffic activity [sec]
• W1 – Power consumed during idle connection time [Watt].
• E2 - Energy spent during application traffic [Joule]
Energy spent during the initial phase of device initialization and connection establishment can be
neglected, since this is a one-time event.
10.2.1 Example
Energy
• P2 = 60 sec
• W1 = 233 uA x 3.0 V = 0.0007 W (assuming a long sleep interval of 1 sec)
• E2 = 25 mA x 200 msec x 3.0 V = 15 mJ (assuming part of the 200 ms is at RX current, very short time
at TX current, and part in LPDS current resulting in 25 mA average over the 200 ms)
Battery – 2AA alkaline battery rated at 1.5 V, each connected in series with a capacity of 2000 mAh:
• B = 2000 mAh
• V = 3.0 V
T (device lifespan) = 2000 x 3.0 / (0.0007 +0.015/60) / (1000 x 24) =~ 263 days
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated